# Express-CFR

COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon® , Core™, Pentium® and Celeron® Processors

# Features

● PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel® processors
● Up to 96GB\* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (\*under validation)
● Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option)
● One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support)
● GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
● Supports Smart Embedded Management Agent (SEMA) functions
● Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs)

![Close-up of a green printed circuit board with visible components and connectors (no readable text or symbols)](.Express-CFR-Datasheet-20200703-(alex-update,-make-ECC-support-more-clear.../5da028c5942898f590da3eabe67d36bc91ad6961f18f3f7fc0b1dd49eb741338.jpg)

# Specifications

# ● Core System

# CPU

Mobile 9th Generation Intel® Xeon®, Core™, Pentium® and Celeron® Processors - 14nm process

• Xeon® E-2276ME 45W (35W cTDP), 6C/GT2 (ECC/non-ECC)
• Xeon® E-2276ML 25W, 6C/GT2 (ECC/non-ECC)
• Xeon® E-2254ME 45W (35W cTDP), 4C/GT2 (ECC/non-ECC)
• Xeon® E-2254ML 25W, 4C/GT2 (ECC/non-ECC)
• Core™ i7-9850HE 45W (35W cTDP), 6C/GT2
• Core™ i7-9850HL 25W, 6C/GT2
• Core™ i3-9100HL 25W, 4C/GT2 (ECC/non-ECC)
• Pentium® G5600E 35W, 2C/GT1 (ECC/non-ECC)
• Celeron® G4930E 35W, 2C/GT1 (ECC/non-ECC)
• Celeron® G4932E 25W, 2C/GT1 (ECC/non-ECC)

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.

Note: Availability of the features may vary between processor SKUs.

# Memory

Up to 96GB\* 2133/2400 MHz DDR4 in three SODIMM sockets (\*under validation, max. 48GB verified)

(Xeon®, Core™ i3, Pentium®, Celeron® paired with CM246 supports both ECC and non-ECC memory)

(three sockets by build option)

# Embedded BIOS

AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel® AMT 12.0 support

# Cache

12MB for Xeon® 6C, 8MB for Xeon® 4C, 9MB for Core™ i7, 6MB for Core™ i3, 4MB for Pentium®, 2MB for Celeron®

# Chipset

• CM246 (supports ECC memory and Intel® AMT)
• QM370 (supports Intel® AMT )
• HM370 (no support for Intel® AMT )

Note: Chipset is same as Coffee Lake.

# Expansion Busses

• PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
• 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
• 2 PCI Express x1 (Gen3); CD connector, Lane 6/7
• LPC bus, SMBus (system), I2 C (user)

# SEMA Board Controller

Supports: voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control

# Debug Headers

• 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
• 60-pin XDP header for ICE debug of CPU/chipset (optional)

# Specifications

# ● Video

# GPU Feature Support

Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs

• Hardware encode/transcode HD content (including HEVC 10-bit)
• DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support
• OpenGL 4.5 support
• OpenCL 2.1, 2.0/1.2 support

# Digital Display Interface

DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI

Notes:

DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp

HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp

# VGA

VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz)

# LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode)

# eDP

4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp)

# ● Audio

Chipset: Intel® HD Audio integrated in chipset

Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported)

# ● Ethernet

Intel® I219LM/V with AMT 12.0 support (only LM version support AMT)

Interface: 10/100/1000 GbE connection

# Multi I/O and Storage

USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7)

SATA: Four ports SATA 6Gb/s (SATA0,1,2,3)

Serial: 2 UART ports with console redirection

GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only

Note: USB 3.1 Gen2 support dependent on carrier design

Notes:

\* All specifications are subject to change without further notice.
\* For CPU and chipset combinations not listed, please contact your ADLINK representative for availability.

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

# ● TPM

Chipset: Infineon

Type: TPM 2.0

# ● Power

Standard Input: ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5%

Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

# ● Operating Systems

# Standard Support

Windows® 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD)

# Extended Support (BSP)

Linux 64-bit, VxWorks 64-bit (TBD)

# ● Mechanical and Environmental

Form Factor: PICMG COM.0, Rev 3.0 Type 6

Dimension: Basic size: 125 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C

Extreme Ruggeed: -40°C to +85°C (build option for selected SKUs)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Functional Diagram
![Based on the provided block diagram, here are the labeled blocks and their connections:\n\n**Central Processing Blocks:**\n*   **Mobile 9th Gen Intel® Xeon® Intel® Core™ Intel® Pentium® Intel® Celeron® Processor**\n*   **Mobile Intel® QM370/HM370/CM246 Chipset**\n\n**Memory and Peripherals (Top Section):**\n*   **SODIMM 1 2133/2400 MHz DDR4**\n*   **SODIMM 2 2133/2400 MHz DDR4**\n*   **SODIMM 3 2133/2400 MHz DDR4**\n*   **XDP 60**\n*   **DDI 1 DP/HDMI/DVI**\n*   **DDI 2 DP/HDMI/DVI**\n*   **DDI 3 DP/HDMI/DVI**\n*   **PCIe x16 (Gen3) 1 x16, 2 x8, or 1 x8 + 2 x4**\n*   **eDP - LVDS**\n*   **eDP - VGA**\n\n**Chipset Interfacing Components (Middle/Bottom Section):**\n*   **LAN I219 LM/V No GbE_SDP**\n*   **LPC to UART**\n*   **TPM 2.0**\n*   **GPIO**\n*   **MUX** (Contains text: '4x GPO, 4x GPI')\n*   **New SEMA BMC**\n*   **SPI 0 BIOS**\n*   **SPI 1 BIOS**\n*   **Thermal Sensor**\n\n**Connections:**\n*   **Processor** connects to **SODIMM 1**, **SODIMM 2**, and **SODIMM 3** (dashed line for SODIMM 3).\n*   **Processor** connects to **XDP 60** (double arrow).\n*   **Processor** connects to **DDI 1**, **DDI 2**, and **DDI 3**.\n*   **Processor** connects to **PCIe x16 (Gen3)...**.\n*   **Processor** connects to **eDP - LVDS** (labeled 'eDP x2') and **eDP - VGA** (labeled 'eDP x2').\n*   **eDP - LVDS** connects to **single/dual 18/24 bit LVDS**.\n*   **eDP - LVDS** has a dashed connection labeled **eDP x4**.\n*   **eDP - VGA** has a dashed connection labeled **AUX**.\n*   **Processor** connects to **Chipset** via a double arrow labeled **DMI**.\n*   **Chipset** connects to **6x PClex1 (Gen3) (port 0-5)**.\n*   **Chipset** connects to **LAN I219 LM/V...** via a connection labeled **PCIe x1**.\n*   **Chipset** connects to **4x SATA 6Gb/s (port 0/1/2/3)**.\n*   **Chipset** connects to **8x USB 2.0**.\n*   **Chipset** connects to **HD Audio**.\n*   **Chipset** connects to **LPC to UART** (which connects to **UART0/1**).\n*   **Chipset** connects to **LPC bus** (which connects to **TPM 2.0**).\n*   **Chipset** connects to **SMBus**.\n*   **Chipset** connects to text reading **Supports Intel® Optane™ Technology & RST on PCIe ports 0-7**.\n*   **Chipset** connects to **2x PCIe x1 (Gen3) (port 6/7)**.\n*   **Chipset** connects to **4x USB 3.0 (port 0/1/2/3)**.\n*   **Chipset** connects to **GPIO** and **SDIO (for SD card)**.\n*   **New SEMA BMC** connects to **Chipset** via **SMBus**.\n*   **New SEMA BMC** connects to **SPI 0 BIOS**, **SPI 1 BIOS**, and **Thermal Sensor**.\n*   **SPI 0 BIOS** and **SPI 1 BIOS** are connected via a double arrow.\n*   **GPIO** connects to **MUX**.\n*   **MUX** connects to **GPIO SD**.\n*   **GPIO** connects to **SDIO (for SD card)**.](.Express-CFR-Datasheet-20200703-(alex-update,-make-ECC-support-more-clear.../0db1804cb030609c8dc8c975879393e4b4f27d0c69e9cbd7e937791dc9a9ae8c.jpg)

# Ordering Information

Express-CFR-E-2276ME
Basic COM Express Type 6 module with Intel® Xeon® E-2276ME (6C/GT2), CM246 chipset, supports ECC/non-ECC
Express-CFR-i7-9850HE
Basic COM Express Type 6 module with Intel® Core™ i7-9850HE (6C/GT2), QM370 chipset
Express-CFR-i3-9100HL
Basic COM Express Type 6 module with Intel® Core™ i3-9100HL (4C/GT2), HM370 chipset

SKUs not listed above can be supported by project basis. Please contact your local ADLINK representative.

# Accessories

\* Express-CF and Express-CFR share the same thermal solution

# Heat Spreaders

● HTS-CF-B
Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting
● HTS-CF-BT
Heatspreader for Express-CF/CFE with through hole standoffs for top mounting

# Passive Heatsinks

● THS-CF-BL
Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting
● THS-CF-BT
Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting
● THSH-CF-BL
High profile heatsink for Express-CF/CFE with threaded standoffs for top mounting

# Active Heatsink

● THSF-CF-BL
High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting

# Starter Kit

● COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6
[🔗 Link to the original document](.Express-CFR-Datasheet-20200703-(alex-update,-make-ECC-support-more-clear.../Express-CFR-Datasheet-20200703 (alex update, make ECC support more clear....pdf)