## Slide 1

![The slide features a close-up image of computer hardware components, likely a motherboard and cooling fan, serving as a background.  **Top Right:** The ADLINK logo is displayed with the tagline 'LEADING EDGE AI COMPUTING'.  **Center:** Large, cyan text reads: 'Trusted Partner in AI Computing Module'.  **Bottom Row (Logos):** A series of logos representing module standards are listed from left to right: *   COM-HPC™ *   COM Express (with a green cross symbol) *   SMARC module (with a green and yellow square logo) *   OPEN STANDARD MODULE™ (with a logo resembling stacked cards) *   SEVEN (with a lightning bolt icon) *   ETX®](.com-presentation-2026-q2-v5-28/slide-001.jpg)

## Slide 2

![This slide features the headline '30 Years of Experience in Embedded Open Standards' set against a blue circuit board background. The top right corner displays the logo 'ADLINK' with the tagline 'LEADING EDGE AI COMPUTING'.  The lower section shows two men in a split-screen layout: - On the left is Jeff Munch, identified as 'CTO, ADLINK', positioned next to the blue hexagonal 'PICMG' logo. - On the right is Henk Van Bremen, identified as 'VP Technology & Development, ADLINK', positioned below the 'SGeT' logo.  Along the very bottom edge, the word 'Member' is repeated four times.](.com-presentation-2026-q2-v5-28/slide-002.jpg)

## Slide 3

![The slide features a blue background with a circuit board pattern and four hands placing white puzzle pieces in a cross formation.  **Top Right Logo:** ADLINK LEADING EDGE AI COMPUTING  **Left Side Main Text:** Your Trusted Partner in COM Innovation  **Top Left Text Block:** From Modules to Complete Solutions, carrier design, system integration, DMS, manufacturing, and lifecycle support  **Top Right Text Block:** Tier-1 Customer Proof Records An unrivaled portfolio of Tier-1 customers across the global embedded industry.  **Bottom Right Text Block:** Localized Support Support model with dedicated regional teams in the US, EMEA, AP and China to ensure local expertise with global standards.  **Bottom Center Text Block:** Technology Leadership long-term participant and contributor in open standards and platform development](.com-presentation-2026-q2-v5-28/slide-003.jpg)

## Slide 4

![ADLINK LEADING EDGE AI COMPUTING  Full Project Lifecycle Coverage No more uncertainty from development to production  Engineering Risk Production & Quality Supply Chain Availability  Proposal Design Verification Integration Production Lifecycle Support  Deliver project proposal Schematic review & design document Troubleshooting & risk management Custom software & thermal solution Assured product quality & delivery Longevity & sustaining](.com-presentation-2026-q2-v5-28/slide-004.jpg)

## Slide 5

![This slide showcases ADLINK's capabilities with the central headline: **'It All Starts with the Right Computer on Module'**. Inside the central blue circle are logos for **'COM-HPC'**, **'COM Express'**, **'SMARC'**, **'OPEN STANDARD MODULE'**, **'SEVEN'**, and **'ETX®'**.  Surrounding the center are three hexagonal sections detailing services:  *   **Carrier Board Design Services** (top left): **'Local project management teams in your market'**. *   **Manufacturing Service** (bottom left): **'ADLINK’s manufacturing service offers consolidated supply chain solutions with component risk monitoring, long-life cycle management, and global support.'** *   **One-stop Shop** (right): **'We solve LCD, storage, and other integration challenges through component services.'** This section includes labels for **'Industrial Solid State Drives'**, **'NVIDIA'**, **'MXM'**, and **'AUO industrial panels'**.  The bottom of the slide features the large text: **'Carrier Design and Production Services'**. The top right corner displays the **ADLINK** logo and the tagline **'LEADING EDGE AI COMPUTING'**.](.com-presentation-2026-q2-v5-28/slide-005.jpg)

## Slide 6

![This slide features a dark blue background dominated by a central, futuristic graphic. The graphic shows a glowing ring structure emitting streams of blue and purple light particles in all directions. Inside the central dark circle is the large, stylized text 'AI' outlined in glowing blue. To the right of this graphic, the text reads 'AI ON' in light blue, with 'MODULES' in white directly below it. In the top right corner, the ADLINK logo is displayed with the tagline 'LEADING EDGE AI COMPUTING' underneath it.](.com-presentation-2026-q2-v5-28/slide-006.jpg)

## Slide 7

![The slide is titled '**AI COM Leader with Full Spectrum Dominance**' at the top left, with the **ADLINK** logo and tagline '**LEADING EDGE AI COMPUTING**' at the top right.  The main graphic is a chart illustrating a spectrum of computing modules, organized by performance on the vertical axis (labeled '**Performance**') and form factor categories across the horizontal axis.  From left to right, the categories and associated text are:  1.  **CO OPEN STANDARD MODULE**, **SMARC module**, and **C7** (with a lightning bolt logo).     *   Below these are module images and brand logos: '**arm**', '**intel**'.     *   The bottom bar lists power ranges: '**5 ~ 25W**', '**5 ~ 15W**', '**5 ~ 15W**'.  2.  **COM Express**.     *   Sub-categories labeled: '**Mini**', '**Compact**', '**Basic**'.     *   Below are module images and brand logos: '**intel**', '**AMD**'.     *   The bottom bar lists the power range: '**10 ~ 85W**'.  3.  **COM+HPC**.     *   Sub-categories labeled: '**Mini**', '**Client**'.     *   Below are module images and brand logos: '**intel**', '**AMD**'.     *   The bottom bar lists the power range: '**15 ~ 100W**'.  4.  **Server**.     *   Below are larger module images.     *   Brand logos: '**intel**', '**arm**'.     *   The bottom bar lists the power range: '**up to 200W**'.](.com-presentation-2026-q2-v5-28/slide-007.jpg)

## Slide 8

![This slide features the title 'Our Partnerships – Powering Your Success' centered at the top, under the ADLINK logo in the upper right corner which includes the tagline 'LEADING EDGE AI COMPUTING.'  The slide displays a grid of partnership logos and titles organized into three rows:  **Top Row:** *   **intel**: Prestige Partner *   **NVIDIA**: Preferred Partner of Jetson Platform *   **AUO**: Strategic Partner *   **NXP**: Gold Partner *   **MEDIATEK**: Powered by Mediatek Genio Partner  **Middle Row:** *   **AMD**: Embedded Partner *   **AMPERE**: Technology Partner *   **arm**: Hardware & Design Partner *   **Qualcomm**: Member of the Qualcomm® Advantage Network  **Bottom Row:** *   **Microsoft Azure Certified**: Azure Certified for IoT Partner *   **Canonical**: Ubuntu Linux OS Partner *   **WNDRV**: OS Partner *   **ami**: BIOS Partner](.com-presentation-2026-q2-v5-28/slide-008.jpg)

## Slide 9

![The slide features the PICMG and COM+HPC™ logos in the top left and the ADLINK logo with the tagline 'LEADING EDGE AI COMPUTING' in the top right. It displays three circuit boards of varying sizes alongside a diagram in the bottom left listing dimensions: E 200x160, C 160x120, A 120x95, Mini 95x70, B 120x120, and D 160x160.  The right side lists four numbered points: 1. Open standard for high-performance embedded computing 2. Delivers server-class bandwidth, power, and performance 3. Multiple sizes and configurations available 4. Typical Applications     - High-end IoT     - Edge server applications     - PCIe Gen5 and beyond requirements  A QR code is in the bottom right corner labeled 'Download Design Guide'.](.com-presentation-2026-q2-v5-28/slide-009.jpg)

## Slide 10

![The slide contains the following text verbatim:  **Top Left:** PICMG COM Express  **Top Right:** ADLINK LEADING EDGE AI COMPUTING  **Bottom Left (Form Factor Diagram):** Compact 95x95 Basic 95x125 Mini 55x84  **Right Side (Numbered Points):** 1 Most successful Computer-on-Module (COM) standard in today's embedded market  2 Mezzanine architecture: • Off-the-shelf module • Dual 220-pin board-to-board connectors • Plugs into application-specific carrier board  3 Typical Applications: • Medical • Test and Measurement • Industrial & Robotics • Data Communication • Transportation  **Bottom Right (Under QR Code):** Download Design Guide](.com-presentation-2026-q2-v5-28/slide-010.jpg)

## Slide 11

![This slide features logos for **SGe**, **SMARC module**, and **ADLINK LEADING EDGE AI COMPUTING**.  On the left, an image displays a blue circuit board module and a carrier board with a heatsink. A size comparison box lists: **Large** 80x82 **Small** 50x82  On the right, a numbered list details the standard: **1** Stands for Smart Mobility Architecture **2** Small form factor COM standard **3** Designed for • Low power • Low cost • High performance **4** Typically Applications • Industrial Control • Handheld Battery Powered Devices • Medical Equipment  In the bottom right corner is a QR code labeled **Download Design Guide**.](.com-presentation-2026-q2-v5-28/slide-011.jpg)

## Slide 12

![The slide contains the following text:  **Logos and Headers** *   SGe *   OPEN STANDARD MODULE™ *   ADLINK *   LEADING EDGE AI COMPUTING  **Numbered List** 1.  Open Standard for solderable BGA mini modules 2.  Highest Cost Efficiency at Volume 3.  Key Advantages     *   Exceptional Ruggedness     *   Machine processible carrier assembly     *   Super dense stack module + carrier 4.  Typically Applications     *   Industrial IoT & Edge Devices     *   Smart Retail & Vending Machines     *   Robotics & Automation     *   UAV & Drones  **Product and Size Chart** *   OSM IMX93 *   M 30x45 *   L 45x45 *   S 30x30 *   0 30x15  **Footer** *   Download Design Kit](.com-presentation-2026-q2-v5-28/slide-012.jpg)

## Slide 13

![**Title:** Real-World Impact Across Vertical Market  **Logo:** ADLINK LEADING EDGE AI COMPUTING  **Categories and Examples:**  *   **Physical AI:** Humanoid robotics, robotics *   **Gaming:** Slot machine *   **Extreme Rugged:** Railway, drone, UxV, in-vehicle system *   **Retail:** Self-check machine, coffee machine, fare box *   **Healthcare:** Ultra sound machine, Robotic surgery *   **Automation & Testing:** Semicon back-end tester, CNC/panel control *   **Smart City:** Intelligent transportation system, building HVAC](.com-presentation-2026-q2-v5-28/slide-013.jpg)

## Slide 14

![**Header:** Application Humanoid Robotics  **Challenge:** *   AI capable Computing power for the 'Brain' (cognitive decision - making) *   'Joints' mechanical management for 'Cerebellum' (real time motion control)  **Solution:** *   Intel Core i7 based COM-HPC Client module for the 'Brain' *   Intel Atom based SMARC module to control the 'Joints'  **Product Line (Bottom Left):** *   Product Line *   COM-HPC-cRLS *   COM-HPC *   intel. *   LEC-ASL *   SMARC module  **Logo (Top Right):** ADLINK LEADING EDGE AI COMPUTING](.com-presentation-2026-q2-v5-28/slide-014.jpg)

## Slide 15

![The slide is titled **'Application Transportation Rugged Server'** and features a background image of a moving train on the right.  **Challenge:** *   'Combine multiple services such as ticketing, public Wi-Fi, public address and surveyance into one compact system' *   'Fanless design with environmental temperatures up 65 Celsius' *   'Shock and vibration resistant design'  **Solution:** *   'Low Power Intel Core i7 based compact COM Express type 6' *   'Low Power Intel Ice Lake D Xeon based COM Express type 7'  **Product Line:** *   'Express-RPL' *   'COM Express' / 'intel.' *   'Express-ID7'  **Header:** 'ADLINK LEADING EDGE AI COMPUTING'](.com-presentation-2026-q2-v5-28/slide-015.jpg)

## Slide 16

![**Slide Title/Header:** Application Medical Ultrasound  **Challenge:** *   Best performance per Watt for smallest system package *   Reduce total cost of ownership through modularization *   Assure longevity and simple upgrading  **Solution:** *   Proven track record in rugged markets *   Fast boot capability: 15 seconds (BIOS fine-tuning) *   Remote management option IPMB  **Product Line (Bottom Left Section):** *   Vertical Label: Product Line *   Logos/Labels: COM Express, COM HPC, intel, AMD *   Product Names: cExpress-MTL, COM-HPC-mMTL  **Logo (Top Right):** ADLINK LEADING EDGE AI COMPUTING](.com-presentation-2026-q2-v5-28/slide-016.jpg)

## Slide 17

![ADLINK LEADING EDGE AI COMPUTING  Application Professional Drone Controller  Challenge: • Build a professional ground control station for the UAV that can withstand extreme environments • Support high-end features such as multiple UAV control • Support for large display panels and long battery life, Android based  Solution: • Use SMARC based LEC-MTK1200 as core development supporting Android out of the box • Additional software services to process multiple camera streams • Extreme rugged -40°C to 85°C ambient  Product Line LEC-MTK1200 SMARC module MEDIATEK Android](.com-presentation-2026-q2-v5-28/slide-017.jpg)

## Slide 18

![The slide presents a case study for an **Application: Smart Coffee Machine** by **ADLINK LEADING EDGE AI COMPUTING**.  **Challenge:** *   Balanced space limitations, power-saving AI options, and strict cost targets *   Rapid development to remain competitive  **Solution:** *   Delivering compact, AI-capable, energy-efficient system *   Reduced cost, simplified certification *   Accelerated time-to-market  **Product Line:** Displays two modules, **OSM-MTK510** and **OSM-MTK520**, alongside logos for **OPEN STANDARD MODULE™** and **MEDIATEK**.  The right side of the slide features a photograph of a black Smart Coffee Machine brewing espresso into a glass cup, with black mugs nearby.](.com-presentation-2026-q2-v5-28/slide-018.jpg)

## Slide 19

![**Header** *   I-Pi 3-3-3 I-Pi For Rapid PoC *   ADLINK *   LEADING EDGE AI COMPUTING  **Left Column** *   Get Your Product in 3 Days *   Complete Installation in 3 Hours *   POC Ready in 3 Days  **Website Screenshot** *   I-Pi PRODUCT DOCS+ DOWNLOAD FORUM BLOG PARTNER BUY ONLINE English *   Available Now - Worldwide Shipping *   SMARC *   I-Pi SMARC IMX8M Plus *   \$320 *   Specifications Wi-Fi *   EU(lead time: 1 week) With Wi-Fi *   Quantity 1 *   ADD TO CART  **Bottom Section** *   I-Pi BUY ONLINE *   COM HPC *   Development Kit *   COM EXPRESS TYPE 7 *   REV.3.1](.com-presentation-2026-q2-v5-28/slide-019.jpg)

## Slide 20

![This slide features a blue-tinted background image of a computer motherboard. In the top right corner is the **ADLINK** logo with the tagline **LEADING EDGE AI COMPUTING**.  Large text in the upper left reads **THANK YOU**, with 'THANK' in cyan and 'YOU' in white.  Below the main text are two QR codes side-by-side: *   Above the left QR code: **Learn More** *   Above the right QR code: **Get a Starter Kit**  Along the bottom edge is a row of logos reading (from left to right): *   **COM+HPC™** (with a green plus sign) *   **COM Express** (with a green star) *   **SMARC module** (with a green square logo) *   **OPEN STANDARD MODULE™** (with a module icon) *   **SEVEN** (with a green lightning bolt and square icon) *   **ETX®**](.com-presentation-2026-q2-v5-28/slide-020.jpg)

[🔗 Link to the original document](.com-presentation-2026-q2-v5-28/com-presentation-2026-q2-v5-28.pptx)