# Starter Kit for COM-HPC-sIDH

User’s Guide

intel

![ADLINK\n+ LEADING BASE COMPUTING\nCOM-HPC Server Base\nCOM-HPC Server Type Carrier Board](.preliminary-sidh-com-hpc-server-type-stkit-20231204/133842e9ca91fc3f46753f8e46232e38f2983a0eda924e9b0bc44baf6902f583.jpg)

Revision History

<table><tr><td>Revision</td><td>Description</td><td>Date</td><td>Author</td></tr><tr><td></td><td></td><td></td><td></td></tr></table>

# Preface

# Disclaimer

Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product descriptions at any time, without notice.

# Environmental Responsibility

ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company.

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California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3- dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to www.P65Warnings.ca.gov.

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# Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.

# Copyright © 2023 ADLINK Technology Incorporated

This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

# Safety Instructions

For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment before handling/operating the equipment.

Read these safety instructions carefully.

Keep this manual for future reference.
 Read the specifications section of this manual for detailed information on the operating environment of this equipment.
 Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
 To avoid electrical shock and/or damage to equipment:
 Keep equipment away from water or liquid sources;
 Keep equipment away from high heat or high humidity;
 Keep equipment properly ventilated (do not block or cover ventilation openings);
 Make sure to use recommended voltage and power source settings;
 Always install and operate equipment near an easily accessible electrical socket outlet;
 Secure the power cord (do not place any object on/over the power cord);
 Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
 If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

# Conventions

The following conventions may be used throughout this manual, denoting special levels of information

![The image displays a simple icon resembling a document or a page of paper. It features a thick red outline on a white background. The bottom right corner of the outline is folded upwards, creating a 'dog-ear' shape. Inside the white area, there are two thick, horizontal red lines centered vertically, representing text or content.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/e094feb942dd606d676aec47496659369651259f10738ae6884125f3342cf843.jpg)

Note: This information adds clarity or specifics to text and illustrations.

![The image displays a yellow triangular warning sign with a black outline. In the center of the triangle is a black exclamation point.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/5db4779f1445fbc64eb379dbe0a913ac2bfa0f78279672f26af34331d2ef9ab4.jpg)

Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.

![The image shows a red triangle with rounded corners containing a white exclamation point in the center.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/8695057847e7c004338be4e52d591ebee1d7016f580dea09a43b5e7cd6bebabf.jpg)

Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

# Getting Service

Ask an Expert: http://askanexpert.adlinktech.com

# ADLINK Technology, Inc.

No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan

Tel: +886-3-216-5088

Fax: +886-3-328-5706

Email: service@adlinktech.com

# Ampro ADLINK Technology, Inc.

6450 Via Del Oro, San Jose, CA 95119-1208, USA

Tel: +1-408-360-0200

Toll Free: +1-800-966-5200 (USA only)

Fax: +1-408-600-1189

Email: info@adlinktech.com

# ADLINK Technology (China) Co., Ltd.

300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China

Tel: +86-21-5132-8988

Fax: +86-21-5132-3588

Email: market@adlinktech.com

# ADLINK Technology GmbH

Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany

Tel: +49-621-43214-0

Fax: +49-621 43214-30

Email: emea@adlinktech.com

Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

# Table of Contents

Revision History ..

Preface .

List of Figures ... 8

1. Introduction .. . 9

1.1 How to Order the Server Type Starter Kit ... .. 10

1.2 Unpacking... . 11

1.3 What’s included in the Kit... ... 12

1.3.1 Standard Items.. . 12

1.3.2 Optional Items... . 17

2. Getting Started .. .19

2.1 Board Installation... ... 19

2.2 Module Uninstallation if required . . 32

2.3 Powering the COM-HPC Server System .. . 34

3. 10GbE Ethernet Adapter Cards at OCP Form Factor .. .35

3.1 10GbE SFP+ Ethernet Adapter Card... .. 36

3.2 10GBASE-T Ethernet Adapter Card... ... 38

4. Thermal Controlling .. .40

5. Secondary BIOS . .41

6. Switches, POST and LEDs.. .42

6.1 Switches (S0-S5)... .. 42

6.2 POST and inductors LEDs.. .... 44

6.3 ATX Power Connectors .. .... 45

6.4 AT Power Mode... .... 46

# List of Figures

Figure 1 – Module function diagram.. ..錯誤! 尚未定義書籤。
Figure 2 - Module rear side row and pin numbering .. .錯誤! 尚未定義書籤。
Figure 3 – Module feature locations (top side) ......... .. 錯誤! 尚未定義書籤。
Figure 4 – Module feature locations (bottom side). . 錯誤! 尚未定義書籤。
Figure 5 – Express-TL and Debug Module .... .錯誤! 尚未定義書籤。
Figure 6 – Module mechanical dimensions .... .. 錯誤! 尚未定義書籤。
Figure 7 – Heatspreader: HTS.. .. 錯誤! 尚未定義書籤。
Figure 8 – Heatsink: THS... .. 錯誤! 尚未定義書籤。
Figure 9 – Heatsink High Profile: THSH .. .. 錯誤! 尚未定義書籤。
Figure 10 – Heatsink with Fan: THSF.. .錯誤! 尚未定義書籤。

# 1. Introduction

The Server Type Starter Kit is intended for testing and verification of COM-HPC systems based on selected Server Type modules and includes everything customers need to begin their own design and development. The Server Type Starter Kit includes the COM-HPC Server carrier board, an extended ATX size COM-HPC Server Type reference carrier board, a COM-HPC Server Type module (of your choice), memory (of your choice), thermal solution (heatsink, of your choice) and additional items such as 10GbE Ethernet adapter card and cabling

The complete kit allows customers to quickly emulate the functionality of their end product for software development and hardware verification. Carrier board design files (schematics, mechanical drawings), COM-HPC module drivers, BSP and user manual are offered, at product webpages, to assist customers in designing their own custom carrier board.

The Server Type Starter Kit also includes additional development cards, such as dedicated 10GbE Ethernet adapter card at OCP form-factor that converts 10G-KR signals to 10GbE SFP+ or 10GBASE-T signals

# 1.1 How to Order the Server Type Starter Kit

Select a COM-HPC-sIDH module, memory and thermal solution

Contact an ADLINK sales representative in yor region

Get the specific part number for your starter kit

Follow above procedure allow you to get all necessary drivers/document for quick start

# 1.2 Unpacking

Check that the EPE foam layers contain the items shown below:

![Close-up of a green printed circuit board placed on a white surface, with metal clips and a small electronic component nearby (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/5734394b3ff82d5d406fd8305ef08c0b1573ad80c0d21e514b6b853bbe77dc2f.jpg)

First Layer

![Top-down view of a black printed circuit board with various connectors and a plastic fan (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/182e33d84fe066a1930a4a6e5ea97bea846a3b8a1129dd2c952b7ba04a666a77.jpg)

Second Layer

In the first layer of kit, there're 10GbE adapter card, I/O bracket and screws/standoff

In the second layer of kit, there're COM-HPC Server Carrier board and several cables

Note: all the boards are with ESD bag, just not shown on picture above

# 1.3 What’s included in the Kit

# 1.3.1 Standard Items

<table><tr><td>No.</td><td>Photo</td><td>Part Number</td><td>Description</td></tr><tr><td>1.</td><td>&lt;img src="images/8031590c8afe0ce6080956f0d4249f16d1afd106e74d59ffcc54a36941d273ac.jpg"/&gt;</td><td>91-77106-0010</td><td>COM-HPC Server BaseCOM-HPC Server Type reference carrier board</td></tr><tr><td>2.</td><td>&lt;img src="images/0a8b7566529070a95e1e841fa89278fe826538605abf8f569e4a986be953e608.jpg"/&gt;</td><td>91-79024-0020</td><td>10GbE SFP+ Ethernet adapter card (OCP-C827-4x10G-SFP+)Converts 4x 10GBASE-KR to 4x 10GbE SFP+ signals via Intel C827 PHYDedicated for COM-HPC-sIDHHeatsink is pre-assembled. Just not shown on this pictureDepends on the Kit you selected</td></tr><tr><td>3</td><td>&lt;img src="images/2ab595a6b51f7925df54ba6d92ca1571b043ecef74629aedc9fd38d514aea292.jpg"/&gt;</td><td>91-79025-0020</td><td>10GBASE-T Ethernet adapter card (OCP-X557-AT4-4x10GBASE-T)Converts 4x 10GBASE-KR to 4x 10GBASE-T signals via Intel X557-AT4 PHYDedicated for COM-HPC-sIDHHeatsink is pre-assembled. Just not shown on this pictureDepends on the Kit you selected</td></tr><tr><td>4</td><td>&lt;img src="images/c041c040b9c444cef2c5c3e1c8cb95e740a6581c6c9df6402da885629aa182e8.jpg"/&gt;</td><td>30-20893-0010</td><td>Flat Cable, 2x5P(2.0) to DB9PCan be used to connect the COM1 pinheader on COM-HPC Server Base</td></tr><tr><td>5</td><td>&lt;img src="images/39611c78e48547ce505a3242b3a7519801cac79f0f15f3481dd25c4c96c95546.jpg"/&gt;</td><td>30-23201-0000</td><td>Wire Canle, 2x10P(2.0) to USB3.0 Type-A(F)x2Can be used to connect the FP_USBconnector on COM-HPC Server Base</td></tr><tr><td>6</td><td>&lt;img src="images/d7a3948188dc14445ed34a6efeb5eeb1b980c145c4d5762b20c163758673103e.jpg"/&gt;&lt;img src="images/741f45fa8281a78aa160be0b66575cf87aa6f900c40126f6eee169a254ec3809.jpg"/&gt;</td><td>34-25330-1000</td><td>The I/O bracket shieldThe I/O shield is a matel material, It protects the motherboard against EMI and static discharge. It also blocks off any dust or moisture that might be getting into your PC.32-25330-1000 is for the kit ship with 10GbE SFP+ Ethernet adapter cardThe other one is for the kit ship with 10GBASE-T Ethernet adapter cardDepends on the kit selected</td></tr><tr><td>7</td><td>&lt;img src="images/2b7320ef8fbd3436819cea59cd78c1efe1aa6762a13247544d1c695e7b1985cd.jpg"/&gt;</td><td>33-03334-005033-70074-N000</td><td>Standoff A, M3, H11.2 and Screw M3, I-head, L5These standoffs and screws are used to assemble the 10GbE Ethernet adapter card to COM-HPC Server BaseQuantity: 4pcs</td></tr><tr><td>8</td><td>&lt;img src="images/5c1036d86dd92ffbce7cd70a72d1c68fd3f2fcc4e20906dadfb101042a9dc466.jpg"/&gt;</td><td>33-10210-6P30</td><td>Screw, P-head,L6.35, BZnScrews for assemble the COM-HPC Server Base to a chassis if requiredQuantity: 18pcs</td></tr><tr><td>9</td><td>&lt;img src="images/f7dfe2468b632eed1ec7a1198bd6bd0246f13adc41db53f75ad1c5aa01420da5.jpg"/&gt;</td><td>33-39021-0000</td><td>Guide pin D2.65, H37These four guide pins used for install and uninstall of module on the carrier.Quantity : 4pcs</td></tr><tr><td>10</td><td>&lt;img src="images/e93844bbbbdc530f59ae9fdcaa9f80188e9740712c1c31bea5207f9c0b969dbf.jpg"/&gt;</td><td>33-01224-0200</td><td>Screw M2.5,P-head,L20,Clean(SW+PW)These screws used for assemble COM-HPC module and COM-HPC Server BaseBottom mounting typeQuantity : 12pcs</td></tr><tr><td>11</td><td>&lt;img src="images/c2ee2820636812fbec364f63237c77c6d2a595e79bf7f00a9986d1bcee730989.jpg"/&gt;</td><td>33-71015-0010</td><td>Standoff B,M2.5,H10,NiThese standoff used for assemble COM-HPC module (four corner side) and COM-HPC Server BaseQuantity : 4pcs</td></tr></table>

1.3.2 Optional Items

<table><tr><td>No.</td><td>Photo</td><td>Part Number</td><td>Description</td></tr><tr><td>1.</td><td>&lt;img src="images/11d9d28072bb99efc5df7b28f098f1520ab40f2b0d1e52127bf9d92f32e6cd75.jpg"/&gt;</td><td>91-73103-XXXX</td><td>COM-HPC-sIDH COM-HPC Server Type moduleof your choice</td></tr><tr><td>2.</td><td>&lt;img src="images/6960043dae4d565a9329a2c20458a847cf68e6149d92beb26e05e41e2a2c23e4.jpg"/&gt;</td><td></td><td>Memory module(s)of your choice</td></tr><tr><td>3</td><td>&lt;img src="images/2b806957c271ec2d1b8a2ab8fcfa775f82c31a1eab05e8d067af40dfd493ec04.jpg"/&gt;</td><td>91-95329-0010</td><td>Thermal solutionof your choiceHeatsink with Fan with bottom mounting, dedicated for COM-HPC-sIDH moduleThere’re 4pcs screws for assembling the FAN cover to heatsink</td></tr></table>

# Getting Started

# 2.1 Board Installation

# Procedure

# Step 1

Take out the module, boards from ESD bag, put it on the EPE foam for further installation is advised

4 guide pin must be used for proper installation of the module to carrier (or uninstallation)

Place the COM-HPC Server Base on a leveled surface

Take out the 4 guide pins and place them into the 4 holes on the COM-HPC Server Base as indicated

![Close-up of a printed circuit board with gold connectors and circuit traces (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/97ad9096467eda3bc1c821d4fcedae98d1ecc3a262087306a3f3036652c7bb7a.jpg)

![Close-up of a printed circuit board with visible traces, pads, and components (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/63c2d02a59ccaaa4e8713f06f9ceb29b3b7915b07343012903a1e75405126815.jpg)

# Step 2

Align the module with the installed guide pins and put it gently onto the COM-HPC Server Base, as illustrated below.

# Required Items

![Close-up of a black printed circuit board with visible components and connectors (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/910a104436ab578c125226d4e11eda8431063b61904f2f1e112dc02a7ddd4326.jpg)

![Close-up of a computer motherboard with visible CPU socket and surrounding circuitry (no text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/03db4290601cbcedff1c81d7d8b6e96d8b4e1338afefc46d40eb99e03357a2ea.jpg)

![The image features seven thin, vertical black lines arranged in a horizontal row against a white background. They are evenly spaced and parallel.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/635f30330d3b1fabe42f3676bc7c158532895e32b8fd89e49b5e7bdd96a48111.jpg)

![Close-up of a computer motherboard with visible CPU socket and cooling fins (no text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/297ee8c996300a0dcfebef7d8efde6e746ef0a57cd73f16b6147f45eaf4469ea.jpg)

# Step 3

Using the pushing area indicated, firmly press down the module to secure it onto the COM-HPC Server Base.

![COMPUTA\nPushing-Area1\nPushing-Area1](.preliminary-sidh-com-hpc-server-type-stkit-20231204/9e6fe5ebba5c345a3998d7cfe2e104f7b90a46af8c4500b46949a33b9a3cb915.jpg)

![Close-up of a computer motherboard with a gloved hand holding the chip, no visible text or symbols](.preliminary-sidh-com-hpc-server-type-stkit-20231204/cb0b6898d2faf764a5189bb8375b7b51f866bc7d8a6a5160409664874aa564b3.jpg)

# Step 4

Once the module has been installed, remove the guide pins from the COM-HPC Server Base to finish

<table><tr><td>&lt;img src="images/7afdd08c8122f6a8af9191be2e300770069456bfe8df8874b719dc14f375ee15.jpg"/&gt;</td><td></td><td></td></tr><tr><td colspan="2">Step 5Take out and separate the thermal part as left, there is heatsink and dual FAN component.</td><td rowspan="3">&lt;img src="images/e77f8ee14a2b654bb3531b38098f4d7a11954414cc1e19d82fb018f6acd68e0d.jpg"/&gt;Bottom mounting style heatsink</td></tr><tr><td colspan="2">&lt;img src="images/9234ba808f8a59a114dda77b72a69e41c1164386627472a692a3b3fb8977f55a.jpg"/&gt;</td></tr><tr><td colspan="2">Step 6Turn the heatsink back to front, and remove the release paper of emboss for processor. Also, remove the release paper of emboss of power parts.</td></tr></table>

![Two-panel image showing a green sample on a brown substrate being processed with tweezers, and a close-up of a thin wire being held by tweezers over a metallic component (no text or symbols visible)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/12cdc17b6616d77ea8a7d5f7bed86efe3332395352884dabaf3d5627034e5c9b.jpg)

# Step 7

Take the heatsink above of the module and to ensure that direction is correctly for embossment of heatsink to the processor and power parts as figure shown in the left.

![Close-up of a computer motherboard with visible CPU socket and circuit board, no text or symbols present](.preliminary-sidh-com-hpc-server-type-stkit-20231204/5778a9e5b926da493583e0c0d2dc4beacdddd81bf9dd0ba0233385a92c97e4b0.jpg)

Yellow: Processor part Red: Power parts

# Step 8

Once heatsink installed appropriately, lock up screws diagonally as no listed in the left figure.

![3\n1\n2\n4](.preliminary-sidh-com-hpc-server-type-stkit-20231204/e153e9dc5c6cf3b1b3ec823f2b074c5e7678b826e17cf6ef011ae2aeb3d60c86.jpg)

# Step 9

Take out the screw parts as listed in right column, be ready to lock up the thermal solution.

![Close-up of a white textured fabric with metal screws and pins, no visible text or symbols](.preliminary-sidh-com-hpc-server-type-stkit-20231204/7fc4f80422490d422ee257bd8f266a6b3b743c6d114d38fcb0111a7d646f91c4.jpg)

![The image displays five identical metallic pins arranged in a horizontal row against a plain white background. Each pin features a flat, circular head with a small central indentation and a long, slender cylindrical shaft extending downwards. They are evenly spaced and appear to be standing upright.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/4489cf514aa434b164cac4dcb464321f6123f5e121f84cd8478c4fa233f4a595.jpg)

# Step 10

Turning the pre-assemblied COM-HPC module/COM-HPC Server Base, showing the back side of COM-HPC Server Base, to Lock up the thermal soultion from bottom.

That screw position (as yellowed cyrcle) same to the guide pin installation position, once thermal solution installed and could be used to lock up the carrier, moudle and thermal solution.

![Close-up of a circuit board with soldering tools and yellow circular annotations (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/03463a774c51a5514038a57b939448facf53409cd80ff8365581706088d85c2b.jpg)

# Step 11

Back to front side, covering the dual fan component onto the heatsink, make sure that fan cables in the front side for connecting to FAN connector

![Close-up of a gloved hand installing a black CPU socket on a motherboard (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/b29377b765fa07070c6feeaa12e69a9657ad04dec3bfc71909624341419ea227.jpg)

![Two black COM thermocouple heat sinks with cooling fans, shown from different angles (no text or symbols visible)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/8ab469f36a8f190bc614d53e647689cdcf46a932a30b5e7e66e9827c90e7d681.jpg)

Bottom mounting style heatsink

# Step 12

Take out of the small black screws, it used for lock up the dual fan component and heatsink.

![Close-up of a transparent plastic sheet with black screw-like pins, next to a textured blue fabric surface (no text or symbols visible)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/b35be1b5cd66a7bc1658d1973a15bb67c67c702e136b39b3d2ef249c1a989cca.jpg)

# Step 13

Lock up small black screws on four corners of dual fan cover.

![Close-up of a COM+HPC CPU socket with cooling fan and motherboard, no visible text or symbols on the main components.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/db0569e7431f2b446d991aaf0530c7e2280fcf2e24dc4cb27394a781dbefb089.jpg)

<table><tr><td>Step 13Screw the 4pcs standoffs and 4pcs screws for the COM-HPC module and COM-HPC Server Base (as yellow circle)&lt;img src="images/e9e8659e2bef1647ad5f9a641e52f2ce5b4e8e2e4b9831ec0f58e492f4cb50ad.jpg"/&gt;</td><td>&lt;img src="images/3d981d0ef1a210d0ea4f9f3ce4fc7e543039107c69e4a5b0b10acdc9003dd8b3.jpg"/&gt;&lt;img src="images/93cb3d5f21902a2a7d7bdad05abba9548e8ef6afbae3e780d925dad26d2a6656.jpg"/&gt;</td></tr><tr><td>Step 14Take out the standoff and screw parts as listed in right column, also take the 10GbE Ethernet adapter card Procedure below will take 10GBASE-T Ethernet adapter card as example (10GbE card depends on your selection)Screws the 4pcs standoff on the COM-HPC Server Base, nearby the MEZZ connector (as yellow circle)</td><td></td></tr></table>

![Close-up of a computer motherboard with visible CPU socket and connectors, no readable text or symbols present.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/81756d407b1ffa178e85c6224aa99d21d79dd0462d1e39cedd87c51cbe864446.jpg)

Step 15

Assmble the 10GbE Ethernet adapter card on the MEZZ connector on COM-HPC Server Base
![Close-up of a computer motherboard with CPU socket, heatsink, and cooling unit (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/e2f64d82ad500282198b70f7cb72db751cb14bab7b70578e63dabbc45f8d00a6.jpg)

Step 16
Screw the 4pcs screws on the 4pcs standoff (as yellow circle)

![Close-up of a computer motherboard with a black CPU fan and gold connectors (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/8c94006956620c1dd4726b4ceeceea6a27284ab508f43ab1e9c965915d4ec2d3.jpg)

![The image shows five small metal components, likely electrical pins or connectors, arranged in a horizontal row on a white, textured surface that resembles foam. From left to right: the first object is a silver metal pin with two vertical prongs. The second is a similar silver metal pin with two vertical prongs. The third is a silver metal pin attached to a small blue rectangular base. The fourth is a single silver metal pin. The fifth is a silver metal pin attached to a small blue rectangular base.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/d87274a676ee3160a799b28d4c51ad226d803d16dd2c271d7ab6694a2b017777.jpg)

![Four rectangular components are arranged horizontally on a white, textured surface. From left to right: the first is a reddish-brown block on a silver cylinder; the second is a black block on a silver cylinder with a small blue ring near the base; the third is a black block on a plain silver cylinder; and the fourth is a black block on a silver cylinder with a blue cap at the bottom.](.preliminary-sidh-com-hpc-server-type-stkit-20231204/7b05eddef14572deaeeff1a4a75a3890c58690b2d9440eb1f154738d9ef19819.jpg)

<table><tr><td>&lt;img src="images/15067ea2c5a4b64ab9f5fdef8ae1f9dce8d9b8338f3f9d6fadbc172f6d538caf.jpg"/&gt;</td><td></td></tr><tr><td>Step 17Inserting of DIMM memory into the COM-HPC module&#x27;s DIMM socket.</td><td></td></tr><tr><td>&lt;img src="images/1e0aaccb068c9be00ee73a1d81532bb824d521cb8b07231170f72aa42c07fc8c.jpg"/&gt;</td><td>&lt;img src="images/3d8af7fee0032e6a5af3ffe104fc09a388db4dbbb7fbb6bb53b6e65ab073266b.jpg"/&gt;</td></tr></table>

# Step 18

Connecting of FAN cable on FAN4 and FAN5 for 100% operating full time.

Or user can connect the FAN cable to FAN connector 1 and 2 of carrier for a dynamically operating by actual temperatures.

For more details, please refer to chapter 4, Thermal Controlling.

![Close-up of a gloved hand installing or adjusting a circuit board with colored wires and connectors (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/5f6307a1d31149b201d4cb8beda6c8c007fdd24d0547f17d7479972e442ad626.jpg)

# Step 19

Preparing of least 400W ATX power supply, and connecting the 24 pins power cable onto the ATX connector of Server carrier.

![Close-up of a gloved hand inserting into a computer motherboard with visible connectors and drive slots (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/ac233da728de06051ab2ebb9a33babdf38fe1f6e0c2fbc9d07a92cc3908fd248.jpg)

Step 20

Then install the 8 pins power cable onto the 8 pins connector of server carrier.

![Close-up of a gloved hand installing or adjusting a computer motherboard with visible CPU socket and wiring (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/0ccf18417a1b326a70bf41e1ad78a5a8d9ca3ee6b050414bd26c417e7fbf3cc4.jpg)

# Step 21

All installed and ready for power on by connecting the power cord to power supply or press the switch on switch on power supply

Note: the power up jumpers setting of COM-HPC Server Base is AT mode in default. See JP 35/33/31 setting on carrier board manual or the indication printed on COM-HPC Server Base or check section 6.4

![Close-up of a computer motherboard with visible CPU socket, connectors, and multicolored wires (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/caf8ab15ed0e5bd648d8006b4969050adea0051592b70bbc8a61267a9b9ce4c0.jpg)

# 2.2 Module Uninstallation if required

<table><tr><td colspan="2">COM-HPC Module Uninstaling</td></tr><tr><td>Step 1For any case that need to uninstall the module from carrier, please reverse steps as above, removing all of screws which has assembled, then to install the guide pins. &lt;img src="images/07198e06ce089c74bebdf992c6fc370de1d478fd1a1de0cd3fe97f49aeaf0a9a.jpg"/&gt;</td><td></td></tr><tr><td>Step 2Holding the upper and down bottom of the board, then pull the module up straightly.</td><td></td></tr></table>

![Close-up of gloved hands installing a computer motherboard with a CPU socket and RAM slots (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/d71f7afa79228b2a171f5742de28708f9a9e836fa50b64c5035adcdd12dd0007.jpg)

(top view)

![Close-up of gloved hands installing a computer motherboard with visible CPU socket and cooling fan (no text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/8eedfad59690be2fc6cd9ae0c9e90423a58b79bb881d8eb110c5d45ed87db2c8.jpg)

(side view)

# 2.3 Powering the COM-HPC Server System

<table><tr><td colspan="2">Powering up the COM-HPC Server system</td><td>Required Items</td></tr><tr><td></td><td>The POST LEDs on the COM-HPC Server carrier will display the bootup status – “Ad” indicates a successful boot.</td><td></td></tr><tr><td>&lt;img src="images/5dfe716690ab3380b911315a6aca913bd9c69f03e210ae6ecb1c54f21c66dd3a.jpg"/&gt;</td><td></td><td></td></tr><tr><td>&lt;img src="images/7e64016f4c23df879981b4a30df7b1120e8228fd3e1eb33ecf750915c533a134.jpg"/&gt;</td><td>If no operating system is installed on the system, then the monitor will display the UEFI shell after the first boot up.</td><td></td></tr></table>

# 3. 10GbE Ethernet Adapter Cards at OCP Form Factor

ADLINK 10GbE Ethernet adapter cards provide access to the COM-HPC Server module’s 10GBASE-KR interface plus its sideband signals and then convert to 10GbE SFP+ or 10GBASE-T signals. The Ethernet adapter card leverage the OCP form factor in dimension and connector style. The COM-HPC Server module requires dedicated 10GbE Ethernet adaptor card as platform specified by vendors, and below are two qualified PHY implemented.

The installation of 10GbE Ethernet adapter cards are as shown on section 2.1

10GbE FW spread into COM-HPC Server module and 10GbE Ethernet adapter card, high level illustration as picture below

![COM-HPC module\nCOM-HPC-sIDH\n10G controller FW\nintegrated into BIOS SPI ROM\nIntegrated into customer's side\ncarrier board or 10G adaptor card\nIntel 10G LAN controller\nintegrated into Ice Lake-D SOC\nOptical PHY on back-side\nID EEPROM talk to 10G controller\ndefine the usage (KR or Optical or Copper)\n10G_KR_TX/RX Side band\nPHY FW stored\nThere's heatsink on top of PHY, but just not shown on picture above](.preliminary-sidh-com-hpc-server-type-stkit-20231204/880bdbced6ba555d40ceaea4b989be1040752e4eecee4f830ed03c9063b398a8.jpg)

# 3.1 10GbE SFP+ Ethernet Adapter Card

# OCP-C827-4x10G-SFP+

Dedicated for COM-HPC-sIDH module usage. It converts 4x 10GBASE-KR & related sideband signals to 4x 10GbE SFP+ signals and can connect to SFP+ transceiver through Intel C827 PHY. Please check the User’s Manual from ADLINK website for more detailed information. If FW updated required, please contact your ADLINK local presentative for detail update procedure SOP.

![Close-up of a green printed circuit board with integrated circuits and capacitors (no readable text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/8750ca52a7da6bc9f58c0ac0b4c34a9e3166c8270fc239054601191a2872d99e.jpg)

10G-KR and sideband Input
(Through OCP connector, back side)

![PHY FW stored\n1x OCP Connector\nID EEPROM with FW stored\n4x SFP+ Connectors](.preliminary-sidh-com-hpc-server-type-stkit-20231204/d4a85fbe53a163f7ed4ca0b618a57fa19b21790c5fdf36ab78b8ae5643e6045a.jpg)

Figure – OCP feature locations

# 3.2 10GBASE-T Ethernet Adapter Card

# OCP-X557-AT4-4x10GBASE-T

Dedicated for COM-HPC-sIDH module usage. It converts 4x 10GBASE-KR & related sideband signals to 4x 10GBASE-T ports through Intel X557-AT4 PHY. Please check the User’s Manual from ADLINK website for more detailed information. If FW updated required, please contact your ADLINK local presentative for detail update procedure SOP.

![Top-down view of a computer motherboard with heatsink, fan, and cooling unit (no visible text or symbols)](.preliminary-sidh-com-hpc-server-type-stkit-20231204/3060b1a2d015bfe5c80220597d50d1f029a32d0373266253af06bc11a87c5857.jpg)

10G-KR and sideband Input
(Through OCP connector, back side)

![1x OCP Connector\nID EEPROM with FW stored\n4x RJ45 Connectors\nPHY FW stored](.preliminary-sidh-com-hpc-server-type-stkit-20231204/b6d77b8924af873209eb390cac4646ee4d59e904ad40c7c8fadbeacc4386afaf.jpg)

Figure – OCP feature locations

# 4. Thermal Controlling

![0 1 2\nCOM+HPC® AOLINK\nModule\nEC/MCU\nCarrier\nBMC\n4\n5](.preliminary-sidh-com-hpc-server-type-stkit-20231204/50717694de18fdd2454c65782aa63f2512949d4d61b33aafba359dda31b08432.jpg)

FAN\_0 Thermal table (EC or MCU)
Control level, CPU Tj, PWM duty (%)

<table><tr><td>1</td><td>25</td><td>25%</td></tr><tr><td>2</td><td>40</td><td>50%</td></tr><tr><td>3</td><td>55</td><td>75%</td></tr><tr><td>4</td><td>70</td><td>100%</td></tr></table>

FAN\_1, FAN\_2 Thermal table (Carrier BMC)
Control level, CPU Tj, PWM duty (%)

<table><tr><td>1</td><td>&lt;30</td><td>40%</td></tr><tr><td>2</td><td>30</td><td>50%</td></tr><tr><td>3</td><td>35</td><td>60%</td></tr><tr><td>4</td><td>40</td><td>70%</td></tr><tr><td>5</td><td>45</td><td>80%</td></tr><tr><td>6</td><td>50</td><td>90%</td></tr><tr><td>7</td><td>56</td><td>100%</td></tr></table>

FAN\_4, FAN\_5 Thermal table
Control level, CPU Tj, PWM duty (%)

<table><tr><td>1</td><td>N/A</td><td>100%</td></tr></table>

# 5. Secondary BIOS

The COM-HPC Server-BASE supports Secondary BIOS, using Boot Serial Peripheral Interface (SPI) for COM-HPC modules.

Secondary BIOS solutions can be used as an alternative to the on-module BIOS and provide support for the following:

• Testing new BIOS versions
Development of firmware modifications
• Recovery if soldered BIOS on module is corrupted

To use the BIOS on the module; short pins 1-2 on JP27, JP28, JP29

To use the BIOS on the carrier board; Short pins 2-3 on JP27, and keep pin 1-2 on JP28, JP29

Ensure the secondary BIOS flash chip has been installed into the Carrier BIOS socket before BOOT BIOS adjusting.

![COM1\nJP9\nJP29\nJP28\nJP27\nFAN_0\nESPI\nCarrier BIOS\nCOM+HPC™](.preliminary-sidh-com-hpc-server-type-stkit-20231204/b605d6ea7f7bb4daf5a82ece352e345f75e131f5d2d880e6fefc9cda541b20bd.jpg)

# 6. Switches, POST and LEDs

# 6.1 Switches (S0-S5)

There are two switches at the center and low of right side of the carrier.

As PWR\_BTN triggering for get into S0 from S5 of system.

![ATX_24\nATX_8\nPWR_BTN\nCN35\nJP36](.preliminary-sidh-com-hpc-server-type-stkit-20231204/d274534519f62dba9c3ae36f72a0e10aa4a578ee707ba315aa7d6926d1e1a5ee.jpg)

And the RST\_BTN triggering for resetting of the system.

![USB4_5\nFRONT PANEL\nM2_0\nOCPLB\nN2_1\nN2_1\nRST_BTN\nLED3\nGP_SP1](.preliminary-sidh-com-hpc-server-type-stkit-20231204/67fab2d879306dffe4ff070475dc01e375eaca78ac91b0114a1a107952e2ba36.jpg)

# 6.2 POST and inductors LEDs

An eSPI based POST display is added for debugging.

The two 7-SEG LEDs shows the actual POST data.

![M2_1\n0M2\nOCPLB\nRST_BT\nLED3\n8.8.\nGP_SPI](.preliminary-sidh-com-hpc-server-type-stkit-20231204/d2a1cc11e50fbc8c3f2a363f32248e46f9a87661cef9688099a1032ee0cf1d45.jpg)

A row of mini-LEDs to below of the POST display indicates the following:

5VSB: ATX power attached on standby or active

S3: Indicates S3 status

PWR\_ON: Indicates power on

WDT: Indicates WDT timer activity

BMC\_HB: Heart beat LED indicator output

![5VSB\nS3\nPWR_ON\nWDT\nBMC_HB](.preliminary-sidh-com-hpc-server-type-stkit-20231204/26caedf1a284db63f3eb75e3c33073b36775f7f0c27878a5ddbdb63f590b3418.jpg)

# 6.3 ATX Power Connectors

The COM-HPC Server BASE has one ATX 24-pin connector to supply power to the carrier board and one ATX 12V 8-pin connector to supply power to the COM Express module.

The system will not power on unless an ATX 12V 8-pin connector is connected.

If your power supply has a 24-pin ATX connector, then attach the connectors as shown.

![ATX_24\nATX_8\nPWR_BTN](.preliminary-sidh-com-hpc-server-type-stkit-20231204/c272272f60f117d7253dd3ad54987ad6c6534a7e063b713e0f2cdbc9596e857f.jpg)

# 6.4 AT Power Mode

To operate the system in AT Mode with an ATX power supply,

Refer to chapter 6.24 jumpers setting for more details, or follow instruction below.

Jumpers Setting for ATX mode

<table><tr><td>JP31</td><td>JP32</td><td>JP33</td><td>JP35</td><td>POWER MODE</td></tr><tr><td>1-2</td><td>1-2</td><td>1-2</td><td>2-3</td><td>ATX Mode</td></tr></table>

![JP33 JP32 JP31\nJP35](.preliminary-sidh-com-hpc-server-type-stkit-20231204/02bc12374f893985af4f440aebb97cb26908f89a0b47ceed439320fda33a3798.jpg)

Jumper Setting for AT mode

<table><tr><td>JP31</td><td>JP32</td><td>JP33</td><td>JP35</td><td>POWER MODE</td></tr><tr><td>2-3</td><td>2-3</td><td>2-3</td><td>3-4</td><td>AT Mode</td></tr></table>

![JP33 JP32 JP31\nJP35](.preliminary-sidh-com-hpc-server-type-stkit-20231204/1dc25ac5d8283a9a24ff1acc007e18f3aa02d06d3c0d572fe9bbd70c071ab725.jpg)

![S\nIPMI\nJP33 JP32 JP31\nJP35\nJP3\nJP2\nBMC_DBG](.preliminary-sidh-com-hpc-server-type-stkit-20231204/a38a990f90b2aa24f85ca6a4a2e5739129cd28d891a8af3f5c2f66238a15da4a.jpg)
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