| Processor & System | CPU | NXP®i.MX93 series with 2-core Arm Cortex-A55 & M33TrustZone Technology with Armv8 CryptographyArm®EthosTM U-65 microNPU |
| Memory | 0.5 up to 2GB LPDDR4-solder down |
| L2 Cache | 32kB L1-I, 32kB L1-D, and 64kB L2 cache per core |
| Security | • TRDC – Resource Domain Controller- Supports up to 16 resource domains• Arm TrustZone® (TZ) architecture• Secure and trusted access control• Battery Backed Security Module (BBSM)- Monotonic counter - Secure real-time clock (RTC) - Zeroizable Mast |
| Video | GPU Core | PXP 2D accelerator |
| MIPI DSI | 1x MIPI DSI 4 lanes (up to 1920x1200p60) |
| LVDS | up to 1366x768p60 or 1280x800p60 |
| Camera | 1x 2-lane MIPI CSI-2 Interface:• Compliant with CSI-2 v1.3 and D-PHY v1.2• Supports up to 2 Rx data lanes + 1 clock lane• 80 Mbps–1.5 Gbps per lane in high-speed mode• 10 Mbps data rate in low-power mode |
| System Storage | SDIO | 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 |
| eMMC | 32, 64, or 128 GB (build option)Compatible with eMMC spec 4.41, 4.51, 5.0, 5.1 |
Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
| Debug Header | JTAG interface |
| Audio | Audio Codec | $I^{2}S$ audio codec located on carrier |
| Dual Ethernet | Primary LAN | 10/100/1000 Ethernet controller on SoC (TSN capable) |
| Secondary LAN | 10/100/1000 Ethernet controller on SoC |
| Extension Buses | USB | 3x USB 2.0, 1x USB 2.0 OTG (Optional USB hub available) |
| UART | 4x UART interfaces (UART A/B has TX/RX/CTS/RTS; C has TX/RX; plus 1 console) |
| CAN | 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps |
| SPI | 2x SPI |
| $I^{2}S$ | 1x $I^{2}S$ interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192kHz (see Audio Codec support) |
| $I^{2}C$ | 2x $I^{2}C$ interfaces-Support for 7-bit and 10-bit address mode-Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 Kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus |
| GPIO | 14x GPIO with interrupt |
| Power | Input | 5V DC +/- 5% |
| Mechanical and Environmental Form Factor | SGET OSM Specifications 1.1 |
| Dimension OSM Size-L (Large) module 45 mm x 45 mm |
| Operating Temperature Standard: 0°C to 60°C Rugged: -40°C to 85°C |
| Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Operating Systems | Standard Support | Yocto Linux BSP |
| Extended Support (BSP) | Foundries.IO |
Ordering Information
| Part Name | Description/Configuration |
| OSM-iMX93-2G-32G-CT | OSM Size-L module with NXP i.MX 93 SoC, microNPU, 2GB LPDDR4, 32GB eMMC, $0^{\circ}C$ to $60^{\circ}C$ |
| OSM-iMX93-2G-32G-ER | OSM Size-L module with NXP i.MX 93 SoC, microNPU, 2GB LPDDR4, 32GB eMMC, $-40^{\circ}C$ to $85^{\circ}C$ |
| OSM-iMX93-2G-32G-BW-CT | OSM Size-L module with NXP i.MX 93 SoC, microNPU, 2GB LPDDR4, 32GB eMMC, AC Wi-Fi BT 5.1, $0^{\circ}C$ to $60^{\circ}C$ |
| Note: For processor or memory SKUs not listed, please contact our ADLINK representative. |
Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.osm-imx93-datasheet-251106/osm-imx93-datasheet-251106.pdf)