# SBC3-IMX93

User’s Guide

![The image displays the NXP logo. It features the letters 'N,' 'X,' and 'P' arranged horizontally in an interlocking, ribbon-like design. The 'N' is colored yellow-orange, the middle section forming the 'X' is blue and green, and the 'P' is colored lime green.](.sbc3-imx93-50m-77a09-1010-11/898c4c0d81a6a17ad237c2aa6bdbf01337e73148737dabbefdb4ce71a28db916.jpg)

![Close-up of a printed circuit board with various electronic components and connectors (no readable text or symbols)](.sbc3-imx93-50m-77a09-1010-11/22165eb27306a51c36a7512f587c4f96a48f2a6af40708413421e89105a5884c.jpg)

Revision History

<table><tr><td>Revision</td><td>Description</td><td>Date</td><td>Author</td></tr><tr><td>1.0</td><td>Initial release</td><td>2025-01-10</td><td>AL</td></tr><tr><td>1.1</td><td>Specifications, block diagram pinout and signal descriptions, and onboard jumpers and switches updated</td><td>2025-11-25</td><td>AL</td></tr></table>

# Preface

# Disclaimer

Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product descriptions at any time, without notice.

# Environmental Responsibility

ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company. 区

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California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3- dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to www.P65Warnings.ca.gov.

# Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.

# Copyright © 2025 ADLINK Technology Incorporated

This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

# Safety Instructions

For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment before handling/operating the equipment.

Read these safety instructions carefully.

Keep this manual for future reference.
• Read the specifications section of this manual for detailed information on the operating environment of this equipment.
• Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
• To avoid electrical shock and/or damage to equipment:
Keep equipment away from water or liquid sources;
Keep equipment away from high heat or high humidity;
• Keep equipment properly ventilated (do not block or cover ventilation openings);
• Make sure to use recommended voltage and power source settings;
• Always install and operate equipment near an easily accessible electrical socket outlet;
• Secure the power cord (do not place any object on/over the power cord);
• Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
• If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

# Conventions

The following conventions may be used throughout this manual, denoting special levels of information.

![The image displays a small, low-resolution icon featuring a red outline of a document or piece of paper. The document has a folded bottom-right corner (a 'dog-ear'). Inside the outline, there are three horizontal red lines stacked vertically, resembling a list or menu icon. There is no text in the image.](.sbc3-imx93-50m-77a09-1010-11/be763b6efd2f5b6b70f53af74b6acad6a78b564fa1f634e1fd2c566f7c6294fc.jpg)

Note: This information adds clarity or specifics to text and illustrations.

![It is a yellow triangular warning sign containing a white exclamation point.](.sbc3-imx93-50m-77a09-1010-11/418af179cb67b14dca11080ccf26b00f70f85712379645f306a10135a23d6457.jpg)

Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.

![The image displays a standard warning symbol: a red equilateral triangle pointing upward with a white exclamation mark centered inside it.](.sbc3-imx93-50m-77a09-1010-11/7dd2b4f2e35ed587c0c7eb4652cc969e8505b9ad426cb662f60092ec17bb70a4.jpg)

Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

# Getting Services

Ask an Expert: https://www.adlinktech.com/en/Askanexpert

# ADLINK Technology, Inc.

No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan

Tel: +886-3-216-5088

Fax: +886-3-328-5706

Email: service@adlinktech.com

# Ampro ADLINK Technology, Inc.

6450 Via Del Oro, San Jose, CA 95119-1208, USA

Tel: +1-408-360-0200

Toll Free: +1-800-966-5200 (USA only)

Fax: +1-408-600-1189

Email: info@adlinktech.com

# ADLINK Technology (China) Co., Ltd.

300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China

Tel: +86-21-5132-8988

Fax: +86-21-5132-3588

Email: market@adlinktech.com

# ADLINK Technology GmbH

Hans-Thoma-Strasse 8-10, 68163 Mannheim, Germany

Tel: +49-621-43214-0

Fax: +49-621 43214-30

Email: emea@adlinktech.com

Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

# Table of Contents

Revision History....

Preface ..

List of Figures .. .. 9

1. Introduction ... ..10

1.1. The OSM Form Factor... ..10
1.2. Product Brief ... ..10

2. Specifications ....... 1

2.1. Board Specifications... .11
2.2. Module Interface.. ...12
2.3. Graphics and Video.. ...12
2.4. USB Interfaces...
2.5. Backlight Power .. ..12
2.6. LCD Power.. ..12
2.7. Networking .. ..12
2.8. Storage ... ..13
2.9. Camera Interface .. ...13
2.10. Audio... ..13
2.11. Communication . ..13
2.12. Power Supply ... ..13
2.13. Mechanical and Environmental. ..14

3. Block Diagram ............ ..15

4. Pinout and Signal Descriptions .... ...16

4.1. Pin Summary... ..16
4.2. Signal Terminology Descriptions... ..18
4.3. Signal Description by Function .. ..19
4.4. DSI ... ..19
4.5. HDMI ... ...19
4.6. LVDS .. ..19
4.7. MIPI CSI Camera.. ..20
4.8. Audio ... ..21
4.9. LAN Ports.. ...21
4.10. SDIO.. ..21

5. Pin Headers for Slow Speed Signals... ..22

5.1. GPIO Header (J6) .. ...22
5.2. I 2C ... ...23
5.3. SPI ... ...23
5.4. CAN bus .. ...24
5.5. UARTS .. ...24
5.6. PWM and ADC .. ...25
5.7. JTAG.. ...25

6. Onboard Jumpers and Switches . .27

6.1.1 Connector Specifications.. ..27
6.1.2 Boot Select Switches . ..27
6.1.3 LCD Panel and Backlight Voltage Settings .. ...28

# List of Figures

Figure 1 – Module function diagram... .15

Figure 2 –SBC3-IMX93 (Top).... ...16

Figure 3– SBC3-IMX93 (Bottom) .. ..17

# 1. Introduction

# 1.1. The OSM Form Factor

The OSM (“Open Standard Module”) Open Standard Module™ specification facilitates the development, production, and distribution of embedded modules tailored for renowned MCU32, ARM, and x86 architectures. This standard is increasingly relevant for IoT applications, as it merges the benefits of modular embedded computing with the growing demands for cost efficiency, compactness, and versatile interfaces.

The modules serve as building blocks for portable and stationary embedded systems. They integrate the core CPU and support circuits, including DRAM, boot flash, power sequencing, and CPU power supplies. The modules are used with application-specific carrier boards to implement features such as audio CODECs, touch controllers, wireless devices, PHY, and more. The modular design not only promotes scalability and fast time to market but also ensures upgradability, all while maintaining low costs, low power consumption, and a compact physical size.

![The image displays the uppercase letters 'S', 'G', and 'T' in a bold, bright yellow font. Superimposed over the bottom right portion of the 'G' and the bottom left portion of the 'T' is a lowercase letter 'e' in a magenta color.](.sbc3-imx93-50m-77a09-1010-11/862679a6bea7fd38d54a956c5c4fd463b0c11b8995f121dab3946bae74a38f3c.jpg)

STANDARDIZATION

GROUP FOR

EMBEDDED

TECHNOLOGIES

OSM module and carrier specifications are available online at: https://sget.org/standards/osm/

# 1.2. Product Brief

The SBC3-IMX93 is a 3.5-inch single-board computer designed for industrial applications that require extended temperature ranges and shock-resistant durability. Powered by the advanced i.MX93 microprocessor, it offers enhanced security features and high-performance Cortex-A55 cores.

# 2. Specifications

# 2.1. Board Specifications

# Form factor

3.5” form factor

# Power supply

Voltage range: from 15 to 30 VDC

# Graphics

HDMI over DSI to HDMI bridge (ADV7535)

LVDS single-channel

# USB

3 USB2.0 interfaces (2x type A, 1x microUSB)

# Communication

2 Gbe ethernet port with TI DP83867IR phy

# Slow-speed signals

4x PWM / 2x ADC on header (J50)

2x CAN header (JP5 & JP6)

2x I2C on header (J44)

2x SPI on header (J45)

14x GPIO on header (J6)

3x UART on header (J46)

# 2.2. Module Interface

1x LGA Footprint: Supports OSM LGA-type modules

# 2.3. Graphics and Video

HDMI Port: Routed through a DSI to HDMI bridge

LVDS Output: Single-channel LVDS to Hirose connector

# 2.4. USB Interfaces

3x USB ports:

• 1x OTG (On-The-Go)

• 2x Host USB 2.0

# 2.5. Backlight Power

Selectable 5V or 12V, switchable via jumper

# 2.6. LCD Power

3V, 5V, or 12V DC for LCD

# 2.7. Networking

LAN0 & LAN1: Connected to RJ45 connectors via a PHY.

# 2.8. Storage

microSD Slot: Connected to SDIO A.

# 2.9. Camera Interface

CSI Interface: Routed to a 22-pin CSI connector, with 2 lanes available.

# 2.10. Audio

TI TLV320AIC3106 Audio Codec: Connected to I2 S A

# 2.11. Communication

Dual CAN Interface: Equipped with CAN transceivers on the board for communication.

# 2.12. Power Supply

The board is powered by a Barrel type connector, accepting 15 to 30 VDC.

# 2.13. Mechanical and Environmental

# Form Factor solder down module

SGET OSM Specifications 1.1 Size L

# Carrier dimension

3.5” standard

# Operating temperature

Standard: 0°C to 60°C / -40°C to 85°C

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and vibration

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,

Condition A and Method 214A, Table 214-I, Condition D

# 3. Block Diagram

![The diagram centers on a large dark grey block labeled **Base 3.5** containing an orange box labeled **OSM-IMX93**.\n\n**Left Side Connections:**\n*   Two **RJ45** blocks connect via **PHY** blocks to **ETH_A** and **ETH_B**.\n*   A **MicroUSB** block connects to **USB_A**.\n*   A **USB Type A** block connects to **USB_B** and **USB_C**.\n*   A **LVDS 4L** block connects to **LVDS**.\n*   An **HDMI** block connects via a **DSI2HDMI** block to **DSI**.\n*   A **22 pin CSI** block connects to **CSI**.\n*   A **PWM ADC Header** block connects to **PWM** and **ADC**.\n*   A **MicroSD** block connects to **SDIO_A**.\n\n**Right Side Connections:**\n*   **Console** connects via a **USB to Uart** block to **USB type C**.\n*   **UART_A**, **UART_B**, and **UART_C** connect to a **UART header**.\n*   **CAN_A** connects via a **Transceiver** block to **CAN_A**.\n*   **CAN_B** connects via a **Transceiver** block to **CAN_B**.\n*   **SPI_A** and **SPI_B** connect to an **SPI Header**.\n*   **I2C_A** and **I2C_B** connect to an **I2C Header**.\n*   **GPIO_A** and **GPIO_B** connect to a **GPIO Header**.\n*   **I2S** connects via a **Codec** block to a **3.5MM jack**.](.sbc3-imx93-50m-77a09-1010-11/e31199cdbe9bb4c6fe3b717f8bd88dc8536fb0442a96780eea293a34c6b20897.jpg)

Figure 1 – Module function diagram

# 4. Pinout and Signal Descriptions

# 4.1. Pin Summary

![Recov. Reset Power J44 J45 CSI J50 J46 J6\nI2C SPI PWM/ADC UART GPIO\nRTC Bat.\nBAT1 J19\nBacklight\nJ20\nLVDS conn.\nJP6 CAN B\nJP6 CAN A\nJ36 JTAG\nAudio\nin/out\nHDMI OTG USB\nType A LAN A LAN B Power\nmSD\nConsole](.sbc3-imx93-50m-77a09-1010-11/ea563dc7f133f52c5c281ca8ddea45f508f244024b0a9bd12f90cf3ae363a4b9.jpg)

Figure 2 –SBC3-IMX93 (Top)

![N9300550ZAB7MOSM-R220-AD820\n51-77A09-0A10-A0\nMADE IN TAIWAN\nR4 2417\n94V-0\nCE FC UK](.sbc3-imx93-50m-77a09-1010-11/f40e1165ae3c6d8b711fa9e39151958736d15c455736f673382df02ebec780a0.jpg)

Figure 3– SBC3-IMX93 (Bottom)

# 4.2. Signal Terminology Descriptions

The following information provides descriptions of the terms used in the signal description table:

<table><tr><td>Term</td><td>Description</td></tr><tr><td>I</td><td>Input to the module</td></tr><tr><td>O</td><td>Output from the module</td></tr><tr><td>O OD</td><td>Open drain output from the module</td></tr><tr><td>I OD</td><td>Open drain input to the module, with mandatory PU (pull up) on module</td></tr><tr><td>OD</td><td>Open drain</td></tr><tr><td>I/O</td><td>Bi-directional Input/Output</td></tr><tr><td>PU</td><td>PU (pull-up) resistor on module</td></tr><tr><td>PD</td><td>PD (pull-down) resistor on module</td></tr><tr><td>VDD_IN</td><td>Main power source from carrier to module</td></tr><tr><td>CMOS</td><td>Logic input or output</td></tr><tr><td>GBE MDI</td><td>Differential analog signaling for Gigabit Media Dependent Interface</td></tr><tr><td>LVDS DP</td><td>Low Voltage Differential Signal for DisplayPort interface</td></tr><tr><td>LVDS D-PHY</td><td>Low Voltage Differential Signal for MIPI CSI-2 cameras and DSI displays</td></tr><tr><td>LVDS M-PHY</td><td>Low Voltage Differential Signal for MIPI CSI-3 cameras</td></tr><tr><td>LVDS LCD</td><td>Low Voltage Differential Signal for LCD displays</td></tr><tr><td>LVDS PCIE</td><td>Low Voltage Differential Signal for PCIe</td></tr><tr><td>LVDS SATA</td><td>Low Voltage Differential Signal for SATA</td></tr><tr><td>TMDS HDMI</td><td>Transition Minimized Differential Signal for HDMI displays</td></tr><tr><td>USB</td><td>DC coupled differential signaling for traditional (non-Superspeed) USB signals</td></tr><tr><td>USB SS</td><td>Differential signal for SuperSpeed USB signals</td></tr><tr><td>USB VBUS 5V</td><td>5V tolerant input for USB VBUS detection</td></tr><tr><td>3.3V</td><td>3.3V Power Domain: Active while CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high)</td></tr><tr><td>1.8V</td><td>1.8V Power Domain: Active while CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high)</td></tr><tr><td>3.3Vsb</td><td>3.3V Power Domain: Active while CARRIER_PWRON is high (regardless of CARRIER_SBY#)</td></tr><tr><td>1.8Vsb</td><td>1.8V Power Domain: Active while CARRIER_PWRON is high (regardless of CARRIER_SBY#)</td></tr></table>

# 4.3. Signal Description by Function

# 4.4. DSI

All DSI signals are sent to a DSI-to-HDMI bridge.

![The image displays a red icon on a white background, resembling a document or piece of paper with a folded top-right corner. Inside the red outline, there are two horizontal red lines stacked vertically in the center.](.sbc3-imx93-50m-77a09-1010-11/5735d96e8302fdfce855cd9d85c751a89068512d023593329be1f659e0b57748.jpg)

Note: DSI is routed to the ADV7535 and output to the HDMI connector.

# 4.5. HDMI

The connector is located on the carrier, with a maximum resolution of up to 1080p.

![The image displays a logo featuring the lowercase text 'ae'. The red letters are positioned side-by-side inside two white squares. These squares are set against a red square background with rounded corners.](.sbc3-imx93-50m-77a09-1010-11/0ee592aa4a7faab7c3f9ac50f977ba6bde617d7fc7d668e7cbf0f03cccf69feb.jpg)

Note: HDMI is derived from DSI signals over the ADV7535/WLCSP-49, with support provided in the Yocto standard.

# 4.6. LVDS

The connector is placed on the carrier: Hirose DF13E-30DP

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>VDD</td><td>2</td><td>VDD</td></tr><tr><td>3</td><td>LVDS_A0_P</td><td>4</td><td>LVDS_A0_N</td></tr><tr><td>5</td><td>LVDS_A1_P</td><td>6</td><td>LVDS_A1_N</td></tr><tr><td>7</td><td>LVDS_A2_P</td><td>8</td><td>LVDS_A2_N</td></tr><tr><td>9</td><td>LVDS_A3_P</td><td>10</td><td>LVDS_A3_N</td></tr><tr><td>11</td><td>LVDSA_CLKP</td><td>12</td><td>LVDSA_CLKN</td></tr><tr><td>13</td><td>LVDS_CTRL_CLK</td><td>14</td><td>LVDS_CTRL_DAT</td></tr></table>

J14: Backlight connector

<table><tr><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>ENABLE</td></tr><tr><td>2</td><td>GND</td></tr><tr><td>3</td><td>12V_carrier</td></tr><tr><td>4</td><td>Backlight Control</td></tr><tr><td>5</td><td>5V_carrier</td></tr></table>

<table><tr><td>15</td><td>GND</td><td>16</td><td>GND</td></tr><tr><td>17</td><td>N/A</td><td>18</td><td>N/A</td></tr><tr><td>19</td><td>N/A</td><td>20</td><td>N/A</td></tr><tr><td>21</td><td>N/A</td><td>22</td><td>N/A</td></tr><tr><td>23</td><td>N/A</td><td>24</td><td>N/A</td></tr><tr><td>25</td><td>N/A</td><td>26</td><td>N/A</td></tr><tr><td>27</td><td>GND</td><td>28</td><td>GND</td></tr><tr><td>29</td><td>GND</td><td>30</td><td>GND</td></tr></table>

# 4.7. MIPI CSI Camera

22-pin CSI connector (RPI-compatible pinout)

<table><tr><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>GND</td></tr><tr><td>2</td><td>CSI_DATA0_N_R</td></tr><tr><td>3</td><td>CSI_DATA0_P_R</td></tr><tr><td>4</td><td>GND</td></tr><tr><td>5</td><td>CSI_DATA1_N_R</td></tr><tr><td>6</td><td>CSI_DATA1_P_R</td></tr><tr><td>7</td><td>GND</td></tr><tr><td>8</td><td>CSI_CLOCK_N_R</td></tr><tr><td>9</td><td>CSI_CLOCK_P_R</td></tr><tr><td>10</td><td>GND</td></tr><tr><td>11</td><td>NI</td></tr><tr><td>12</td><td>NI</td></tr><tr><td>13</td><td>GND</td></tr><tr><td>14</td><td>NI</td></tr><tr><td>15</td><td>NI</td></tr><tr><td>16</td><td>GND</td></tr><tr><td>17</td><td>CAM_ENABLE</td></tr><tr><td>18</td><td>CAM_PWR_LED</td></tr><tr><td>19</td><td>GND</td></tr><tr><td>20</td><td>CSI_I2C_SCL_3V3</td></tr><tr><td>21</td><td>CSI_I2C_SDA_3V3</td></tr><tr><td>22</td><td>3V3_carrier</td></tr></table>

# 4.8. Audio

Connector located on carrier, standard 3.5 mm audio jack with mic

![The image displays a red icon on a white background. It depicts the outline of a document or piece of paper with a folded corner (dog-ear) at the top right. Inside the outline are two horizontal red lines.](.sbc3-imx93-50m-77a09-1010-11/90c46e84964c33d7627726f2f37f53d0e341d53b6b5603f15d5e98a49ec3e860.jpg)

Note: CTIA pinout order

# 4.9. LAN Ports

2x RJ45 connectors for wired network interfaces

The network interfaces come from the SoC over 2 TI DP83867IR phy

# 4.10. SDIO

One MicroSD card-slot is located on the carrier, acting as device storage or boot media.

# 5. Pin Headers for Slow Speed Signals

# 5.1. GPIO Header (J6)

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>1V8_carrier</td><td>2</td><td>GND</td></tr><tr><td>3</td><td>GPIO_A_0</td><td>4</td><td>GPIO_B_0</td></tr><tr><td>5</td><td>GPIO_A_1</td><td>6</td><td>GPIO_B_1</td></tr><tr><td>7</td><td>GPIO_A_2</td><td>8</td><td>GPIO_B_2</td></tr><tr><td>9</td><td>GPIO_A_3</td><td>10</td><td>GPIO_B_3</td></tr><tr><td>11</td><td>GPIO_A_4</td><td>12</td><td>GPIO_B_4</td></tr><tr><td>13</td><td>GPIO_A_5</td><td>14</td><td>GPIO_B_5</td></tr><tr><td>15</td><td>N/A</td><td>16</td><td>GPIO_B_6</td></tr><tr><td>17</td><td>N/A</td><td>18</td><td>GPIO_B_7</td></tr><tr><td>19</td><td>GND</td><td>20</td><td>1V8_carrier</td></tr></table>

![A red outline icon depicting a document or piece of paper with a folded bottom-right corner, inside of which are two horizontal lines resembling an equals sign.](.sbc3-imx93-50m-77a09-1010-11/0252b3912acc24f39564fe4a3d60cda8c6b29557eb25993d61798d4de890173a.jpg)
Note: GPIO’s 4,5,6, and 7 are reserved for board functions.

# 5.2. I2 C

All I2C busses are located on header J44

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>3V3_carrier</td><td>2</td><td>GND</td></tr><tr><td>3</td><td>I2C_A_SCL_3V3</td><td>4</td><td>I2C_B_SCL_3V3</td></tr><tr><td>5</td><td>I2C_A_SDA_3V3</td><td>6</td><td>I2C_B_SDA_3V3</td></tr></table>

# 5.3. SPI

All SPI busses are located on header J45

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>SPI_A_SDI_IO0</td><td>2</td><td>SPI_B_SDI</td></tr><tr><td>3</td><td>SPI_A_SDO_IO1</td><td>4</td><td>SPI_B_SDO</td></tr><tr><td>5</td><td>SPI_A_CS0#</td><td>6</td><td>SPI_B_CS0#</td></tr><tr><td>7</td><td>SPI_A_CS1#</td><td>8</td><td>SPI_B_CS1#</td></tr><tr><td>9</td><td>SPI_A_SCK</td><td>10</td><td>SPI_B_SCK</td></tr><tr><td>11</td><td>VCC_OUT_IO</td><td>12</td><td>GND</td></tr></table>

![The image displays a digital icon resembling a document or memo pad. It features a thick red outline forming a square shape with a folded-over top-right corner. Inside the white background, two horizontal red bars are centered, representing lines of text.](.sbc3-imx93-50m-77a09-1010-11/65a7cd46623630649d3744351eab59c9d3e4ebafa10036434865778452c969a4.jpg)

Note: During boot, SPI\_A\_SCK and SPI\_A\_CS0# must be kept low.

# 5.4. CAN bus

CAN buses located on header JP5 & JP6, and the transceiver is already inline

JP5

<table><tr><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>CAN_A_H_C</td></tr><tr><td>2</td><td>CAN_A_L_C</td></tr><tr><td>3</td><td>GND</td></tr></table>

JP6

<table><tr><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>CAN_B_H_C</td></tr><tr><td>2</td><td>CAN_B_L_C</td></tr><tr><td>3</td><td>GND</td></tr></table>

# 5.5. UARTS

All available UARTs are located on header J46

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>UART_A_TX</td><td>2</td><td>UART_A_RX</td></tr><tr><td>3</td><td>UART_A_RTS#</td><td>4</td><td>UART_A_CTS#</td></tr><tr><td>5</td><td>UART_B_TX</td><td>6</td><td>UART_B_RX</td></tr><tr><td>7</td><td>UART_B_RTS#</td><td>8</td><td>UART_B_CTS#</td></tr><tr><td>9</td><td>UART_C_TX</td><td>10</td><td>UART_C_RX</td></tr><tr><td>11</td><td>1V8_carrier</td><td>12</td><td>GND</td></tr><tr><td>13</td><td>3V3_carrier</td><td>14</td><td>5V_carrier</td></tr></table>

![The image displays a red icon resembling a document or piece of paper. It features a square outline with the top right corner folded down (a 'dog-ear'). Inside the square, there are two horizontal red lines centered vertically.](.sbc3-imx93-50m-77a09-1010-11/4800f163d9efbdb74feb8123fbcabc85072cf9e42c29844de5e2d495036d9bec.jpg)

Note: The console is directly available via a Type-C connector located on the board, with no need for adapters.

# 5.6. PWM and ADC

PWM and ADC share J50 header

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>ADC_0</td><td>2</td><td>GND</td></tr><tr><td>3</td><td>ADC_1</td><td>4</td><td>GND</td></tr><tr><td>5</td><td>PWM_0</td><td>6</td><td>PWM_1</td></tr><tr><td>7</td><td>PWM_2</td><td>8</td><td>PWM_3</td></tr></table>

# 5.7. JTAG

JTAG signals are located on header J36 and JP7

<table><tr><td>Pin</td><td>Description</td><td>Pin</td><td>Description</td></tr><tr><td>1</td><td>1V8_carrier</td><td>2</td><td>JTAG_TMS</td></tr><tr><td>3</td><td>GND</td><td>4</td><td>JTAG_TCK</td></tr><tr><td>5</td><td>GND</td><td>6</td><td>JTAG_TDO</td></tr><tr><td>7</td><td>JTAG_RTCK</td><td>8</td><td>JTAG_TDI</td></tr><tr><td>9</td><td>GND</td><td>10</td><td>SYS_RST#</td></tr></table>

<table><tr><td>JP7 PIN</td><td>Description</td></tr><tr><td>1</td><td>JTAG_nTRST</td></tr><tr><td>2</td><td>JTAG_DEBUG_EN</td></tr></table>

# 6. Onboard Jumpers and Switches

# 6.1.1 Connector Specifications

# List of connectors and counterparts:

• DC Jack: 2.5mm
• LVDS Connector: 15P x 2, P=1.25mm wafer (DF13E-30DP-1.25V(52), Hirose)
Backlight Connector: 5P, 2mm pitch
• MIPI-CSI: FPC, 22P, 0.5mm pitch (identical to Raspberry Pi)

# Header Pinouts:

All headers are 2.0mm pitch, except for the ADC/PWM header, which uses 2.54mm pitch.

• J6: GPIO Header – 10P x 2, P=2.0mm
• J19: LCD Backlight Voltage Select – 3P x 2, P=2.0mm
• J44: I2C Header – 3P x 2, P=2.0mm
• J45: SPI Header – 6P x 2, P=2.0mm
• J45: UART Header – 7P x 2, P=2.0mm
• JP5/6: CAN Header – 3P x 1, P=2.0mm
• J50: ADC and PWM Header – 4P x 2, P=2.54mm

# 6.1.2 Boot Select Switches

The i.MX93 can boot from different media; therefore, different boot media can be enabled via switch combinations:

eMMC on-module storage
• SDIO SD Card located on the carrier
• Serial boot mode, used with Universal Update Utility (UUU) to provision the board

 SW7 and SW8 are used to select the boot media, with SW8 also used for SD card detection.

![SN4T774\n29KG4\nCJ70\nSW7.SW8 BOOT SEL\nON ON :A55 Internal Fuse\nON OFF :eMMC\nOFF ON :Serial Dwnloader\nOFF OFF :uSD\nSW6 CD DET.\nON :SD FIXED\nOFF :SD AUTO](.sbc3-imx93-50m-77a09-1010-11/93682af86e77ebd8e0d253da27a40ed13d5b007b59e1abebbb9bb5484727bdbe.jpg)

# 6.1.3 LCD Panel and Backlight Voltage Settings

The J19/J20 pinouts are labeled as shown below:

The LCD backlight enable signal provides 5V/12V options via J19

![J19\n5 3 1\n6 4 2](.sbc3-imx93-50m-77a09-1010-11/30f564f9f82677601d482a41a485ae6b871708a0e6eb5fbf260615e876d38226.jpg)

The LCD panel power offers a selection of 3/5/12 VDC via J20

![2 4 6\n1 3 5\nJ20](.sbc3-imx93-50m-77a09-1010-11/220c5117b9cfba322cab438f927160d0abf80d9e43a1a5a8fb0a68db169a4ea0.jpg)
[🔗 Link to the original document](.sbc3-imx93-50m-77a09-1010-11/sbc3-imx93-50m-77a09-1010-11.pdf)