# OSM-MTK520

OSM Size-L Module with MediaTek Genio 520 Series

![Preliminary\nM-103-2017-0\nE164871\nJU R02\n51-76104.0A10\nM-103-2017-0\nE164871\nJU R02\n51-76104.0A10\nM-103-2017-0\nE164871\nJU R02\n51-76104.0A10\nM-103-2017-0\nE163911V\nZ511-22444H\nE510-805-A\nE510-805-A\nM-103-2017-0\nE163911V\nZ511-22444H\nE510-805-A\nE510-805-A\nM-103-2017-0\nE163911V\nZ511-22444H\nE510-805-A\nM-103-2017-0\nE163911V\nZ511-22444H\nE510-805-A\nM-103-2017-0\nE163911V\nZ511-22444H\nE510-805-A\nN 330](.osm-mtk520-datasheet-20260327/d6e84ba168b60de7265bc7274677ea5ef318424d8510e21c2730e9d42ed4b645.jpg)

# Features

• MediaTek Genio 520 with dual-core Arm Cortex-A78 and hexa-core Cortex-A55
• MediaTek 8th Gen NPU, up to 10 TOPS (system)
• OSM revision 1.2 compliant
• DP, eDP, DSI, LVDS graphic output interfaces
• Rugged operating temperature option : -40°C to 85°C (standard SKU, consumer temperature)

• 10 year product availability
• USB 3.0 / 2.0 interfaces
Gigabit RGMii Ethernet
• UFS 3.1

Specifications

<table><tr><td rowspan="4">Core System</td><td>SoC</td><td>Genio 520 with dual-core Cortex-A78 and hexa-core Cortex-A55 MediaTek 8th Gen NPU</td></tr><tr><td>Memory</td><td>2/4/8/16 GB LPDDR5</td></tr><tr><td>L2 Cache</td><td>256KB L2 cache per core</td></tr><tr><td>Security</td><td>•Arm® TrustZone®•Security Boot (RSA4096)•Crypto Engine•True random number generation RNG</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="6">Video</td><td>GPU Core</td><td>Arm Mali-G57 MC2</td></tr><tr><td>DP</td><td>1x DP V1.4, 4 lanes</td></tr><tr><td>eDP</td><td>1x eDP V1.4, 4 lanes</td></tr><tr><td>MIPI DSI</td><td>1x MIPI DSI, 4 lanes (share-pin with LVDS)</td></tr><tr><td>LVDS</td><td>1x LVDS, Single-channel (share-pin with MIPI DSI)</td></tr><tr><td>Camera</td><td>2x CSI, 4 lanesCompatible with the MIPI D-PHY specification v2.1 Up to 4 data lanes, with a maximum data rate of 2.5 Gbps per lane</td></tr><tr><td rowspan="2">System Storage</td><td>SDIO</td><td>2x SDIO (4-bit), compatible with SD/SDIO standard, up to version 3.0</td></tr><tr><td>UFS</td><td>64, 128, 256, or 512 GB (build option) Based on JEDEC Standard Universal Flash Storage version 3.1</td></tr><tr><td>Audio</td><td>Audio Codec</td><td>I2S audio codec (located on the carrier)</td></tr><tr><td>Ethernet</td><td>Primary LAN</td><td>MAC 10/100/1000 RGMii interface with TSN</td></tr><tr><td rowspan="6">Extension Busses</td><td>USB</td><td>1x USB 3.1, 2x USB 2.0, 1x USB 2.0 OTG</td></tr><tr><td>UART</td><td>4x UART interfaces (A: TX/RX/CTS/RTS; C &amp; D: TX/RX; 1x console: TX/RX)</td></tr><tr><td>SPI</td><td>3x SPI interfaces</td></tr><tr><td>I2S</td><td>2x I2S interfaces</td></tr><tr><td>I2C</td><td>2x I2C interfaces</td></tr><tr><td>GPIO</td><td>22x GPIOs with interrupts</td></tr><tr><td>Power</td><td>Input</td><td>5V DC +/-5%</td></tr><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>SGeT OSM revision 1.2</td></tr><tr><td>Dimensions</td><td>OSM Size-L 45x45 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C Rugged: -40°C to 85°C (optional)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Yocto Linux BSP, Android (by project), Ubuntu (by project)</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Ordering Information

<table><tr><td>Part name</td><td>Description/Configuration</td></tr><tr><td>OSM-MTK520-4G-64G-CT</td><td>OSM module L size with 8 Core Genio 520, NPU, 4 GB LPDDR5, 64 GB UFS, 0°C to 60°C</td></tr><tr><td>OSM-MTK520-4G-64G-ER</td><td>OSM module L size with 8 Core Genio 520, NPU, 4 GB LPDDR5, 64 GB UFS, -40°C to 85°C</td></tr></table>

Note: Non-listed configurations are available upon request.

Block diagram
![**Central Blocks:**\n*   OSM\n*   Genio 520\n*   LPDDR5 2/4/8/16 GB\n*   64 - 512 GB\n*   SPI_NOR\n*   Audio Lineout on a Vendor Define Pin\n\n**Left Connections (External to Internal):**\n*   eDP connects to eDP_A\n*   DP connects to eDP_B\n*   LVDS 4L connects to LVDS\n*   RGB (Unconnected)\n*   DSI 4L connects to DSI\n*   CSI_A connects to CSI_A\n*   CSI_B connects to CSI_B\n*   RGMii connects to ETH_A\n*   ETH_B (Unconnected)\n*   ETH_C (Unconnected)\n*   ETH_D (Unconnected)\n*   ETH_E (Unconnected)\n*   USB_A connects to USB_A\n*   USB_B connects to USB_B\n*   USB_C connects to USB_C\n*   USB_D connects to USB_D\n*   PCIE_A connects to PCle_A\n*   PCle_B (Unconnected)\n*   PCle_C (Unconnected)\n*   PCle_D (Unconnected)\n*   UFS (Unconnected)\n*   PWM connects to PWM\n*   ADC x2 connects to ADC\n\n**Right Connections (Internal to External):**\n*   Console connects to OSM-DEBUG\n*   UART_A connects to UART_A 4W\n*   UART_B (Unconnected)\n*   UART_C connects to UART_C 2W\n*   UART_D connects to UART_D 2W\n*   SPI_A connects to SPI_A\n*   SPI_B connects to SPI_B\n*   SPI_C connects to SPI_C\n*   I2C_A connects to I2C_A\n*   I2C_B connects to I2C_B\n*   I2S_A connects to I2S_A\n*   I2S_B connects to I2S_B\n*   SDIO_A connects to SDIO_A\n*   SDIO_B connects to SDIO_B\n*   CAN_A (Unconnected)\n*   CAN_B (Unconnected)\n*   GPIO_A connects to GPIO_A 4x\n*   GPIO_B connects to GPIO_B 8x\n*   GPIO_C connects to GPIO_C 2x\n*   GPIO_D connects to GPIO_D 4x\n*   GPIO_E (Unconnected)](.osm-mtk520-datasheet-20260327/5171650c3cde2f7bcf6a8cf1193797066c1955a62575a10fd28f5c65956597c6.jpg)

Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.osm-mtk520-datasheet-20260327/osm-mtk520-datasheet-20260327.pdf)