# nanoX-EL # COM Express Mini Size Type 10 Module with 6th Generation Intel Atom® x6000E Processor SoC # Features ● Quad-core Intel Atom® Processor SoC, Burst Frequency up to 3.0GHz ● Intel® Gen11 LP GFX for AI inference based on OpenVINO ● In-band ECC, up to 16GB LPDDR4 at up to 4267 MT/s TCC and 2.5GbE with TSN ● Real-time I/O via ARM Cortex-M7 processor ● USB 3.2 10Gbps ![Close-up of an Intel Confidential processor on a green circuit board (no readable text or symbols beyond product labels)](.nanox-el-datasheet-20250122/e9a3405b9531b89ecd5585f4a7de667a0b2691307c2e23d54d8fc51f99913495.jpg) # Specifications # ● Core System # CPU 6th Gen Intel Atom® Processor (formerly “Elkhart Lake”) • Intel Atom® x6425E 2.0GHz (3.0GHz Burst) 12W (4C/32EU, IBECC/non-ECC) • Intel Atom® x6413E 1.5GHz (3.0GHz Burst) 9W (4C/16EU, IBECC/non-ECC) • Intel Atom® x6211E 1.3GHz (3.0GHz Burst) 6W (2C/16EU, IBECC/non-ECC) • Intel Atom® x6200FE 1.0GHz 4.5W (2C/No GPU, IBECC/non-ECC) • Intel Atom® x6425RE 1.9GHz 12W (4C/32EU, IBECC/non-ECC) • Intel Atom® x6414RE 1.5GHz 9W (4C/16EU, IBECC/non-ECC) • Intel Atom® x6212RE 1.2GHz 6W (2C/16EU, IBECC/non-ECC) Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, Execute Disable Bit, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key Notes: Availability of features may vary between processor SKUs. Some of the SKUs listed above are supported by project basis only. Please contact your ADLINK representative for availability. # Memory LPDDR4 soldered memory up to 4267 MT/s, IBECC/non-ECC up to 16GB Memory configuration: 2/4/8/16GB (8/16GB by project basis) In-Band ECC (IBECC), provides ECC protection without additional ECC device (dependent on SoC SKU) # Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option) # Cache TBC # Expansion Busses • 4 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) • LPC bus, SMBus (system) , I2 C (user) # SEMA® Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) # Debug Headers 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs # Video # GPU Feature Support Intel® Gen11 LP Graphics Core Architecture, supporting multiple independent and simultaneous display combinations of DisplayPort/HDMI/ LVDS or eDP outputs (max. 4K @60Hz) • Hardware encode/transcode of HD content (including HEVC) • DirectX 12 and Vulkan v1.1 support • OpenGL 4.5 and ES 3.2 support • OpenCL 1.2 support # Digital Display Interface DDI0 supporting DisplayPort/HDMI/DVI # LVDS Single channel 18/24-bit LVDS via eDP-to-LVDS IC (max. resolution 1920x1200 @60Hz in dual mode) # eDP Optional 4 lane support, in place of LVDS (max. resolution 4096x2160 @60Hz) # ● Audio # Chipset Intel® HD Audio integrated in SoC # Audio Codec Located on carrier miniBASE-10R # ● Ethernet # Intel® MAC and external PHY MaxLinear GPY series PHY (GPY 211/215) TSN support on Linux # Interface 2.5Gbit/s and 1000/100/10 Mbit/s Ethernet connection GbE0\_SDP available if TSN support enabled # Specifications # ● I/O Interfaces USB: 2x USB 3.2/2.0/1.1 (USB 0,1,) and 6x USB 2.0/1.1 (USB 2,3,4,5,6,7) SATA: 2x SATA 6Gb/s (SATA 0,1) Serial: 2x UART ports with console redirection eMMC: eMMC 5.0 (16/32/64GB by build option), functions as boot-up device (TBC) GPIO/SD: 4x GPO and 4x GPI from EC (GPI with interrupt TBC) SD/GPIO muxed design, SD is build option by project basis, SD functions as storage device only Notes: USB 3.2 Gen2 support dependent on carrier design. 2x UART and 8x GPIO can be managed by ARM M7 processor or x86 processor. UART, GPIO managed by ARM M7 is for real-time usage. CAN FD (build option by project basis, shared with UART 1) is managed by ARM M7 processor for real-time usage (TBC). # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis) # ● TPM (build option) Chipset: Infineon Type: TPM 2.0 (SPI based, build option by project basis) # ● Power # Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% # Wide Input ATX: 4.75-20 V / 5Vsb ±5%; or AT: 4.75-20V # Management ACPI 5.0 compliant, Smart Battery support # Power States S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) # ECO mode Supports deep S5 mode for power saving # ● Mechanical and Environmental Form Factor: PICMG COM.0: Rev 3.0 Type 10 Dimension: Mini size: 84 mm x 55 mm # Operating Temperature Standard: 0°C to 60°C (storage: -20°C to 80°C) Extreme Rugged: -40°C to 85°C (optional, selected SKUs; storage: -40°C to 85°C) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operating Systems # Standard Support Windows 10 IOT Enterprise 64-bit, Windows 10 64-bit, Yocto Linux 64-bit, VxWorks 64-bit (TBC), Ubuntun (TBC) # Extended Support (BSP) Yocto project based Linux 64-bit # Functional Diagram ![**Central Block**\n* **6th Generation Intel Atom® x6000E (formerly Elkhart Lake)** (Reddish-brown background)\n\n**Top Blocks (Memory & Display)**\n* Four blocks labeled: **LPDDR4 8/16/32Gb**\n* One block labeled: **eDP to LVDS**\n* Text label: **build option, eDP 4 lanes**\n\n**Left Column Blocks (External Interfaces)**\n* **DDI 0**\n* **eDP/LVDS**\n* **USB 3.0 Lane 0-1**\n* **USB 2.0 Lane 0-7**\n* **SATA Port 0-1**\n* **Max. 2.5GbE**\n* **PCIe Lane 0-3**\n* **HDA**\n* **SPI**\n* **SMBus**\n* **I2C**\n* **GPIO/SDIO**\n* **UART 0-1/CAN**\n* **LPC/eSPI**\n\n**Intermediary Blocks (Left Side)**\n* **LAN PHY (GPY 215, 211)** (Blue box)\n* **x4, x2, x1 config.** (Blue box)\n* **TPM 2.0** (Dashed box) with text **build option** next to it.\n* **BIOS** (Blue box inside a dashed outline)\n* **eSPI to LPC** (Blue box)\n\n**Internal Labels (Inside Central Block, Right Side)**\n* **2 USB 3.2 Gen2**\n* **eDP**\n* **2 SATA Gen3**\n* **SGMII**\n* **4 PCIe Gen3**\n* **I2C**\n* **SDIO 3.0**\n* **UART**\n* **eSPI**\n\n**Bottom Blocks (Controller & Sensors)**\n* **Embedded Controller** (Large blue box)\n* **Thermal sensor (SOC)** (Blue box)\n* **Thermal sensor (board)** (Blue box)\n* **eMMC 5.1 16GB-64GB build option** (Dashed box)\n\n**Connections**\n* **DDI 0** connects to **eDP** (inside central block).\n* **eDP/LVDS** connects to **eDP to LVDS**, which connects to **eDP** (inside central block). A dashed line labeled **build option, eDP 4 lanes** connects **eDP/LVDS** to the central block.\n* **USB 3.0 Lane 0-1** and **USB 2.0 Lane 0-7** both connect to **2 USB 3.2 Gen2** (inside central block).\n* **SATA Port 0-1** connects to **2 SATA Gen3** (inside central block).\n* **Max. 2.5GbE** connects to **LAN PHY (GPY 215, 211)**, which connects to **SGMII** (inside central block).\n* **PCIe Lane 0-3** connects to **x4, x2, x1 config.**, which connects to **4 PCIe Gen3** (inside central block).\n* **HDA** connects to the central block area near the **TPM 2.0** build option.\n* **SPI** connects to **BIOS**.\n* **SMBus** connects to **I2C** (inside central block).\n* **I2C** (left column) connects via dashed lines to **SDIO 3.0** and **UART** (inside central block).\n* **GPIO/SDIO** connects to **Embedded Controller**.\n* **UART 0-1/CAN** connects to **Embedded Controller**.\n* **LPC/eSPI** connects to **eSPI to LPC**, which connects to **Embedded Controller**.\n* **eSPI** (inside central block) connects to **Embedded Controller**.\n* **Embedded Controller** connects to **Thermal sensor (SOC)** and **Thermal sensor (board)**.\n* A dashed line connects the central block to the **eMMC 5.1 16GB-64GB build option** block.](.nanox-el-datasheet-20250122/4f3189a9e51512712359de5ec170f4d4181b7ec01c7aa61917a164b49fe1cd70.jpg) # Ordering Information . nanoX-EL-x6425E-2G Mini COM Express Type 10 module with Intel Atom® x6425E, 2GB memory nanoX-EL-x6413E-2G Mini COM Express Type 10 module with Intel Atom® x6413E, 2GB memory nanoX-EL-x6211E-2G Mini COM Express Type 10 module with Intel Atom® x6211E, 2GB memory ● nanoX-EL-x6200FE-2G Mini COM Express Type 10 module with Intel Atom® X6200FE (no GPU), 2GB memory nanoX-EL-x6425E-4G Mini COM Express Type 10 module with Intel Atom® x6425E, 4GB memory ● t1nanoX-EL-x6425E-4G Mini COM Express Mini Type 10 module with Intel Atom® x6425E, 4GB memory-40 to +85 ● t1nanoX-EL-x6211E-8G Mini COM Express Type 10 module with Intel Elkhart Lake Atom x6211E, 8GB memory, -40 to +85 ● t1nanoX-EL-x6425RE-4G Mini COM Express Type 10 module with Intel Elkhart Lake Atom x6425RE, 4GB memory, -40 to +85 ● t2nanoX-EL-x6211E-8G Mini COM Express Type 10 module with Intel Elkhart Lake Atom x6211E, 8GB memory, -40 to +85, ETT ● t2nanoX-EL-x6425RE-16G Mini COM Express Type 10 module with Intel Elkhart Lake Atom x6425RE, 16GB memory, -40 to +85, ETT \*For processor SKUs not listed, please contact your ADLINK representative for availability. # Starter Kit ● Starter kit for COM Express Type 10 Includes miniBase-10R carrier board, power adaptor and neccessory accessory # Accessories # Heat Spreaders ● HTS-nXEL-B-I Heatspreader for nanoX-EL Atom with threaded standoffs for bottom mounting ● HTS-nXEL-BT-I Heatspreader for nanoX-EL Atom with through hole standoffs for top mounting # Passive Heatsinks ● THS-nXEL-B-I Low profile heatsink for nanoX-EL Atom with threaded standoffs for bottom mounting ● THS-nXEL-BT-I Low profile heatsink for nanoX-EL Atom with through hole standoffs for top mounting ● THSH-nXEL-B-I High profile heatsink for nanoX-EL Atom with threaded standoffs for bottom mounting [🔗 Link to the original document](.nanox-el-datasheet-20250122/nanox-el-datasheet-20250122.pdf)