# nanoX-ASL

COM Express Mini Size Type 10 Module based on Intel® Amston Lake platform

# Features

• Delivers efficient performance with up to 8 cores, turboing up to 3.8 GHz
• Intel® UHD Graphics supports up to three independent 4K @ 60 Hz displays
• Supports up to 32 GB of on-board LPDDR5-4800 memory with in-band ECC

![The image features a large, blue, tilted oval shape centered in the frame. Inside the oval, the word '**Preliminary**' is written in white, sans-serif capital letters. Partially visible beneath the oval on the right side is a sliver of another graphic, showing a yellow circle and lines of small white text on a dark background.](.nanox-asl-prelim-datasheet-20260312-1/0a6e9f3d96471be32c49bb0712aa27d9562b9861aa73ae76d693dc208dbf374b.jpg)

![Close-up of a green circuit board with a central processor and multiple microcontroller chips (no visible text or symbols)](.nanox-asl-prelim-datasheet-20260312-1/f26cc73840ad233c199e0656e80309a9f5030a9f49adcd93c515bf8996fab76b.jpg)

• 2.5GbE with Intel® TSN/TCC enables deterministic, real-time control
• Offers flexible I/O with four PCIe Gen 3 lanes and USB 3.2/2.0 for easy expansion
Extended temperature options ensure reliable operation in harsh environments; SDIO support optional via BOM

Specifications

<table><tr><td rowspan="11">Core System</td><td rowspan="6">SoC</td><td colspan="6">Intel® CoreTM Atom® x7000 Series Processors</td></tr><tr><td>CPU SKU</td><td>Core</td><td>Cache</td><td>Base Frequency</td><td>TDP</td><td>Graphics</td></tr><tr><td>x7835RE</td><td>8</td><td>6MB</td><td>1.3GHz</td><td>12W</td><td>UHD 32EUs</td></tr><tr><td>x7433RE</td><td>4</td><td>6MB</td><td>1.5GHz</td><td>9W</td><td>UHD 32EUs</td></tr><tr><td>x7213RE</td><td>2</td><td>6MB</td><td>2GHz</td><td>9W</td><td>UHD 16EUs</td></tr><tr><td>x7211RE</td><td>2</td><td>6MB</td><td>1GHz</td><td>6W</td><td>UHD 16EUs</td></tr><tr><td>Memory (Soldered Down)</td><td colspan="6">Up to 32GB (2x 16GB) LPDDR5 at max. 4800MT/s, IBECC (build option)</td></tr><tr><td>Embedded BIOS</td><td colspan="6">AMI Aptio V</td></tr><tr><td>Expansion</td><td colspan="6">Up to 4 PCIe1 Gen3 lanesPCIe Gen3 x4 (lane 0-3): configurable as x2, x1</td></tr><tr><td>Buses SEMA Board Controller</td><td colspan="6">ManageabilityVoltage/current monitoringPower-sequence debug supportAT/ATX mode controlLogistics &amp; forensic information (event/history)General-purpose interfaces:  $I^{2}C$ , UART, GPIOWatchdog timer and fan control</td></tr><tr><td>Debug Headers</td><td colspan="6">30-pin FFC/FPC connector, compatible with the DB30-x86 debug module(For BIOS POST code LEDs, EC access, SPI BIOS flashing, power test points, and debug LEDs)</td></tr></table>

Specifications

<table><tr><td rowspan="3">Video</td><td>GPU Feature Support</td><td>Support up to 3 independent displays resolution up to 4K60: DP / HDMI / eDP• Intel® Gen 12 UHD graphics, up to 32EU• Standards: DirectX® 12, OpenGL® 4.6, Vulkan® 1.2• Graphics hardware virtualization: SR-IOV 1</td></tr><tr><td>Digital Display Interface</td><td>DDI port (DDI 0), support DP1.4/HDMI2.0b</td></tr><tr><td>LVDS/eDP</td><td>Default LVDS (Option eDP)LVDS: Single channel 18/24-bit, resolution up to (1366 × 768 @60Hz)eDP: 1.4b HBR3, resolution up to (TBC).</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Codec</td><td>On the carrier miniBASE-10R</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (TSN by build option)</td></tr><tr><td>Speed</td><td>2.5Gbps/1000M/100M/10M Ethernet connection</td></tr><tr><td rowspan="2">Multi I/O and Storage</td><td>USB</td><td>2 x USB 3.28 x USB 2.0 (USB 2 port 7 colay with SDIO, by project support)2 x SATAIII(600 MB/s)</td></tr><tr><td>eMMC</td><td>eMMC 5.1, 32GB to 128GB (Optional)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on the carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="4">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support (TBC)</td></tr><tr><td>Power States</td><td>C1-C6, S0, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 10</td></tr><tr><td>Dimension</td><td>Mini size: 84 mm x 55 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°CExtreme Rugged: -40°C to 85°C (Selected SKIs)</td></tr><tr><td>Humidity</td><td>Operating: 5-90% RH, non-condensingStorage: 5-95% RH, non-condensing</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,Table 214-I, Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 11 IoT Enterprise LTSCUbuntu 24.04 LTS</td></tr></table>

![Based on the provided flowchart, here is the accurate description of the labeled blocks and their connections:\n\n**Main Components:**\n*   **Top Header:** A light blue bar labeled 'PICMG COM R3.1 Compliant'.\n*   **Central Processor:** A large reddish/pink block labeled '7th Generation Intel Atom® x7000 series Processor (Amston Lake)'.\n*   **Memory:** Two light blue blocks at the top right labeled 'LPDDR5 4800 MHz max 2~16GB'.\n*   **Left Column:** A grey column containing interface labels (DDIO, eDP/LVDS, USB, SATA, PCIe, etc.).\n*   **Bottom Controller:** A light blue block labeled 'Embedded Controller'.\n\n**Detailed Connections and Labels:**\n\n**To the Processor (Left Side Inputs):**\n*   **DDIO:** Connects from the left column to the processor.\n*   **eDP/LVDS:** Connects from the left column to the processor.\n    *   An intermediate box labeled 'eDP to LVDS' sits on the line.\n    *   Dashed text below reads 'eDP 4 Lanes. Build option'.\n*   **USB 3.0 (0:1):** Connects to 'USB 3.2(0:1)'.\n*   **USB 2.0 (0:6):** Connects to 'USB2.0(0:6)'.\n*   **USB 2.0 (7):** Connects to 'USB2.0(7)'.\n*   **SATA (0:1):** Connects to 'SATA(0:1)'.\n*   **Max 2.5GbE:** Connects to 'LAN' via a small blue block labeled 'I226 V/IT'.\n*   **PCIe (0:1):** Connects to 'HSIO(2:3)' via a small block labeled 'X2, x1 config'.\n*   **PCIe (2:3):** Connects to 'HSIO(8:9)' via a small block labeled 'X2, x1 config'.\n*   **HDA:** Connects to 'HDA'.\n*   **SPI:** Connects to 'SPI'.\n    *   **TPM2.0:** A small blue block connects via a dashed line to the SPI line.\n    *   **BIOS:** A small blue block connects via a dashed line to the SPI line.\n    *   Below BIOS is text 'Build option'.\n    *   There is a dashed box labeled 'USB to SDIO' connecting to SDIO.\n*   **GPI:** Connects to 'GPI'.\n*   **SMBus:** Connects to 'SMBus'.\n*   **GPIO/SDIO:** Connects to 'GPIO' (dashed line) and 'SDIO' (dashed line).\n*   **I2C:** Connects to 'I2C'.\n*   **UART(0:1):** Connects to 'UART'.\n\n**To the Processor (Top Inputs):**\n*   Two lines connect from the 'LPDDR5 4800 MHz max 2~16GB' blocks to the top of the processor.\n\n**Bottom Connections:**\n*   **eSPI:** A line connects from the processor to the 'Embedded Controller'.\n*   **LPC/eSPI:** Connects from the left column to the 'Embedded Controller'.\n    *   An intermediate box labeled 'eSPI to LPC' sits on the line.\n    *   Dashed text below reads 'eSPI'.\n*   **eMMC:** A dashed box labeled 'eMMC 5.1 32~128GB' connects to a line labeled 'eMMC'. Below it is text 'Build option'.](.nanox-asl-prelim-datasheet-20260312-1/1503c40d27e4f43cc0bd46b534ad54846add9cd6913c0235950e2895bc593dea.jpg)

# Ordering Information

Module

Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative.

# Accessories

Heat Spreaders

<table><tr><td>HTS-nASL-B</td><td>Heatspreader for nanoX-ASL with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-nASL-B</td><td>Low profile heatsink for nanoX-ASL with threaded standoffs for bottom mounting</td></tr><tr><td>THSH-nASL-B</td><td>High profile heatsink for nanoX-ASL with threaded standoffs for bottom mounting</td></tr></table>
[🔗 Link to the original document](.nanox-asl-prelim-datasheet-20260312-1/nanox-asl-prelim-datasheet-20260312-1.pdf)