# OCP-4x10G-SFP+ User's Guide 11/24/2022- 12/24/2022 ![This image features a circular design composed of numerous light green, sprout-like or arrow-shaped icons arranged in concentric rings. Each icon points outward from the center, creating a sunburst effect against a plain white background.](.product-spec-ocp-4x10g-sfp-user-manual/e51fa8ffa524868b52b39171a13528dc6ddfdc6ba4822a7e3427d69b1459d886.jpg) OPEN ![Circular arrangement of green arrows pointing outward from center, no text or symbols present](.product-spec-ocp-4x10g-sfp-user-manual/ff56c85244dcf364a225f6e153f71fbeff6417b5247c2a70a44a4737e9f3194a.jpg) OPEN ![ME7Z_C1\nCN5\nCN4\nV-T\nM06V0\n94V-0\n2148\nCN3\nCN2\nCN6](.product-spec-ocp-4x10g-sfp-user-manual/f9e253481c04acc24f80d0b8203e33865a64ae6fef5dd53064bb3a5eef04bc7f.jpg) # Preface # Disclaimer Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product descriptions at any time, without notice. # Environmental Responsibility ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company. ![The image displays a black and white line drawing of a wheeled bin with a large 'X' crossed over it, positioned above a solid black rectangle.](.product-spec-ocp-4x10g-sfp-user-manual/6e6ac563fa5d486fddeba7d3f1b8db035c999da7e1ae0e003885d3bba994507a.jpg) ![A red triangular warning sign with rounded corners featuring a white exclamation point in the center.](.product-spec-ocp-4x10g-sfp-user-manual/0a59b9bd3d096783f0d81f2f00ed04ee1694afe4c724105ca9283bc9c3b734f3.jpg) California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3- dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to www.P65Warnings.ca.gov. # Trademarks Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies. Document Name:OCP-4x10G-SFP+ Product Specs last saved: 2024/6/12 Confidential – all rights reserved # © Copyright 2020 ADLINK Technology Incorporated This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer. # Safety Instructions For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment before handling/operating the equipment. Read these safety instructions carefully. Keep this manual for future reference. • Read the specifications section of this manual for detailed information on the operating environment of this equipment. • Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment. • To avoid electrical shock and/or damage to equipment: Keep equipment away from water or liquid sources; Keep equipment away from high heat or high humidity; • Keep equipment properly ventilated (do not block or cover ventilation openings); • Make sure to use recommended voltage and power source settings; • Always install and operate equipment near an easily accessible electrical socket outlet; • Secure the power cord (do not place any object on/over the power cord); • Only install/attach and operate equipment on stable surfaces and/or recommended mountings; • If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment. # Conventions The following conventions may be used throughout this manual, denoting special levels of information ![The image shows a red outline icon resembling a document or piece of paper. The shape is roughly square with a folded top-right corner. Inside the red border, there are two horizontal red lines centered horizontally. The background is white.](.product-spec-ocp-4x10g-sfp-user-manual/78a7a7e66e36110fcad45a445377315fef97dac39e71d308d4c0f65124812e9c.jpg) Note: This information adds clarity or specifics to text and illustrations. ![The image shows a low-resolution, pixelated graphic of a yellow triangular warning sign. Inside the yellow triangle is a white exclamation mark centered vertically.](.product-spec-ocp-4x10g-sfp-user-manual/05f0d70df2bd08edb4945708dfe978d708da2204025f019a7cacefa495b7e1c4.jpg) Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption. ![The image displays a red, triangular warning sign with rounded corners. In the center of the red triangle is a white exclamation point (or exclamation mark).](.product-spec-ocp-4x10g-sfp-user-manual/ec40b40d01f8e667475323f7a2a8d20f4f386cee1913f45db602145109486dcb.jpg) Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption. # Revision History
RevisionPLM RevisionDescriptionDateAuthor
0.81st release to TPDC2022-11-24Alex Wang
# Table of Contents 1. OCP Card Introduction.... 1.1 Mechanical and Environmental . 2. Block Diagram .... ..錯誤! 尚未定義書籤。 3. Mezzaniee card pin Descriptions.. 13 3.1 Pin Summary .. . 13 4. Mechanical.... .16 # List of Figures Figure 1 – .12 Figure 2 – .錯誤! 尚未定義書籤。 Figure 3 – C Figure 4 – . ..錯誤! 尚未定義書籤。 Figure 5 – .錯誤! 尚未定義書籤。 Figure 6 – . .錯誤! 尚未定義書籤。 Figure 7 – .錯誤! 尚未定義書籤。 # 1. OCP Mezzanine Card Introduction ![The image displays a red triangular warning sign with a white border. Inside the triangle, centered, is a white exclamation mark.](.product-spec-ocp-4x10g-sfp-user-manual/9498a551b372dfb014434fe2d7edb7ee4d308b2c16cc90fafdc93723e868a71d.jpg) Warning: This is an EA (early available) engineering manual. The contents may not accurately reflect the actual or final version of this product. The original OCP Mezzanine Card for Intel v2.0 Motherboard specification1 have been developed mainly to serve the use case of Single and Dual port 10G Ethernet card. Adoption of this specification has been seen in OCP community on different server and storage platforms. Over the recent two years, demand of supporting new use cases were raised and the original Mezzanine card specification cannot support those new use cases without modification in order to support different I/O types, increase bandwidth of data and management, and support higher power controller IC. Mezzanine card 2.0 specification is developed based on original OCP Mezzanine card. It extends the card mechanical and electrical interface to enable new uses cases for Facebook and other users in OCP community. The extension takes backward compatibility to existing OCP platforms designed for original OCP Mezzanine card specification V0.5 into consideration, and some tradeoffs are made between backward compatibility and new requirements. Mezzanine card with different placement height restriction, I/O connectors’ location, and mezzanine connector stacking height to baseboard. Type 1 is the original OCP Mezzanine 1.0 stack with 8mm stacking. This is also the most widely adopted stacking Type. The baseboard needs to have a cut out with in the I/O area since most network connector is taller than 8mm. Type 2 is based on Type 1, but change stacking to 12mm for taller heatsink. Baseboard and system does not have strict height constrain can take this stacking with the benefit to avoid have cut out in baseboard, and having taller heatsink on Mezzanine card side. 64 pin Connector C is added in Mezzanine card 2.0 Rev0.45. The pin assignment of Connector C has up to 4x KR, their low speed and I2C signals, and power pins. It is created to support the use case of KR only. Connector C can be used independently on Mezzanine card side. The typical KR Mezzanine card implementation with Connector C does not have Connector A and Connector B on card side. # OCP card Ethernet KR/KX Interfaces 4x SFI Mezzanine card with Connector C and with 4 pcs SFP+ connectors. Module’s Broadcom® Ethernet Controller BCM57502, connected to the SoC through PCIex8 lane 4x 10GBASE-KR and its sideband signals Supports both full-duplex and half-duplex Note: BCM57504 4x 25GBASE-KR only make sense if PHYs are on carrier board directly, not with OCP card, because OCP connectors cannot sustain 25G # 1.1 Mechanical and Environmental Form Factor and Specification
TYPEA(typ)B(max)C(max)H(max)S(typ)I/OController IC
TYPE 31.57mm7.5mm4.5mm/4mm7.5mm8mmPrimary side optional /Secondary sidePrimary side/secondary side
64 pin Connector C is added in Mezzanine card 2.0 Rev0.45. The pin assignment of Connector C has up to 4x KR, their low speed and I2C signals, and power pins. It is created to support the use case of KR only. Connector C can be used independently on Mezzanine card side. The typical KR Mezzanine card implementation with Connector C does not have Connector A and Connector B on card side.
Mezzanine card (5mm stack)Mezzanine card (8/12mm stack)Baseboard (5/8mm stack)Baseboard (12mm stack)
Connector CFCI/10135584-641402LFFCI/10135584-644402LFFCI/10135583-641402LFFCI/10135583-642402LF
![Connector C](.product-spec-ocp-4x10g-sfp-user-manual/271fdfd3a855bea6eefb35492ab37f16d4db5fb73568fceb97e6271f96a1179e.jpg) # Operating Temperature Standard 0°C to +60°C at 12V Storage: -20°C to +80°C The module can operate at -40°C to +85°C at 12V if Broacom LAN controller is not populated # Humidity 5-90% RH operating, non-condensing, 5-95% RH storage (and operating with conformal coating) # Shock and Vibration Document Name:OCP-4x10G-SFP Product Spec Page 18 Copyright © 2024 ADLINK Technology, Inc. IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT tested Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # EMI EN55032 Class B inside an enclosure Ultrasound equipment will typically be sensitive to noise in the 1MHz to 20MHz band, we shall handle it well during these bands # De-rating De-rating file is provided by RD (delta temperature of some of components is based on the experience of previous products) and reviewed/approved by RRC team before each Gerber Out Once we have real sample on-hand, the temperature of critical components shall be measured and feedback to the De-rating file to see if it still in specification. # MTBF 200,000 hrs commercial 40℃ ambient (according MIL calculation) based on actual calculated de-rating 120,000 hrs ETT -20℃\~70℃ ambient (according MIL calculation) based on actual calculated de-rating (excludes the BCM57504 LAN controller) # Specific Requirement PM need a table with early predicted MTBF (must with CPU/PCH into consideration) at 0℃ to +60℃ and -40℃to +85℃ for every SKUs on leading platform. We need this table to align which SKUs are suitable for ETT support Document Name:OCP-4x10G-SFP+ Product Specs last saved: 2024/6/12 Confidential – all rights reserved All the final version MTBF shall be calculated with real CPU/PCH data (for example, Intel has real reliability data, called F.I.T data) - All the standard SKUs need has its own final version MTBF report, not just the highest-end SKU # 2. Block Diagram ![Based on the provided flowchart/block diagram, here is a description of the labeled blocks and their connections:\n\n**1. CPU module (Left Column)**\n* **Blocks:**\n * CPU\n * LAN controller (BCM57502)\n * MCU (STM32L071RBT6)\n* **Connections:**\n * **CPU** connects to **LAN controller** via **PCIE X8**.\n * **LAN controller** connects to **MCU** via **SFI side band signal x4 group** and **LED signal x4 group**.\n * **MCU** connects to **LAN controller** via **I2C** and **BEC_SEL0/1**.\n\n**2. Carrier board (Center Column)**\n* **Blocks:**\n * Demux (TMUXHS4412)\n * Retimer (DS100DP410SGE/WOPB)\n * Mux (TMUXHS4412)\n* **Connections:**\n * **LAN controller** (from CPU module) connects to **Demux** via four unlabeled lines.\n * **Demux** connects to **Retimer** via **SFI0_RX**, **SFI1_RX**, **SFI2_RX**, and **SFI3_RX**.\n * **Retimer** connects to **Mux** via four unlabeled lines.\n * **Mux** connects to the **OCP Card** (right column) via **SFI0_RX**, **SFI1_RX**, **SFI2_RX**, and **SFI3_RX**.\n * Red lines labeled **For KB0_RX**, **For KB1_RX**, **For KB2_RX**, and **For KB3_RX** connect the output side of the **Demux** to the input side of the **Mux** (appearing to bypass the central Retimer).\n\n**3. OCP Card (Right Column)**\n* **Blocks:**\n * Retimer (DS100DP410SGE/WOPB)\n * Port 0 SFP+\n * Port 1 SFP+\n * Port 2 SFP+\n * Port 3 SFP+\n * GPIO expander (top)\n * GPIO expander (bottom)\n * SN74LV4052APN\n* **Connections:**\n * **LAN controller** (from CPU module) connects to the top **Retimer** via **SFI0_TX**, **SFI1_TX**, **SFI2_TX**, and **SFI3_TX**.\n * The **Mux** (from Carrier board) connects to the top **Retimer** via **SFI0_RX**, **SFI1_RX**, **SFI2_RX**, and **SFI3_RX**.\n * The top **Retimer** connects to **Port 0 SFP+**, **Port 1 SFP+**, **Port 2 SFP+**, and **Port 3 SFP+**.\n * **GPIO expander** (top) connects to the ports via **LED0 to SFP+0**, **LED1 to SFP+1**, **LED2 to SFP+2**, and **LED3 to SFP+3**.\n * **GPIO expander** (bottom) connects to the ports via **Sideband signal to SFP+ 0**, **Sideband signal to SFP+ 1**, **Sideband signal to SFP+ 2**, and **Sideband signal to SFP+ 3**.\n * **MCU** (from CPU module) connects to **SN74LV4052APN** via **CEI_I2C**.\n * **SN74LV4052APN** connects to the ports via **SFP 0_I2C to SFP+0**, **SFP 1_I2C to SFP+1**, **SFP 2_I2C to SFP+2**, and **SFP 3_I2C to SFP+3**.\n * **SN74LV4052APN** connects to **GPIO expander** (bottom) via **BEC_SEL0** and **BEC_SEL1**.](.product-spec-ocp-4x10g-sfp-user-manual/499bbd052892c2edac8e902908317d3226a778b69bc2f148689889ae408965f9.jpg) ![**Labeled Blocks:**\n* 4x SFI Mezzanine card with Connector C\n* Retimer\n* SFP+ 0\n* SFP+ 1\n* SFP+ 2\n* SFP+ 3\n* GPIO Expander 1 (TCA9535RGER_TI)\n* GPIO Expander 2 (TCA9535RGER_TI)\n* GPIO Expander 3 (TCA9535RGER_TI)\n\n**Connections:**\n* Four arrows connect '4x SFI Mezzanine card with Connector C' to 'Retimer'.\n* One arrow connects 'Retimer' to 'SFP+ 0'.\n* One arrow connects 'Retimer' to 'SFP+ 1'.\n* One arrow connects 'Retimer' to 'SFP+ 2'.\n* One arrow connects 'Retimer' to 'SFP+ 3'.\n* One arrow connects 'SFP+ 0' to '4x SFI Mezzanine card with Connector C'.\n* One arrow connects 'SFP+ 1' to '4x SFI Mezzanine card with Connector C'.\n* One arrow connects 'SFP+ 2' to '4x SFI Mezzanine card with Connector C'.\n* One arrow connects 'SFP+ 3' to '4x SFI Mezzanine card with Connector C'.\n* One arrow connects '4x SFI Mezzanine card with Connector C' to 'GPIO Expander 1 (TCA9535RGER_TI)'.\n* One arrow connects 'GPIO Expander 1 (TCA9535RGER_TI)' to '4x SFI Mezzanine card with Connector C'.\n* One arrow connects '4x SFI Mezzanine card with Connector C' to 'GPIO Expander 2 (TCA9535RGER_TI)'.\n* One arrow connects 'GPIO Expander 2 (TCA9535RGER_TI)' to '4x SFI Mezzanine card with Connector C'.\n* One arrow connects '4x SFI Mezzanine card with Connector C' to 'GPIO Expander 3 (TCA9535RGER_TI)'.\n* One arrow connects 'GPIO Expander 3 (TCA9535RGER_TI)' to '4x SFI Mezzanine card with Connector C'.](.product-spec-ocp-4x10g-sfp-user-manual/2bae8e829ab86861bec70ddd475755b8a93c6da686472553f85a620fd8bd3960.jpg) Figure 1 –Function Block Diagram # 3. Mezzanine card pin Descriptions # 3.1 Pin Summary (DRAFT) Mezzanine card pin description is shown in below table; input output direction is in the prospective of baseboard.
Signals on Connector CTypeDescription
GNDGroundGround return
P12V/P12V_AUX/P5V_AUXPowerPower supply to Mezzanine connector
SDP[3..0]InputSoftware defined pin for port 0~3; OD, pull up at baseboard sideSFP+ KR Mezz:MODULE_PRSENT_N[3..0] for Port [3..0]SFP+ modules10GBaseT KR Mezz:INT_N [3..0] for Port [3..0] 10GBaseT PHYQSFP+ KR Mezz:SDP_0 to QSFP+ MODULE_PRSENT_N
KR_TX_DP/N<3..0>OutputKR TX; total up to 4 lanes on Connector C
KR_RX_DP/N<3..0>InputKR RX; total up to 4 lanes on Connector C
LED_P[3..0]_0_NOutputPort[3..0] LED0 for link speed; OD and active low
LED_P[3..0]_1_NOutputPort[3..0] LED1 for link activity; OD and active low
SHARED_KR_MDCOutputMDC for PHY
SHARED_KR_MDIOBidirectionalMDIO for PHY
MEZZ_SMCLKOutputSMBus Clock for Mezzanine slot for PHY/Repeater config/Mezz FRU EEPROM; 3.3V AUX rail; Share with thermal reporting interface; Both 100Kb/s and 400Kb/s shall be supported
MEZZ_SMDATABidirectionalSMBus Data for Mezzanine slot for PHY/Repeater config/Mezz FRU EEPROM; 3.3V AUX rail; Share with thermal reporting interface; Both 100Kb/s and 400Kb/s shall be supported
EXT_MDIO_I2C_SELOutputStrapping pin to configure PHY/repeater on KR Mezzanine card to be accessed through MDIO or I2C. High for MDIO and Low for I2C
Module_SCL[3..0]OutputDedicate I2C for SFP+ or QSFP+ modules
Module_SDA[3..0]BidirectionalDedicate I2C for SFP+ or QSFP+ modules
MEZZ_PRSNTC2_NInputConnector C Present Pin; connect to GND with 0 ohm on Mezzanine card side
RSVDTBDReserved for Future use
Power RailVoltage Tolerance# of pinsCurrent CapabilityStatus
P12V_AUX/P5V_AUX-P12V±8%(max)32.4AAuxiliary Power/Normal Power
Connector C
SignalPinPinSignal
P12V_AUX/P5V_AUX-P12VC33C1MEZZ_SMCLK
P12V_AUX/P5V_AUX-P12VC34C2MEZZ_SMDATA
P12V_AUX/P5V_AUX-P12VC35C3EXT_MDIO_I2C_SEL
RSVDC36C4GND
SDP0C37C5KR_TX_DP<2>
SDP1C38C6KR_TX_DN<2>
GNDC39C7GND
KR_TX_DP<0>C40C8LED_P1_0_N
KR_TX_DN<0>C41C9LED_P1_1_N
GNDC42C10GND
LED_P0_0_NC43C11KR_TX_DP<3>
LED_P0_1_NC44C12KR_TX_DN<3>
GNDC45C13GND
KR_TX_DP<1>C46C14LED_P2_0_N
KR_TX_DN<1>C47C15LED_P2_1_N
GNDC48C16GND
SHARED_KR_MDC_0C49C17KR_RX_DP<2>
SHARED_KR_MDIO_0C50C18KR_RX_DN<2>
GNDC51C19GND
KR_RX_DP<0>C52C20Module_SCL0
KR_RX_DN<0>C53C21Module_SDA0
GNDC54C22GND
LED_P3_0_NC55C23KR_RX_DP<3>
LED_P3_1_NC56C24KR_RX_DN<3>
GNDC57C25GND
KR_RX_DP<1>C58C26Module_SCL1
KR_RX_DN<1>C59C27Module_SDA1
GNDC60C28GND
Module_SCL2C61C29Module_SCL3
Module_SDA2C62C30Module_SDA3
GNDC63C31SDP2
MEZZ_PRSNTC2_NC64C32SDP3
Document Name:OCP-4x10G-SFP Product Spec # Notes: Document Name:OCP-4x10G-SFP+ Product Specs # 4. Mechanical # OCP Card views Quad Port 10GBaseT RJ45 KR Mezzanine card with Connector C (Type 2) heat sink height is limited to 7.5mm max and may not be able to provide sufficient cooling to some controller IC. Type 2 vertical stack allows 11.5mm max for heatsink and provide more freedom to thermal design. This implementation has limitation in system mechanical compatibility due to taking extra volume. Vendor may need to modify mechanical design in order to support it. #
BFOR PLUG, SEE DWG. NO. 61083
COMBINATION OF MATED HEIGHTPlug 1Plug 2Plug 3Plug 4
Recep 1 3.75678
Recep 2 7.79101112
Recep 3 11.713141516
# # ![Connector B\nConnector C](.product-spec-ocp-4x10g-sfp-user-manual/c516ddaf75916f02aa5033e4835765ba57a46bb0ef1913e4f6b9dbe5240df5e5.jpg) Side View of Quad port 1oG SFP+ KR Mezzanine Card ![3D CAD model of a purple and gray electronic component with green outline, showing internal structure and dimension label (7.5mm)](.product-spec-ocp-4x10g-sfp-user-manual/4e313e087744a99389c77923fc1a699258b3d29698aa06ad318a191272057b65.jpg) Document Name:OCP-4x10G-SFP Product Spec ![Pin1\nCONN C](.product-spec-ocp-4x10g-sfp-user-manual/b6400b8899f3d8373ab8bdc82193cd22514149a2c924b0577459b349e0dbef67.jpg) Figure 2 – Card with connector C bottom view
TYPEA(typ)B(max)C(max)H(max)S(typ)I/OController IC
TYPE 21.57mm2.9mm/2.0mm4.5mm/4mm11.5mm12mmPrimary side/Secondary side optionalPrimary side
# Product Specification # OCP-4x10G-SFP+ Rev 1.0 Date: 2022/11/24 Status: Released Author:Alex.Wang Approved: OCP-4x10G-SFP+ TPDC member [🔗 Link to the original document](.product-spec-ocp-4x10g-sfp-user-manual/product-spec-ocp-4x10g-sfp-user-manual.pdf)