# LEC-TWL / LEC-ALN / LEC-ASL

SMARC 2.1 Short Size Module with Intel® Atom 7th Gen series

![Close-up of a blue printed circuit board with various electronic components and gold connectors (no visible text or symbols)](.lec-twl-aln-asl-datasheet-260126/dcf64f322260107681e1a0fb53e544c9d3338387205d030570c28a8bd2977ae8.jpg)

# Features

• 2/4/8-core Intel® Atom series
• SMARC revision 2.1.1 compliant
• Up to 16GB LPDDR5
• Dual-channel LVDS (18/24-bit, optional)
• 4K DP++, DP++/HDMI

• 1x SATA Gen3 / onboard eMMC up to 256GB
• 2x CAN bus
• 2x 2.5GbE ports (TSN capable on Embedded-ER SKUs)
• USB3/USB2 interfaces
• 10 year product availability

Specifications

<table><tr><td rowspan="4">Processor &amp; System</td><td>CPU</td><td>Commercial: Intel core N250 processor, 4 cores, 6W TDP; Intel core i3-N305 processor, 8 cores, 15W TDP; Intel N97 processor, 4 cores, 1.5GHz, 12W TDP; Intel N50 processor, 2 cores, 1.2GHz, 6W TDPIndustrial/Embedded: Intel x7835RE Processor, 8 cores, 1.3GHz, 12W TDP; x7433RE, 4 cores, 1.5GHz, 9W TDP; x7211RE, 2 cores, 1.0GHz, 6W TDPNote: All other Alder Lake-N/Amston Lake platform CPUs also available</td></tr><tr><td>Memory</td><td>4/8/16 GB LPDDR5</td></tr><tr><td>Cache</td><td>6MB</td></tr><tr><td>Security</td><td>Intel® Boot GuardIntel® OS GuardIntel® VT-x with Extended Page Tables (EPT)Intel® AES-New Instruction, Intel® SHA ExtensionsIntel® Virtualization Technology (Intel® VT-x)Intel® Virtualization Technology for Directed I/O (VT-d)Optional TPM 2.0 module</td></tr><tr><td rowspan="3">Video</td><td>GPU Core</td><td>Intel® UHD Graphics</td></tr><tr><td>GPU Feature Support</td><td>12th Gen Intel® graphics core architecture with up to 32 EUs (selected SKUs)Supports 3x independent display 2D and 3D graphics hardware accelerationSupports DirectX 12, OpenGL 4.2, OpenCL 1.2, Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9, Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MV</td></tr><tr><td>LVDS</td><td>Dual Channel LVDS 18/24 bit</td></tr><tr><td rowspan="2">System Storage</td><td>eMMC</td><td>32/64/128/256GB (build option), compatible with EMMC 4.41, 4.51, 5.0, 5.1</td></tr><tr><td>SATA</td><td>1x SATA Gen3</td></tr></table>

Specifications

<table><tr><td>SEMA® Board Controller</td><td colspan="2">Supports: Voltage/Current monitoring, Power Sequencing, Logistics, Forensic Information, Flat Panel Control, I2C Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer, Fan Control</td></tr><tr><td>Debug Header</td><td colspan="2">30-pin multipurpose flat cable connector for use with optional DB-30 debug moduleProvides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration</td></tr><tr><td>Audio</td><td>Audio Codec</td><td>HDA audio codec (on carrier)</td></tr><tr><td rowspan="2">Dual Ethernet</td><td>Primary LAN</td><td>10/100/1000Mbit / 2.5Gbit Ethernet (TSN capable on Embedded-ER SKUs)</td></tr><tr><td>Secondary LAN</td><td>10/100/1000Mbit / 2.5Gbit Ethernet (TSN capable on Embedded-ER SKUs)</td></tr><tr><td rowspan="8">Extension Busses</td><td>USB</td><td>2x USB 3.2, 4x USB 2.0</td></tr><tr><td>UART</td><td>4x UART interfaces SER0/SER2 (TX/RX/RTS/CTS) and SER1/SER3 (TX/RX)</td></tr><tr><td>CAN</td><td>2x CAN2.0A or CAN2.0B, data bit rate up to 1 Mbps</td></tr><tr><td>SPI</td><td>2x SPI</td></tr><tr><td>I2C</td><td>4x I2C interfaces•Support for 7-bit and 10-bit address mode•Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 Kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus</td></tr><tr><td>GPIO</td><td>14x GPIO with interrupt, one GPIO with PWM</td></tr><tr><td>PCIe</td><td>4x PCIe x1 Gen3</td></tr><tr><td>MIPI</td><td>CSI0 2 lanes, CSI1 4 lanes</td></tr><tr><td>Power</td><td>Input</td><td>5Vdc +/- 5%</td></tr><tr><td rowspan="6" colspan="2">Mechanical and Environmental Form Factor</td><td>SGET SMARC Specifications 2.1</td></tr><tr><td>Dimension SMARC short size module 82 mm x 50 mm</td></tr><tr><td>Operating Temperature Standard: 0°C to 60°C Rugged: -40°C to 85°C (Embedded SKUs only)</td></tr><tr><td>Humidity 5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td rowspan="2">Operating Systems</td><td>Standard Support</td><td>Yocto Linux BSP, Microsoft Windows</td></tr><tr><td>Extended Support (BSP)</td><td>Vxworks</td></tr></table>

Ordering Information

<table><tr><td>Part name</td><td>Description/Configuration</td></tr><tr><td>LEC-TWL-N250-8G-64G-CT</td><td>SMARC 2.1 COM with Intel Twin Lake N250 4-core CPU, 8GB LPDDR5, 64GB eMMC , 0°C to 60°C</td></tr><tr><td>LEC-ALN-i3N305-8G-64G-CT</td><td>SMARC 2.1 COM with Intel Alder Lake I3N305 8-Core CPU, 8GB LPDDR5, 64GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-ALN-N97-8G-64G-CT</td><td>SMARC 2.1 COM with Intel Alder Lake N97 4-Core CPU, 8GB LPDDR5, 64GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-ALN-N50-4G-32G-CT</td><td>SMARC 2.1 COM with Intel Alder Lake N50 2-Core CPU, 4GB LPDDR5, 32GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-ASL-x7835RE-8G-64G-ER</td><td>SMARC 2.1 COM with Intel Amston Lake x7835RE 8-Core CPU, 8GB LPDDR5, 64GB eMMC, -40°C to 85°C</td></tr><tr><td>LEC-ASL-x7433RE-8G-64G-ER</td><td>SMARC 2.1 COM with Intel Amston Lake x7433RE 4-Core CPU, 8GB LPDDR5, 64GB eMMC, -40°C to 85°C</td></tr><tr><td>LEC-ASL-x7211RE-4G-32G-ER</td><td>SMARC 2.1 COM with Intel Amston Lake x7211RE 2-Core CPU, 4GB LPDDR5, 32GB eMMC, -40°C to 85°C</td></tr></table>

Note: Non-listed configurations for Alder Lake, Amston Lake, and Twin Lake are available. Please contact your commercial Windows representative for more information.

![**Central Block:**\n*   **Intel®**\n*   **Alder Lake / Amston Lake SoC**\n\n**Left Block:**\n*   **314-pin Golden finger**\n\n**Right Blocks:**\n*   **LPDDR5 Memory down 4/8/16GB**\n*   **eMMC**\n*   **TPM**\n*   **Debug**\n*   **EC/BMC**\n*   **SPI-BIOS**\n\n**Intermediate Blocks (Orange):**\n*   **LVDS**\n*   **I226** (appears twice)\n*   **F81604**\n\n**Connections:**\n*   **HDMI/DDI2**\n*   **LVDS/DSI/eDP** connects to the **LVDS** block, which connects via **DDI0**. A dotted orange line labeled **DSI** connects **LVDS/DSI/eDP** directly to the **LVDS** block.\n*   **(DP++/HDMI) DDI1**\n*   **PCIe x1 Gen3 ports 0,1,2,3**. A dotted orange line labeled **1x SATA Gen3** branches off this connection.\n*   **GbE_0** connects to an **I226** block, which connects via **PCIe**.\n*   **GbE_1** connects to an **I226** block, which connects via **PCIe**.\n*   **14X GPIO**\n*   **4x I2C**\n*   **1x HDA / 1x I2S**\n*   **2x UART**\n*   **CAN 0, 1** connects to an **F81604** block, which connects via **USB**.\n*   **6x USB2.0 host**\n*   **2x USB3.2 host**\n*   **CSI0, CSI1**\n*   **Power Management**\n*   **GSPI / eSPI**\n*   **2x UART**\n*   **Boot Select**\n*   **LPDDR5 Memory down 4/8/16GB**\n*   **eMMC 5.0 (8bit)** connects to the **eMMC** block.\n*   **SPI** connects to the **TPM** block.\n*   **Debug**\n*   Connections to **EC/BMC** and **SPI-BIOS** (indicated by bidirectional arrows at the bottom right).](.lec-twl-aln-asl-datasheet-260126/2e9c87d92f4a4de6d948e8783e14a009010d4f18d3e6bcf2fca32cd19ac56a5d.jpg)

All products and company names listed are trademarks or trade names of their respective companies. Updated Jan. 26, 2026. ©2026 ADLINK Technology, Inc. All Rights Reserved. All pricing and specifications are subject to change without further notice.
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