# OSM-MTK510 OSM Size-L Module with MediaTek Genio 510 Series ![MEDIATEK\n2362-Z4HHAH\nBT1KMV12-A\nMB70AV\n5501\nMEDIATEK\nMEDI500\n2362-Z4HHAH\nMT8370AV\neMMC\nPT64AUSP-320E\n00402050](.osm-mtk510-datasheet-20260212/0476d926946888aa356e0c01e5d26ef3d5609cde6e275491a55c2b5ea0ac432e.jpg) # Features • MediaTek Genio 510 with dual core Arm Cortex-A78 and quad-core Cortex-A55 • MediaTek 5th Gen NPU, up to 3.2 TOPS • OSM revision 1.1 compliant • HDMI/DP, eDP, DSI graphic output interfaces • Rugged operating temperature option : -40°C to +85°C (standard SKU, consumer temperature) • 10 year product availability • USB 3.0 / 2.0 interfaces Gigabit RGMii Ethernet . eMMC ADC: 2-channel, 12-bit Specifications
Core SystemSoCGenio 510 with dual-core Cortex-A78 and quad-core Cortex-A55EthosTM U-VP6 AI processing unit
Memory2/4/8 GB LPDDR4L
L2 Cache256KB L2 cache per core
Security•Arm® TrustZone®•Security Boot (RSA4096)•Crypto Engine•True random number generation RNG
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Specifications
VideoGPU CoreArm Mali-G57 MC2 GPU
HDMIHDMI 2.0b
MIPI DSI1x MIPI DSI 4 lanes
eDPSingle-channel, eDP V1.4, 2 lanes
Camera• Compatible with the MIPI D-PHY specification v2.1• Up to 4 data lanes, with a maximum data rate of 2.5 Gbps per lane• Supports MIPI-HS, MIPI-LP modes
System StorageSDIO2x SDIO (4-bit), compatible with SD/SDIO standard, up to version 3.0
eMMC32,64,128, or 256 GB (build option)Compatible with eMMC specifications 4.41, 4.51, 5.0, and 5.1
AudioAudio Codec $I^{2}S$ audio codec (located on the carrier)
EthernetPrimary LANMAC 10/100/1000 RGMii interface
Extension BussesUSB1x USB 3.0, 2x USB 2.0
UART4x UART interfaces (A: TX/RX/CTS/RTS; C & D: TX/RX; 1× console: TX/RX)
SPI3x SPI interfaces
$I^{2}S$ 1x $I^{2}S$ interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192kHz (see Audio Codec support)
$I^{2}C$ 6x $I^{2}C$ interfaces
GPIO19x GPIOs with interrupts
PowerInput5Vdc +/-5%
Mechanical and EnvironmentalForm FactorSGeT OSM revision 1.1
DimensionsOSM Size-L 45x45 mm
Operating TemperatureStandard: 0°C to +60°CRugged: -40°C to +85°C (optional)
Humidity5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)
Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I,Condition D
HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test
Operating SystemsStandard SupportYocto Linux BSP, Android (by project), Ubuntu (by project)
Extended SupportFoundries.IO Linux microPlatform (LMP)
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Ordering Information
Part nameDescription/Configuration
OSM-MTK510-2G-32G-CTOSM Size-L module with Genio 510 SOC , NPU , 2 GB LPDDR4, 32 GB eMMC, 0°C to 70°C
OSM-MTK510-4G-32G-EROSM Size-L module with Genio 510 SOC , NPU , 4 GB LPDDR4, 32 GB eMMC, -40°C to 85°
Note: Non-listed configurations are available upon request.
Block diagram ![The diagram features a central red block labeled **OSM**, which contains the following internal components: **LPDDR4**, **I510**, **eMMC 32/65/128/256 GB**, and **DP on a Reserved Pin**.\n\nThe diagram illustrates connections between external interface blocks (left and right columns) and internal interface blocks (columns inside the OSM block):\n\n**Left-Side Connections (External to OSM):**\n* **HDMI** connects to **eDP_A**\n* **eDP** connects to **eDP_B**\n* A red **X** marks the connection to **LVDS**\n* A red **X** marks the connection to **RGB**\n* **DSI** connects to **DSI**\n* **CSI** connects to **CSI**\n* **RGMii** connects to **ETH_A**\n* Red **X** marks connect to **ETH_B**, **ETH_C**, **ETH_D**, and **ETH_E**\n* **USB_A** connects to **USB_A**\n* **USB_B** connects to **USB_B**\n* **USB_C** connects to **USB_C**\n* A red **X** marks the connection to **USB_D**\n* **PCIE_A** connects to **PCIe_A**\n* Red **X** marks connect to **PCIe_B**, **PCIe_C**, **PCIe_D**, and **UFS**\n* **PWM** connects to **PWM**\n* **ADC x2** connects to **ADC**\n\n**Right-Side Connections (OSM to External):**\n* **Console** connects to **OSM-DEBUG 2W**\n* **UART_A** connects to **UART_A 4W**\n* **UART_B** has a connection terminated by a red **X**\n* **UART_C** connects to **UART_C 2W**\n* **UART_D** connects to **UART_D 2W**\n* **SPI_A** connects to **SPI_A**\n* **SPI_B** connects to **SPI_B**\n* **SPI_C** connects to **SPI_C**\n* **I2C_A** connects to **I2C_A**\n* **I2C_B** connects to **I2C_B**\n* **I2S_A** connects to **I2S_A**\n* **SDIO_A** connects to **SDIO_A**\n* **SDIO_B** connects to **SDIO_B**\n* **CAN_A** and **CAN_B** have connections terminated by red **X** marks\n* **GPIO_A** connects to **GPIO_A 6x**\n* **GPIO_B** connects to **GPIO_B 8x**\n* **GPIO_C** connects to **GPIO_C 4x**\n* **GPIO_D** connects to **GPIO_D 1x**\n* **GPIO_E** has a connection terminated by a red **X**](.osm-mtk510-datasheet-20260212/aa4ac2f3b86e0bd4076249fac5648e0ed7c3af598ead25c47b81fdfb93130971.jpg) Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. [🔗 Link to the original document](.osm-mtk510-datasheet-20260212/osm-mtk510-datasheet-20260212.pdf)