## Slide 1

![The slide features the **ADLINK** logo with the tagline '**LEADING EDGE COMPUTING**' in the top right corner.\n\nOn the left side, a large red panel displays the title '**Edge Computing Platform**' in white text, followed by '**2026 Q2**' underneath. A grey bar at the bottom left contains the text '**ECP SBU**'.\n\nThe right side of the slide shows a blue-tinted cityscape background with white, glowing icons (such as clouds, phones, and location pins) connected by radiating lines to a central Wi-Fi symbol.](.ecp-introduction-2026q2/slide-001.jpg)

## Slide 2

![**ADLINK**\n**| Agenda**\n\n**01 Mother Boards | Embedded SBCs | IPC Systems**\nIndustrial Grade, Advanced Performance, and High Flexibility\n\n**02 Matrix Embedded Computers**\nEnable Data-driven Decision Making,\nImprove Efficiency/Productivity across Industries\n\n**03 DLAP | ROScube Series**\nPowering AI in Edge with Industrial\nEnvironmental Compliance for 24/7\nOperation\n\n**04 ASD+ SSD Series**\nOptimized for Data-Heavy and Rugged\nEnvironments](.ecp-introduction-2026q2/slide-002.jpg)

## Slide 3

![This slide is titled **'Overview'** with the main heading **'Evolving with Edge AI Computing'** and the subtitle **'The Ultimate Blend of Performance and Efficiency'**. The top right corner features the logo for **ADLINK LEADING EDGE COMPUTING**.\n\nThe slide is divided into three main sections:\n\n**1. Left Sidebar (Applications):**\nThree vertical images depict application areas:\n*   **'Smart Factory'** (top) shows industrial machinery.\n*   **'Smart City'** (middle) shows a car dashboard with digital overlays.\n*   **'5G Network'** (bottom) shows a city skyline with network icons.\n\n**2. Central Diagram (Hardware Ecosystem):**\nA large circular graphic displays various hardware products categorized by type:\n*   **Center (Red Circle):** Labeled **'Industrial Computers'**, showing various motherboards and chassis.\n*   **Outer Ring (Grey Area):** Surrounding hardware categories include:\n    *   **'Configuration Platforms'**\n    *   **'Embedded Computers'**\n    *   **'IoT Gateways'** (shown with antennas)\n    *   **'Robotics Controllers'**\n    *   **'Edge AI Platforms'**\n\n**3. Bottom Row (Services & Components):**\nBelow the diagram is a row detailing services and components under the **'EdgeGO )'** logo:\n*   **'Remote Device Management'**\n*   **'Complete AI Modules Support'**\n*   **'Configuration to Order Services'**\n*   **'Function Modules Design'**\n*   **'SSD, Wireless Modules'**](.ecp-introduction-2026q2/slide-003.jpg)

## Slide 4

![**High-Density Core**\nExtremely high-performance multi-stream computing\n• 24 Cores • 128GB DDR5 RAM\n• 36MB SmartCache\n\n**Remote Edge Management**\nSystem control, monitoring and OTA software updates\nEdgeIO Device Management Software\n\n**Reliable and Trusted**\nRugged design to ensure system stability in harsh environments\n20°C to 60°C (-40 ~ 140 °F) operating temp.\n• Rugged SODIMM\n• Anti-vibration: 5 Grm\n\n**Advanced Security**\nHighly integrated data encryption and security features\n• Boot Guard • TPM 2.0\n• Secure Boot • Intel® TME, SGX and TXT\n\n**High Bandwidth RF Connectivity**\nSuper-speed data throughput with low-latency transmission\nGlobal Certification Capabilities\n• WWAN 4G & 5G connections • WLAN 802.11ax\n\n**Compact Form Factor**\nFast integration, better scalability and easy maintenance\n• 3.5” SBC • Embedded Computer\n• Industrial motherboard\n\n**ADLINK's Featured Technology**](.ecp-introduction-2026q2/slide-004.jpg)

## Slide 5

![**Global Certification Capabilities**\n\n**Spread across nearly 50 countries worldwide**\n\n**ADLINK RF Capabilities**\n*   WLAN, 4G/LTE, 5G built-in with global certifications.\n*   WiFi 6E, IPv6 new standards support.\n*   Dual-SIM connectivity redundancy.\n\n**Americas**\n*   BRAZIL | ANATEL\n*   CANADA | ISED\n*   CHILE | SUBTEL\n*   COLOMBIA | CRC - LoNA\n*   MEXICO | IFETEL\n*   PERU | MTC\n*   PUERTO RICO\n*   UNITED STATES OF AMERICA (THE) | FCC - Certification\n\n**Asia**\n*   AUSTRALIA | ACMA,RSM,ERAC - RCM\n*   NEW ZEALAND\n*   CHINA | MIIT - NAL/SRRC\n*   HONG KONG | OFCA\n*   INDIA | WPC (TA Self-Declaration)\n*   INDONESIA | SDPPI\n*   JAPAN | MIC\n*   KOREA, REPUBLIC OF (SOUTH KOREA) | MSIT/NRRA\n*   MALAYSIA | MCMC\n*   PHILIPPINES | NTC\n*   SINGAPORE | IMDA\n*   TAIWAN | NCC - Cert\n*   THAILAND | NBTC\n*   VIET NAM | MIC\n\n**Europe**\n*   AUSTRIA\n*   BELGIUM\n*   CZECHIA\n*   DENMARK\n*   FINLAND\n*   FRANCE\n*   GERMANY\n*   GREECE | EUROPEAN UNION - EU DoC\n*   IRELAND | EN 301489-1-17\n*   ITALY | EN 300328\n*   LUXEMBOURG | EN 301893\n*   NETHERLANDS\n*   NORWAY\n*   POLAND\n*   SLOVAKIA\n*   SPAIN\n*   SWEDEN\n*   SWITZERLAND\n*   TURKEY\n*   ISRAEL | MoC/Import Permit\n*   MOROCCO | ARNT\n*   RUSSIAN FEDERATION | MITC\n*   SAUDI ARABIA | CITC\n*   SOUTH AFRICA | ICASA\n*   UNITED ARAB EMIRATES | TRA\n*   UNITED KINGDOM OF GREAT BRITAIN AND NORTHERN IRELAND | UK DoC](.ecp-introduction-2026q2/slide-005.jpg)

## Slide 6

![**Title:** Define Your Edge AI Scale\n\n**Categories and Use Cases:**\n*   **Light-Weight AI:** City Vehicle Monitoring, Retail Crowd Tracking\n*   **Medium AI:** Manufacturing Scratch Detection, Logistics AMR\n*   **Heavy AI:** Humanoid & Legged Robotics, Large-Scale LLM Inference\n\n**Performance Scale:**\n*   (40 TOPS\n*   40-300\n*   300-1500\n*   1500-5000+ TFLOPS\n\n**Hardware Specifications and Models:**\n*   10 TOPS SOC MXA-312M\n*   20-40 TOPS SOC DLAP-211-Orin\n*   40 TOPS SOC MXE-330\n*   275 TOPS SOC DLAP-411-Orin\n*   310 TOPS MXM DLAP-5200\n*   1457 TFLOPS PEG DLAP-8100\n*   2070 TFLOPS SOC DLAP-701\n*   3000+ TFLOPS PEG AXE Series\n\n**Footer:** 10](.ecp-introduction-2026q2/slide-006.jpg)

## Slide 7

![**Slide Title:** Next-Generation AI IPC Comprehensive GPU Solution\n\n**Section 1: PEG Card Support**\nThis section displays a row of hardware components (computer chassis and motherboards) with the following labels:\n*   **MVP-6200** (*Support limited to short cards)\n*   **DLAP-4100**\n*   **DLAP-8100**\n*   **IAP-M47-4U** (marked with a 'New' tag)\n*   **IMB-M47**\n*   **AmITX-RL-WV** (marked with a 'New' tag)\n\n**Section 2: MXM Support**\nThis section displays a second row of hardware components with the following labels:\n*   **DLAP-3000 series**\n*   **DLAP-5200 series**\n*   **AmSTX series**\n\n**Footer:**\nBottom right corner text: 'Click to access Support list (Updating)'](.ecp-introduction-2026q2/slide-007.jpg)

## Slide 8

![**ADLINK DDR5-Ready Product Portfolio**\n\n**Industrial MB & SBCs**\n\n**DDR5**\n*   NuPRO-E47\n*   IMB-M47\n*   IMB-M47H\n*   IMB-M47-R680E\n*   IMB-C47 2026Q2\n*   IMB-C47H 2026Q2\n*   SBC35-ALN\n*   SBC35-RPL\n*   SBC35-MTL\n*   SBC35-ARL\n*   AmITX-RL-I\n*   AmITX-RL-WV 2026Q3\n\n**DDR4**\n*   IMB-M46\n*   IMB-C46\n*   IMB-C46H\n*   AmITX-ALN\n\n**IPC System**\n\n**DDR5**\n*   IAP-E47-4U\n*   IAP-M47-4U\n*   EVP-1000-E4\n\n**Edge AI Platform**\n\n**DDR5**\n*   MEX-230\n*   MXE-310\n*   MXC-3340\n*   MVP-3100\n*   MVP-3120\n*   MVP-5200\n*   MVP-6200\n*   DLAP-4100\n*   DLAP-5200\n*   DLAP-8100\n*   MXA-312M\n\n**DDR4**\n*   MXA-200\n*   MVP-5100\n*   MVP-6100\n*   DLAP-4000\n*   DLAP-8000\n\n**Edge Server/Board**\n\n**DDR5**\n*   AXE-5100R7\n*   AXE-5100R9\n*   AXE-7120SR\n*   AXE-7220SR\n*   AXE-7400SR\n*   ISB-H34\n*   ISB-W890 2026Q2\n*   AXE-7440GW 2026Q2\n*   AXE-7420GWA 2026Q2\n*   AXE-7220GW 2026Q2\n*   ISB-TR10 2026Q2\n*   AXE-7400TR 2026Q2\n*   AXE-7220TR 2026Q2\n\nPage 8](.ecp-introduction-2026q2/slide-008.jpg)

## Slide 9

![**Text Content (Verbatim):**\n\n*   **01**\n*   **Mother Boards | Embedded SBCs | IPC System**\n*   **Industrial Grade, Advanced Performance, and High Flexibility**\n*   **ADLINK LEADING EDGE COMPUTING** (Top Right Logo)\n*   **Smart Industrial Control System** (Tablet Screen Header)\n*   **Dashboard** (Tablet Sidebar Header)\n*   **Overview**\n*   **Product report**\n*   **Performance**\n*   **Product Quality**\n*   **Machine State**\n*   **PICMG** (Bottom Right Icon)\n\n**Visual Description:**\n\n*   **Left Side (Red Background):** Contains the main text overlaid on a red shape. Below the text are images of industrial computing hardware, including two white computer cases, one black computer case, a flat silver chassis, and three green motherboard circuit boards.\n*   **Right Side (Background):** A blurred industrial setting featuring a robotic arm. Overlaid is a close-up of a hand holding a tablet. The tablet screen displays a 'Smart Industrial Control System' dashboard with charts and graphs.\n*   **Bottom Right Corner:** Four circular icons are displayed: a hammer and shield, a document with a grid, a robot arm tool, and the PICMG logo.](.ecp-introduction-2026q2/slide-009.jpg)

## Slide 10

![**Title:** ADLINK Full-Spectrum Industrial Computing Platforms\n**Subtitle:** The Industrial Edge Powerhouse — Where Core Meets Intelligence\n\n**Advanced Hardware Design**\n*   Precision engineering ensures longevity Anti-vibration for durability Enhanced cooling for optimal performance Low noise output at 45dB\n\n**Application-Oriented Solution**\n*   Wide range of in-house I/O cards Full GPU compatibility Includes EdgeGO® for remote management CTOS for specific industry needs\n\n**Robust Testing and Evaluation**\n*   Anti-vibration testing Dust-resistant design Stress burn-in tests High-temperature operation: 0 to 60°C\n\n**Top Safety Certifications**\n*   Conforms to CE and FCC standards CB, LVD, UL certified RoHS certified\n\n**Partners and Operating Systems:**\n*   intel prestige partner\n*   Windows\n*   Ubuntu\n\n**Footer Logo:** ADLINK Leading Edge Computing](.ecp-introduction-2026q2/slide-010.jpg)

## Slide 11

![**Title:** ADLINK IPC Unmatched Reliability for Critical Industrial Applications\n\n**Application Areas:**\n*   Industrial Automation\n*   Warehouse\n*   Smart Manufacturing\n*   New Energy\n\n**Product Categories:**\n*   **IPC Systems:** Embedded Value Industrial Automation Platforms (EVP), Industrial Automation Platforms (IAP)\n*   **Mainboards:** 3.5' SBC, Mini-ITX, ATX, PICMG® 1.3 SBC\n*   **Chassis:** 2U Chassis for Mini-ITX, 1U Rackmount, 2U Rackmount, 4U Rackmount, Wall-mount\n\n**Key Features:**\n*   **Industrial-Grade Reliability:** Proven durability under shock, vibration, and temperature extremes\n*   **Global Safety & Compliance:** Meeting CB, ESD, EMC, LVD, and UL global industrial standards\n*   **Long-Term Stability:** Endurance tested for continuous operation and long lifecycle support\n\n**Footer/Partners:**\n*   ADLINK | Leading Edge AI Computing\n*   intel prestige partner\n*   Windows\n*   Ubuntu](.ecp-introduction-2026q2/slide-011.jpg)

## Slide 12

![The slide presents a product lineup under the title: **The Latest Intel-Based Industrial PCs, Motherboards, & SBCs**\n\nThe products are organized into two main rows surrounding a central banner:\n\n**Top Row:**\n*   **AmITX-RL-I** Mini-ITX\n*   **AmITX-RL-WV** Mini-ITX\n*   **AmITX-ALN** Mini-ITX\n*   **SBC35-RPL** 3.5' SBC\n*   **SBC35-ALN/ASL** 3.5' SBC\n*   **SBC35-MTL/ARL** 3.5' SBC\n\n**Center Banner:**\n*   **Intel® Core™ 200S Series Ready**\n\n**Bottom Row:**\n*   **IMB-C47H** Value ATX Motherboard\n*   **IMB-C47** Value ATX Motherboard\n*   **IMB-M47H** Pro ATX Motherboard\n*   **IMB-M47** Pro ATX Motherboard\n*   **IMB-M47-R680E** Pro ATX Motherboard\n*   **NuPRO-E47** PICMG1.3 SHB\n*   **IAP-M47-4U/ IAP-E47-4U** IPC System\n\n**Footer:**\n*   **ADLINK | Leading Edge Computing**](.ecp-introduction-2026q2/slide-012.jpg)

## Slide 13

![**Title:** The New Recruits to the ATX Family\n\n**Headers:** 10th Gen Intel Core Processors | 12/13/14th Intel Core Processors\n\n**IMB-M Pro Series**\n*   **IMB-M46:** Q470E, DDR4, PCIe 3.0, Multi-PCIe Slots\n*   **IMB-M47H:** H610E, DDR5, PCIe 5.0, Multi-PCI Slots\n*   **IMB-M47:** Q670, DDR5, PCIe 5.0, All-PCIe Slots\n*   **IMB-M47-R680E:** R680E, DDR5 ECC, PCIe 5.0, All-PCIe Slots\n\n**IMB-C Value Series**\n*   **IMB-C46H:** H420E, DDR4, PCIe 3.0, Multi-PCI Slots\n*   **IMB-C46:** Q470, DDR4, PCIe 3.0, Multi-PCIe Slots\n*   **IMB-C47H:** H610, DDR4, PCIe 4.0, Multi-PCI Slots\n*   **IMB-C47:** Q670, DDR4, PCIe 4.0, Multi-PCIe Slots\n\n**Footer:** ADLINK | Leading Edge Computing | intel prestige partner | Windows](.ecp-introduction-2026q2/slide-013.jpg)

## Slide 14
![This slide presents a comparison between two computing solutions against a dark, digital background.\n\n**Top Header:**\n'Tailored Computing Solutions for Every Need'\n\n**Central Visual:**\nTwo motherboards are displayed facing each other, separated by a large white 'VS' graphic with an orange explosion effect.\n\n**Left Side (Value Series):**\n- Label: 'Value Series'\n- Main Title: 'IMB-C Series'\n- Text below:\n    - '\\\$' (Dollar sign icon)\n    - 'Value-conscious users'\n    - 'DDR'\n    - 'PCIe'\n    - 'Up to 02 x8'\n    - 'up to'\n    - 'M'\n    - 'Up to'\n    - 'CE & FCC'\n    - 'Affordable and reliable with smart cost savings'\n\n**Right Side (Pro Series):**\n- Label: 'Pro Series'\n- Main Title: 'IMB-M Series'\n- Text below:\n    - '\\\$\\\$\\\$' (Three dollar sign icons)\n    - 'High-performance users'\n    - 'DDR'\n    - 'PCIe'\n    - 'Up to 16x16 or 2'\n    - 'Up to'\n    - 'Yes'\n    - 'Up to'\n    - 'CE & FCC'\n    - 'Premium build quality for peak performance'\n\n**Center Column (Comparison Table Headers):**\nA red column in the center lists the following attributes:\n- 'Price'\n- 'Target User'\n- 'DRAM'\n- 'PCIe'\n- 'CPU PCIe Bifurcation'\n- 'SATA'\n- 'TPM'\n- 'M.2'\n- 'Certification'\n- 'Sustainability Features'](.ecp-introduction-2026q2/slide-014.jpg)

## Slide 15

![**Headline:**\nWhere Affordability Meets Industrial Strength\n\n**Image Labels (Below Motherboards):**\nIMB-C46\nIMB-C47\nIMB-C47H\nIMB-C46H\n\n**Sub-Headline:**\nIMB-C Series Value ATX Motherboards\n\n**Feature List:**\n\n**Intel Core™**\nOffering Intel® Core™ processor options from 10th to 14th generation, up to 125W\n\n**DDR4**\nSupports up to 128 GB of quad-channel DDR4 memory at 3200 MHz.\n\n**PCIe 4.0**\nSupports PCIe 4.0 and 3.0 for enhanced expansion capabilities.\n\n**2.5 GbE**\nFeatures two Ethernet ports supporting 2.5 GbE and 1 GbE\n\n**USB 3.0**\nSupports up to 13 USB ports with USB 3.0 and 2.0 compatibility\n\n**Logos:**\nintel prestige partner\nWindows](.ecp-introduction-2026q2/slide-015.jpg)

## Slide 16

![**Star Product**\n\nWindows 11\nintel prestige partner\n\n**IMB-M47-**\nR680E\nEmpower Industrial Automation with PCIe 5.0 and ECC DDR5. Dual-GPU ready, supporting Intel® Core™ Series 2 and 14th/13th/12th Gen Intel® Core™ processors on the Intel® R680E chipset (up to 125W CPU TDP).\n\n**High Speed PCIe Gen5**\n*   2x PCIe Gen5 (1 PCIe x16, 1 PCIe x8),\n*   3x PCIe x4\n*   2x PCIe x1\n\n**DDR5 ECC**\n*   Four 288-pin DIMM DDR5 4400 MHz slots capable of holding up to 128GB\n\n**2.5GbE LAN**\n*   3 Intel® 2.5 Gigabit LAN\n\n**Rich I/O**\n*   3 Intel® 2.5 Gigabit LAN, 6 USB 3.2 Gen2, 2 USB 3.1, 4 USB 2.0, 1 M.2 Key B, 1 M.2 Key E, 1 M.2 Key M, 6 COM, 8 SATA3\n\nADLINK | Leading Edge Computing\nPage 16](.ecp-introduction-2026q2/slide-016.jpg)

## Slide 17

![**Header:**\nStar Product\nWindows 11\nintel prestige partner\n\n**Main Title & Description:**\nIMB-M47\nEmpowering industrial automation with PCIe 5.0 and DDR5. Supports Intel® Core™ Series 2 and 14th/13th/12th Gen Intel® Core™ processors, with CPU TDP up to 125W.\n\n**Specifications (Bottom Row):**\n**PCIe Gen5**\n2x PCIe 5.0 (1x PCIe x16 OR 2x PCIe x8), 2 PCIe x4 Gen4. 3 PCIe x1 Gen3\n\n**DDR5**\nFour 288-pin DIMM DDR5 4800 MHz slots capable of holding up to 128GB\n\n**2.5GbE LAN**\n3 Intel® 2.5 Gigabit LAN\n\n**Rich I/O**\n3x Intel® 2.5 Gigabit LAN, 5x USB 3.2 Gen2, 4x USB 2.0, 1x M.2 Key B, 1x M.2 Key E, 1x M.2 Key M, 6x COM, 8x SATA3\n\n**Footer & Disclaimer:**\n*COMING SOON: 14th gen (Raptor Lake-S Refresh) BIOS development is in the pipeline. Official 14th gen support launching on January 1, 2024.\nADLINK | Leading Edge Computing\nPage 17](.ecp-introduction-2026q2/slide-017.jpg)

## Slide 18

![The slide features a product presentation for a motherboard.\n\n**Top Section:**\n*   **Top Left:** 'Star Product' (in red).\n*   **Top Right:** 'Windows 11' logo and 'intel prestige partner' logo.\n\n**Main Body:**\n*   **Center Text:** 'IMB-C47'\n*   **Description:** 'High-Value Industrial Automation with PCIe 4.0 and DDR4. Supports Intel® Core™ Series 2 and 14th/13th/12th Gen Intel® Core™ processors, with CPU TDP up to 125W.'\n\n**Bottom Section (Four Categories):**\n*   **PCIe Gen4:**\n    *   '2x PCIe Gen4 x16 (x8 signal)'\n    *   '4x PCIe x4 (3x Gen4, 1x Gen3)'\n*   **DDR4:**\n    *   'Four 288-pin DIMM DDR4 3200 MHz slots capable of holding up to 128GB'\n*   **2.5GbE LAN:**\n    *   '1x Intel® 2.5 Gigabit LAN'\n    *   '1x Intel® 1 Gigabit LAN'\n*   **Rich I/O:**\n    *   '8x USB 3.0, 5x USB 2.0,'\n    *   '1x M.2 Key E, 1x M.2 Key M,'\n    *   '6x COM, 4x SATA3'\n\n**Footer:**\n*   **Bottom Left:** '*COMING SOON: 14th gen (Raptor Lake-S Refresh) BIOS development is in the pipeline. Official 14th gen support launching on January 1, 2024.' followed by 'ADLINK | Leading Edge Computing'.\n*   **Bottom Right:** 'Page 18'](.ecp-introduction-2026q2/slide-018.jpg)

## Slide 19

![**Star Product**\n**Windows 11**\n**intel prestige partner**\n\n**IMB-C47H**\n\nHigh-Value Industrial Automation with PCIe 4.0 and DDR4. Supports Intel® Core™ Series 2 and 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 desktop processors with 65W TDP.\n\n**PCIe Gen4**\n*   1x PCIe Gen4 x16\n*   3x PCIe Gen3 x4 (x2 signal)\n\n**DDR4**\n*   Two 288-pin DIMM DDR4 3200 MHz slots capable of holding up to 64GB\n\n**GbE LAN**\n*   2x Intel® Gigabit LAN\n\n**Rich I/O**\n*   4x USB 3.0, 6x USB 2.0,\n*   1x M.2 Key M,\n*   6x COM, 3x SATA3\n\n*COMING SOON: 14th gen (Raptor Lake-S Refresh) BIOS development is in the pipeline. Official 14th gen support launching on January 1, 2024.*\n\n**ADLINK | Leading Edge Computing**\n**Page 19**](.ecp-introduction-2026q2/slide-019.jpg)

## Slide 20

![**Header:**\nIPC Roadmap\nATX/PICMG SHB\nADLINK\nLEADING EDGE COMPUTING\n\n**Legend (Top Right):**\nReleased / M\nUnder\nUnder\n\n**Timeline:**\nAvailable\n2026 H1\n2026 H2\n2027\n\n**Categories (Left Axis):**\nIMB M-series\nIMB C-series\nNuPRO\n\n**Product Content:**\n\n**IMB M-series:**\nIMB-M45\nIMB-M45H\nIMB-M46\nIMB-M47-\nIMB-M47\nIMB-M47H\n\n**IMB C-series:**\nIMB-C46\nIMB-C46H\nIMB-C47\nIMB-C47H\nIMB-C47/\nRaptor Lake-S Refresh, Q670\nDDR5, Multi-PCIe slots\nIMB-C47H/\nRaptor Lake-S Refresh, H610\nDDR5, Multi-PCI slots\nIMB-C49\nNova Lake-S, Q970\nDDR5, Multi-PCIe slots\nIMB-C49B\nNova Lake-S, B960\nDDR5, Multi-PCI slots\n\n**NuPRO:**\nNuPRO-\nNuPRO-E49\nNova Lake-S, Q970\nDDR5\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-020.jpg)

## Slide 21

![**Scalable IPC Platforms for Every Edge**\n\n**IAP Series and EVP Series IPC Systems**\n\n**Global certifications:**\nCB, UL, LVD(EU), CE, FCC\n\n**Features:**\n*   Fully Pre-Validated I/O Integration, Plug-and-Play ADLINK I/O Cards\n*   One-stop System Solution\n*   Configurable System Options\n\n**Products:**\n*   **IAP Series**\n    Industrial Automation Platform\n*   **EVP Series**\n    Embedded Value Platform\n\n**Logos/Partners:**\n*   intel prestige partner\n*   Windows\n*   CB FC CE UL LVD\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-021.jpg)

## Slide 22

![The slide presents the following text content verbatim:\n\n**Header:**\nGlobally Certified\nPlatforms for Industrial\nAutomation\nIAP Series Industrial Automation Platform\n\n**Product Labels:**\nADLINK\nIAP-E47-4U\nIAP-M47-4U\n\n**Feature List (Bottom Row):**\nIntel® Core™ 200S Series\nand 14/13/12th Gen Core™\nProcessors\nGlobal\nCertificati\non\nPre-\nValidated\nI/O\nUp to\n14\nSlots\nUp to\n2\nGPUs\nConfigurable\nSystem\nOptions\n\n**Logos & Footer:**\nintel prestige\npartner\nWindows\nCB FC CE UL LVD\n\nADLINK | Leading Edge\nComputing](.ecp-introduction-2026q2/slide-022.jpg)

## Slide 23

![**Headline & Subtitle**\nUltra-Slim. Power-Saving.\nEVP Series Embedded Value Platform\n\n**Product Image Dimensions**\n254 mm\n44.4 mm\n230 mm\n\n**Product Model Label**\nEVP-1000-E4\n\n**Feature List**\n*   Intel® 14/13/12th Gen Core™ Processors\n*   Slim 1U Design (Text is broken across lines as 'Desig' / 'n')\n*   Pre-Validated I/O\n*   Configurable System Options\n\n**Port Labels (on rear view image)**\n24V DC IN\nDP1\nDP2\nCOM\n2 USB\n1 LAN\n\n**Logos & Certifications**\nintel prestige partner\nWindows\nCB FC CE UL LVD\n\n**Footer**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-023.jpg)

## Slide 24

![The slide is titled **ADLINK IPC Portfolio Segmentation** with the subtitle **Power Meets Efficiency**. It presents a side-by-side comparison of two product lines, categorized by a central blue column labeled: **Positioning**, **CPU**, **Certification**, **Value**, and **Applications**.\n\n**Left Side (IAP Series):**\n*   **Tag:** High Performance\n*   **Title:** IAP Series Industrial Automation Platform\n*   **Positioning:** High-performance, scalable IPC\n*   **CPU:** Intel® Core™ 200S Series and 12/13/14th Core™ Processor\n*   **Certification:** CB, UL, LVD (EU), CE, FCC\n*   **Value:**\n    *   Scalable and Modularize\n    *   Rack mount\n    *   Harsh Environments (OP Shock 20 G/ Vibration 1G)\n*   **Applications:** Industrial Automation, Mechanical Equipment, Semiconductor\n\n**Right Side (EVP Series):**\n*   **Tag:** Cost Efficient\n*   **Title:** EVP Series Embedded Value Platform\n*   **Positioning:** Lightweight, cost-efficient IPC\n*   **CPU:** Intel® 12/13/14th Gen Core™ Processor\n*   **Certification:** LVD (EU), CE, FCC\n*   **Value:**\n    *   Compact & Power-saving\n    *   Easy to deploy\n    *   Low power consumption (Celeron / Pentium / Core i3)\n*   **Applications:** POS, KIOSK, Digital Signage, Medical\n\n**Footer:** ADLINK | Leading Edge Computing Page 24](.ecp-introduction-2026q2/slide-024.jpg)

## Slide 25

![**Slide Title:** Two IPC System Offering Models\n**Subtitle:** Barebone for Channel • Pre-Configured System for Key Accounts\n\n**Left Panel (Blue Background):**\n*   **Heading:** Barebone System\n*   **Tag:** Channel Partners\n*   **Bullet Points:**\n    *   Flexible assembly & validated IPC\n    *   MB + Chassis + PSU\n    *   Ideal for distributors & SI customers\n*   **Image Labels:** Motherboard, Chass is, PS U\n\n**Right Panel (Grey Background):**\n*   **Heading:** Pre-Configured System\n*   **Tag:** Key Accounts\n*   **Bullet Points:**\n    *   Fully assembled & validated IPC\n    *   Barebone + CPU + CPU Cooler + DRAM\n    *   Best for OEM & automation deployments\n*   **Graphic:** +\n*   **Image Labels:** CPU, Cooler, DRAM (Intel Core i9 logo is visible above 'CPU')\n\n**Footer:**\n*   ADLINK | Leading Edge Computing\n*   Page 25](.ecp-introduction-2026q2/slide-025.jpg)

## Slide 26

![**Header and Title**\n*   IPC System Roadmap\n*   ADLINK LEADING EDGE COMPUTING\n*   IAP / EVP Series IPC System\n\n**Status Indicators (Top Right)**\n*   Released / M\n*   Under\n*   Under\n\n**Left Column (Form Factors and Specifications)**\n*   4U\n    *   • Industrial automation\n    *   • Machine vision\n    *   • 7 or 13 slots for expansion\n*   2U\n    *   • Industrial automation\n    *   • Machine vision\n    *   • 3 or 4 slots for expansion\n*   Wallmount\n    *   • Industrial automation\n    *   • Machine vision\n    *   • 7 or 8 slots for expansion\n*   Compact PC (Text under image is partially obscured but appears to read 'Compact PC')\n    *   • 2U Edge computing\n    *   • AIoT\n    *   • 1 slot for expansion\n*   Thin / Compact PC\n    *   • 1U Edge computing\n    *   • AIoT\n    *   • 1 slot for expansion\n\n**Central Label**\n*   RK Chassis Ready\n\n**Timeline**\n*   Available\n*   2024H1\n*   2024H2\n*   2025\n\n**Product Releases (Red and Green Blocks)**\n*   IAP-M47-4U\n*   Intel® 12/13/14th Core i, ATX, 7 slots\n*   IAP-E47-4U\n*   Intel® 12th Core i, PICMG, 13 slots\n*   IAP-M47H-2U\n*   Intel® 12/13/14th Core i, ATX, 7 slots\n*   IAP-E47-2U\n*   Intel® 12/13/14th Core i, PICMG, 4 slots\n*   IAP-M47-W\n*   Intel® 12/13/14th Core i, ATX, 7 slots\n*   IAP-E47-W\n*   Intel® 12/13/14th Core i, PICMG, 8 slots\n*   EVP-2000\n*   Intel® 12/13/14th Core i, MiniITX, 1 slot\n*   EVP-1000-E4\n*   Intel® 12th Core i, MiniITX, 1 slot](.ecp-introduction-2026q2/slide-026.jpg)

## Slide 27

![**ADLINK Tailored Chassis**\n\n**Solutions**\nQuiet Safety & Economical Light Series — Built for Different Industrial Demands\n\n**Quiet Safety Chassis**\n*   4U Rack Mount\n*   1U Rack Mount\n*   Wall Mount\n*   Mini-ITX Chassis\n\n**Economical Light Chassis**\n*   4U Rack Mount\n*   Wall Mount\n*   2U Rack Mount\n\n**Low Acoustic**\n≤45 dB\n\n**Safety Certified**\n\n**EMC Certified**\n\n**Cost Effective**\n\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-027.jpg)

## Slide 28

![**Title:** ADLINK IPC Chassis Comparison\n\n**Center Graphic:** VS\n\n**Left Column (Blue Background):**\n*   Quiet\n*   Chassis\n*   Safety\n*   4-pin PWM Dual Ball Bearing Fan*\n*   EMC(CE, FCC), Safety(UL, LVD)\n*   1.2 mm SGCC Steel\n*   OP Shock 20 G/ Vibration 1G\n\n**Center Column (Row Headers):**\n*   Cooling System\n*   Certification\n*   Chassis Thickness\n*   Reliability\n\n**Right Column (Green/Blue Background):**\n*   Economical Light\n*   Chassis\n*   3-pin Dual Bearing Fan Fixed Speed Airflow\n*   EMC(CE, FCC) Only\n*   1.0 mm SGCC\n*   Steel Standard\n*   Mechanical Reliability\n*   No e: Models with 'L' suffix belong to the Economical Light series.\n\n**Footer (Bottom Left):** ADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-028.jpg)

## Slide 29

![**Title:** Chassis with PICMG 1.3 Full-size SHB Rack Mount / Wall Mount\n**Banner:** Quiet Safety Chassis\n\n**Table Data:**\n\n*   **Type:** Rack Mount Industrial Chassis | Wall Mount Industrial Chassis\n*   **Model:** RK-110SE | RK-620B | RK-420B | RK-609B\n*   **Hight:** 1U | 4U | 4U | Wall Mount\n*   **Dimension W x D x H (mm):** 19 x 17.7 x 1.75 in (483 x 450 x 44 mm) | 16.8 x 17.4 x 7 in (427 x 448 x 177 mm) | 16.8 x 17.4 x 7 in (427 x 448 x 177 mm) | 21.1 x 17.5 x 12.4 in (535 x 445 x 315 mm)\n*   **Motherboard Option:** PICMG 1.3 SHB | PICMG 1.3 SHB | PICMG 1.3 SHB | PICMG 1.3 SHB\n*   **Backplane Option:** EBP-D3E1 | EBP-10E5 EBP-13E2 EBP-13E4 WBP-12E7 | EBP-10E5 EBP-13E2 EBP-13E4 WBP-12E7 | EBP-5E1 EBP-6E2 EBP-7E2 EBP-9E2 EBP-9E5\n*   **Chassis Color:** Black | Beige/ Black | White | Beige\n*   **External 5.25':** 1 | 2 | 2 | 2\n*   **External 3.5':** 1 | 1 | 1 | 2\n*   **Internal 3.5':** 0 | 1 | 1 | 0\n*   **Internal 2.5':** 0 | 1 | 1 | 0\n*   **Supported PSU:** 300W (1U PSU) | 400,500,600,750, 1200,2000W (PS2 ATX) | 400,500,600,750, 1200,2000W (PS2 ATX) | 300,00,500,600W (PS2 ATX)\n*   **Supported Expansion Card (Quantity):** FHFL PCIe x4 cards (1) | FHFL cards (14) | FHFL cards (15) | FHFL Cards\n\n**Footer:** ADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-029.jpg)

## Slide 30

![**Title:** Chassis with ATX/ Micro-ATX/ Mini-ITX\n**Subtitle:** Rack Mount / Wall Mount\n\n**Section 1: Quiet Safety Rack Mount Chassisd**\n*   **Columns:** Rack Mount Industrial Chassis (RK-620MB), Wall Mount Industrial Chassis (RK-609MB), Wall Mount/ Tower Industrial Chassis (RK-200I)\n*   **Rows:**\n    *   **Hight:** 4U | Wall Mount | Wall Mount/ Tower\n    *   **Dimension W x D x H (mm):** 16.8 x 17.4 x 7 in (427 x 448 x 177 mm) | 21.1 x 17.5 x 12.4 in (535 x 445 x 315 mm) | 14.7 in x 14.17 x 7.87 in (375 x 360 x 200 mm)\n    *   **Motherboard Option:** ATX Micro-ATX | ATX Micro-ATX | Mini-ITX\n    *   **Chassis Color:** Beige/ Black | Beige | Black\n    *   **Externals:** 5.25' (2, 1, 0) | 3.5' (1, 2, 0)\n    *   **Internal:** 3.5' (1, 1, 1) | 2.5' (1, 0, 1)\n    *   **Supported PSU:** 400,500,600,750, 1200,2000W (PS2 ATX) | 400,500,600,750W (PS2 ATX) | 300W(1U PSU) Or DC-in\n    *   **Supported Expansion Card (Quantity):** FHFL cards (7) | FHFL cards (7) | HHHL cards (1)\n\n**Section 2: Economical Light Rack Mount Chassis**\n*   **Columns:** Rack Mount Industrial Chassis (RK-270MB-LH), Rack Mount Industrial Chassis (RK-620MB-L), Wall Mount Industrial Chassis (RK-609MB-L), Wall Mount/ Tower Industrial Chassis (RK-500MB-L)\n*   **Rows:**\n    *   **Hight:** 2U | 4U | Wall Mount/ Tower | Wall Mount/ Tower\n    *   **Dimension W x D x H (mm):** 16.9 x 3.5 x 19 in (428 x 88.5 x 483mm) | 16.8 x 17.4 x 7 in (428 x 447.9 x 177mm) | 14.7 x 14.17 x 7.87 in (375 x 360 x 200 mm) | 14.96 x 6.46 x 12.52 in (380 x 164 x 318 mm)\n    *   **Motherboard Option:** ATX Micro-ATX (All columns)\n    *   **Chassis Color:** Black | Beige | Beige | Beige\n    *   **External:** 5.25' (1, 1, 0, 1) | 3.5' (1, 2, 0, 0)\n    *   **Internal:** 3.5' (2, 1, 2, 2) | 2.5' (0, 0, 0, 0)\n    *   **Supported PSU:** 500W(1U) | 400,500,600W (PS2 ATX) | 400,500,600W (PS2 ATX) | 400,500,600W (PS2 ATX)\n    *   **Supported Expansion Card (Quantity):** HFFL cards (7) | FHFL cards (7) | FHFL cards (7) | FHFL cards (7)\n\n**Footer:** ADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-030.jpg)

## Slide 31

![**Header**\n*   IPC Roadmap\n*   IPC Chassis Roadmap\n*   ADLINK\n*   LEADING EDGE COMPUTING\n\n**Legend (Top Right)**\n*   Released / M\n*   Under T\n*   Under\n\n**Left Column (Categories)**\n*   **4U**\n    *   • Industrial automation\n    *   • Machine vision\n    *   • 7 or 13 slots for expansion\n*   **2U**\n    *   • Industrial automation\n    *   • Machine vision\n    *   • 3 or 4 slots for expansion\n*   **Wallmount**\n    *   • Industrial automation\n    *   • Machine vision\n    *   • 7 or 8 slots for expansion\n*   **Compact PC**\n    *   • 2U Edge computing\n    *   • AIoT\n    *   • 1 slot for expansion\n*   **Thin PC**\n    *   • Edge computing\n    *   • AIoT\n    *   • 1 slot for expansion\n\n**Product List (Center & Right Columns)**\n*   **RK-620B**\n    *   Quiet Safety , PICMG 1.3,\n*   **RK-620MB**\n    *   Quiet Safety , ATX, 7 slots\n*   **RK-620MB-**\n    *   Economical , ATX, Micro-ATX, Mini-ITX, 7 slots\n*   **RK-270MB-**\n    *   Economical , ATX, Micro-ATX, Mini-ITX, 7 slots\n*   **RK-609B**\n    *   Quiet Safety , PICMG 1.3, 10\n*   **RK-609MB**\n    *   Quiet Safety, ATX, 7 slots\n*   **RK-500MB-**\n    *   Economical , ATX, Micro-ATX, Mini-ITX, 7 slots\n*   **RK-609MB-**\n    *   Economical , ATX, Micro-ATX, Mini-ITX, 7 slots\n*   **RK-200i**\n    *   2U MiniITX, 1 slot\n*   **RK-420B-**\n    *   Economical White, PICMG 1.3, 11 slots with removable hand screw\n*   **RK-506B-W**\n    *   Beige, PICMG, 6 slots\n*   **RK-700MB-L**\n    *   Economical , ATX, Micro-ATX, Mini-ITX, 7 slots\n*   **RK-270B**\n    *   Economical, Black, PICMG 1.3, 4 slots\n\n**Timeline (Bottom)**\n*   Available\n*   2025 H1\n*   2025 H2\n*   2026](.ecp-introduction-2026q2/slide-031.jpg)

## Slide 32

![**Embedded SBCs**\nAI-Accelerated Performance for Next-Gen Edge Computing\nAI-Accelerated Computing\nExpandable GPU/NPU\nAI-Optimized I/O\n\n**Warehou**\n**se**\n**Energ**\n**Reta**\n**il**\n**Healthca**\n**re**\n\n**AI** (Large background text)\n\n**AmITX**\n**Series**\n**Mini-ITX**\n\n**SBC35**\n**Series**\n**3.5: SBC**\n\n**Industrial-Grade Durability**\nRugged, reliable, long\nlifecycle\n\n**Reliable in Extreme Temperatures**\nBuilt for automation & AI\nWide-temp support (-40°C to 85°C)\nStable in harsh conditions\n\n**Optimized for Peak Performance**\nScalable, high-efficiency processing\nAI and IoT-ready\n\n**Advanced Thermal Management**\nPassive & active cooling\nOptimized heat dissipation\n\n**ADLINK | Leading Edge Computing**](.ecp-introduction-2026q2/slide-032.jpg)

## Slide 33

![**Ultimate Adaptability, Ultra Compact**\n\n**SBC35 Series 3.5” Single Board computer**\n\n**Slim Design in a Small Form Factor**\n*   Ideal for integration into a variety of compact systems\n*   Compact and energy-efficient without compromising performance\n\n**Uniquely Functional Module Design**\n*   SBC-FM seamless integration with all SBC35 series\n*   Supports PCIe, USB, and LPC/eSPI options\n\n**Flexible Configuration**\n*   SBC-FM supports vertical stacking and parallel linking\n*   Customizable modules offer tailored options for diverse needs\n\n**ADLINK | Leading Edge Computing**\n\n**Labels on graphic:**\n*   LPC/eSPI\n*   USB\n*   PCIe\n*   FPC Cable](.ecp-introduction-2026q2/slide-033.jpg)

## Slide 34

![**Flexible Mechanical Design**\nStreamlined design and maximized adaptability with FPC cable\nStacked at Top or Bottom\nArranged Left or Right\nPlaced at Front or Rear\nLPC/SPI\nUSB\nPCIe\nFPC Cable\nCustomizable SBC-FM Extension\nAdaptive Function Module (AFM) enhances SBC35 series with custom functionalities for optimal performance\nSignal Reservation for Easy Expansion\nEnables customers to independently develop proprietary function modules while ensuring protection of intellectual property\nSBC-FM\nAdaptive Function Module Design Features](.ecp-introduction-2026q2/slide-034.jpg)

## Slide 35

![**Title:** Why SBC-FM?\n\n**Comparison Header:** ADLINK SBC-FM VS Competitors\n\n**Table Content:**\n\n*   **Row 1:** FPC (Image) | **Connector type** | B2B (Image)\n*   **Row 2:** High flexibility can be vertical stacking and parallel linking (Star Icon) | **Assemble flexibility** | Minimal flexibility, designed for fixed\n*   **Row 3:** High thermal flexibility adapts to extreme conditions with ease (Star Icon) | **Thermal flexibility** | Low thermal flexibility, inadequate space hampers heat dissipation\n*   **Row 4:** Reduces assembly space and time, enabling innovative designs (Star Icon) | **Advantages** | Reliable, durable connections, easy to service and upgrade\n\n**Footer:** ADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-035.jpg)

## Slide 36

![**Header:**\nSBC-FM Exclusive Adaptive Function Module\nCustomized Options Based on Project Needs\n\n**Left Column (Coming Soon):**\n*   **SBC-FM-2C8DIO**\n*   **I/O COM and DIO** (Note: 'I/O' is partially obscured)\n*   Icons: **Parking system**, **Fuel dispenser**, **ATM machine**\n\n**Center Column (Ready Now):**\n*   **SBC-FM-4U5C**\n*   **4x USB2.0, 5x COM**\n*   Icons: **Outdoor Drive-thru Kiosk**, **Parking system**\n*   Images of circuit boards and a mainboard.\n\n**Right Column (Coming Soon):**\n*   **SBC-FM-4USB**\n*   **4 Extra USB 2.0**\n*   Icons: **Outdoor Drive-thru Kiosk**, **POS**\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-036.jpg)

## Slide 37

![This slide showcases ADLINK's new SBC35 product line, categorized into performance tiers.\n\n**Header:**\n'From Entry to Advanced'\n'ADLINK's New SBC35 Models Cater to All'\n\n**Category: High-Performance**\nThis section covers the first two models on the left and center.\n\n*   **Model 1 (Left):**\n    *   **Image:** A green single-board computer (SBC) and a separate daughterboard.\n    *   **Title:** SBC35-MTL/ARL\n    *   **Description:** 3.5' Single Board Computer with Intel® Core™ Ultra Processors (Series 1/2)\n    *   **Logo:** intel CORE ULTRA\n\n*   **Model 2 (Center):**\n    *   **Image:** A green single-board computer (SBC) and a separate daughterboard.\n    *   **Title:** SBC35-RPL\n    *   **Description:** 3.5' Single Board Computer with 13th Gen Intel® Core™ i7/i5/i3 Processor\n    *   **Logo:** intel CORE i9\n\n**Category: Efficiency-Optimized**\nThis section covers the model on the right.\n\n*   **Model 3 (Right):**\n    *   **Image:** A green single-board computer (SBC) and a separate daughterboard.\n    *   **Title:** SBC35-ALN/ASL\n    *   **Description:** 3.5' Single Board Computer with Intel® N97 Processor / Intel® x7835RE/x7433RE/x7211RE Processor\n    *   **Logo:** intel ATOM\n\n**Footer:**\n'ADLINK | Leading Edge Computing'](.ecp-introduction-2026q2/slide-037.jpg)

## Slide 38

![**Top Header:**\nComing Soon Product\n\n**Main Title Section:**\nPowerful AI, Smarter Edge\nSBC35-ARL NEW\nHigh Performance Embedded 3.5” SBC with Integrated NPU processing\n\n**Visual Element:**\n(An image of a green circuit board with a magnified circular inset showing stacked chips labeled GPU, NPU, and CPU).\n\n**Feature Columns:**\n\n**Next-Gen AI Processing**\n*   Intel® Core™ Ultra (Series 2).\n*   Built-in Intel AI Boost (NPU) delivering up to 99 TOPS for real-time inferencing at the edge.\n\n**Enhanced Graphics & Display**\n*   Supports up to 4 independent displays\n*   Improved GPU for multi-display HMI and vision AI.\n\n**High-Speed Expansion**\n*   PCIe Gen4/Gen5, USB 3.2, and M.2 for accelerators/storage\n*   Dual 2.5GbE LAN for high-bandwidth networking.\n\n**Modular Scalability**\n*   Supports SBC-FM modules\n*   SBC-FM for Flexible I/O Customization in Diverse Applications\n\n**Bottom Logos:**\nintel prestige partner, Windows, Ubuntu\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-038.jpg)

## Slide 39

![**Star Product**\n\n**Maximum AI, Minimal Space**\nSBC35-\nAI-Enhanced 3.5' SBC with Built-In\nMTL\nNPU for Vision Applications\n\n**AI-Enhanced Processing**\n- Intel® Core™ Ultra Processor (Series 1)\n- Built-in Intel AI Boost (NPU) delivering up to 32 TOPS for real-time inferencing at the edge.\n\n**Versatile Display & I/O**\n- Up to 4 displays (HDMI, DP, Type-C, eDP/LVDS).\n- Dual 2.5GbE LAN, USB, COM, MIPI-CSI for cameras\n\n**Advanced Connectivity**\n- M.2 slots for NVMe and wireless.\n- M.2 with SIM for 4G/5G.\n\n**Customizable Expansion**\n- PCIe, USB, eSPI via FPC.\n- SBC-FM modules for I/O customization.\n\n**Logos:**\nintel prestige partner\nWindows\nUbuntu\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-039.jpg)

## Slide 40

![This slide describes the **SBC35-ASL** board, labeled as a **Star Product**.\n\n**Header Section:**\n*   'Compact. Tough. Ready for the Extreme.'\n*   **SBC35-ASL**\n*   'Fanless Xtreme Performance 3.5” Embedded SBC with Wide Temperature Support'\n*   Graphic icon displays temperature range: **-40°C | 85°C**\n\n**Feature Columns:**\n\n**Optimized Efficiency**\n*   Intel® x7835RE/x7433RE/x7211RE, 4-core, 3.4GHz, 9W.\n*   Up to 16GB DDR5 memory.\n*   Fanless, low-power design.\n\n**Compact Versatility**\n*   SBC-FM for easy customization.\n*   M.2 slots for storage and wireless.\n*   4G/5G support with SIM card.\n\n**Industrial-Grade Durability**\n*   Operates in -40 to 85°C.\n*   I/O: 2x GbE, 4x COM, 5x USB, 8x DI/DO.\n*   12-24V wide DC input.\n\n**Footer/Partners:**\n*   intel prestige partner\n*   Windows\n*   Ubuntu\n*   ADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-040.jpg)

## Slide 41

![This slide presents product specifications for the **SBC35-RPL**.\n\n**Header & Title:**\n*   **Star Product**\n*   **Compact Size, Capable Performance**\n*   **SBC35-RPL**\n*   **High Performance 3.5” Embedded SBC**\n\n**Key Features (Three Columns):**\n\n**High-Performance Platform**\n*   Powered by 13th Gen Intel® Core™ i7/i5/i3/Celeron® processors\n*   Supports up to 64GB DDR5 4800MHz dual-channel memory\n*   Ideal for compute-intensive industrial and embedded applications\n\n**Versatile Four Display Support**\n*   Four independent display outputs: HDMI, DP, USB Type-C, eDP/LVDS\n*   Default eDP, LVDS available via BOM option\n*   Suitable for panel PC, digital signage, and visual interface systems\n\n**Expandable and Application-Ready**\n*   SBC-FM module supports PCIe x4, PCIe x1, USB 3.0/2.0, LPC\n*   Onboard: dual GbE (1GbE + 2.5GbE), 4x COM, 5x USB, 8x DI/DO\n*   M.2 B/E/M Key, TPM 2.0 (optional), 12-24V wide input, fanless design\n\n**Footer & Logos:**\n*   **ADLINK | Leading Edge Computing**\n*   **intel prestige partner**\n*   **Windows**\n*   **Ubuntu**](.ecp-introduction-2026q2/slide-041.jpg)

## Slide 42

![**Slide Title/Header:** Star Product\n\n**Main Headline:** Small Board, Smart Power.\n\n**Product Name:** SBC35- ALN\n\n**Subtitle:** Compact Fanless IoT Platform\n\n**Feature Columns:**\n\n*   **Optimized for Panel Integration**\n    *   Native LVDS / eDP interface for direct display panel integration\n    *   Compact 3.5” SBC design fits slim enclosures\n    *   Ideal for self-service kiosks, medical monitors, and embedded HMI\n\n*   **Flexible & Customizable I/O**\n    *   Supports SBC-FM I/O expansion with PCIe x1, USB 2.0, LPC\n    *   FPC cable enables vertical or parallel module layout\n    *   Tailor isolation I/O or rugged function on FM board\n\n*   **Industrial Connectivity & Reliability**\n    *   Dual 1GbE LAN, 4x COM ports, 4x USB, 8x DI/DO\n    *   12-24V DC input, CE/FCC Class B certified\n    *   Operating temperature: 0°C to 60°C, fanless design\n\n**Footer Logos:** intel prestige partner, Windows, Ubuntu\n\n**Bottom Left Corner:** ADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-042.jpg)

## Slide 43

![**Header & Title:**\n*   **IPC Roadmap**\n*   **SBC35 / SBC-FM**\n\n**Top Right Status Indicators:**\n*   **Released / M** (Red banner)\n*   **Under** (Blue banner)\n*   **Under** (Green banner)\n\n**Vertical Axis Labels:**\n*   **Function Module**\n*   **3.5' SBC**\n\n**Function Module Products:**\n*   **SBC-FM-4U50** (Red Box): 4X USB2.0, 5X RS232\n*   **SBC-FM-4USB** (Red Box): 4X USB2.0\n*   **SBC-FM-4C8DI** (Red Box): 2x RS232/422/485 Isolation, 8bit DI/IO isolation\n*   **SBC-FM-GMSI** (Green Box): 2channel x4 MIPI-CSI, FPGA\n\n**3.5' SBC Products:**\n*   **SBC35-RPI** (Red Box)\n\n*   **Group 1 (Same PCB):**\n    *   **SBC35-MTI** (Red Box): Meteor Lake U, DDR5, USB, COM, 3x M.2 expansion slot, MIPI, 12~24V DC\n    *   **SBC35-ARL** (Green Box): Arrow Lake, DDR5, USB, COM, 12~24V DC, MIPI, 12~24V DC\n\n*   **Group 2 (Same PCB):**\n    *   **SBC35-ALN** (Red Box): Alder Lake N, DDR5, USB, COM, 12~24V DC, wide temp., FANLESS\n    *   **SBC35-ASI** (Red Box): Aston Lake, DDR5, USB, COM, 12~24V DC, wide temp., FANLESS\n    *   **SBC35-TWL** (Green Box): Twin Lake, DDR5, USB, COM, 12~24V DC, wide temp. FANLESS\n\n*   **Other Products:**\n    *   **SBC35-PTL** (Blue Box): Partner Lake, DDR5, 3xLAN, USB, COM, 3x M.2 expansion slot, MIPI, 12~24V DC\n    *   **SBC35-WCL** (Green Box): Wildcat Lake DDR5, 4xLAN, USB, COM, 3x M.2 expansion slotI, 12~24V DC\n\n**Timeline (X-Axis):**\n*   **Available**\n*   **2026 H1**\n*   **2026 H2**\n*   **2027**\n\n**Footer:**\n*   **ADLINK | Leading Edge Computing**\n*   **ADLINK** (Logo top right) **LEADING EDGE COMPUTING**](.ecp-introduction-2026q2/slide-043.jpg)

## Slide 44

![**Header:**\nADLINK AmITX New\nCompact Solutions for High-Efficiency Edge Computing\nSeries\n\n**Product Models:**\nAmITX-RL-I\nIndustrial Mini-ITX\nMotherboard for\nIntel® Core™ 200S Series and\n15th-12th Gen Core™ Processor\n\nAmITX-ALN\nIndustrial Mini-ITX Motherboard\nwith Intel® N97 Processor\n\nAmITX-RL-WV\n12-28V wide-voltage Mini-\nITX motherboard for 14th-\n12th Gen Intel® Core™\nprocessors\n\n**Features:**\n**Extreme and Efficient Performance**\n• Intel® Core™ 200S Series\nand 15th-12th Gen Core™\nProcessor\n• Ultra-low power\nconsumption option with\nIntel® N97 Processors\n\n**Flexible Power and Seamless Integration**\n• Dual power options: ATX\nand DC-In (12-28V) for\nflexible deployment\n• Compatible with standard\nMini-ITX chassis\n\n**High-Speed Connectivity**\n• Features 2.5GbE LAN and\nUSB 3.2 Gen2\n• Multiple M.2 slots for\nstorage and expansion\n\n**Advanced GPU and Memory Support**\n• PCIe Gen5 x16 for high-\nperformance GPU integration\n• Supports up to 64GB DDR5\nmemory for demanding\napplications\n\n**Logos/Footers:**\nADLINK | Computing\nintel prestige partner\nWindows 10\nWindows 11\nUbuntu](.ecp-introduction-2026q2/slide-044.jpg)

## Slide 45

![**Header:**\nADLINK Mini-ITX Motherboards\nScalable Performance for Every Edge Application\n\n**Left Column:**\nPower Efficiency\nAmITX-ALN\nDDR4\nPCIe 3.0\n12-28V DC-in\n\n**Middle Column:**\nEfficient Computing\nAmITX-RL-WV / NEW\n14th-12th Gen Intel® Core™ CPUs,\nU610 Chipset\nDDR4\nPCIe 4.0\n12-28V DC-in\n\n**Right Column:**\nHigh-Performance\nAmITX-RL-I\n14th-12th Gen Intel® Core™ CPUs,\nQ670 Chipset\nDDR5\nPCIe 5.0\nATX PWR or 12V DC-In\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-045.jpg)

## Slide 46

![The slide presents a comparison table of three ADLINK AMICAITX series motherboards, organized into three columns.\n\n**Column 1: AmITX-ALN**\n*   **Subtitle:** Power Efficiency\n*   **Price:** (\\$)\n*   **Target User:** Ideal for low power consumption\n*   **CPU:** Intel® N97 SoC\n*   **Chipset:** -\n*   **DRAM:** DDR4\n*   **PCIe®:** PCIe 3.0\n*   **CPU PCIe Bifurcation:** x1 only\n*   **SATA:** 1\n*   **TPM:** TPM header\n*   **M.2:** 3\n*   **Certification:** CE & FCC Class B\n*   **Sustainability Features:** Thin and low power consumption\n*   **Power Input:** 12-28V DC-In\n\n**Column 2: AmITX-RL-W**\n*   **Tag:** /NEW/ (in red)\n*   **Subtitle:** Efficient Computing\n*   **Price:** (\\$) (\\$)\n*   **Target User:** Efficient Computing enthusiasts\n*   **CPU:** 14/13/12th Gen Intel® Core™\n*   **Chipset:** H610\n*   **DRAM:** DDR4\n*   **PCIe®:** PCIe 4.0\n*   **CPU PCIe Bifurcation:** one x16\n*   **SATA:** 2\n*   **TPM:** Yes\n*   **M.2:** 3\n*   **Certification:** CE & FCC Class B\n*   **Sustainability Features:** Low-profile design with efficient performance\n*   **Power Input:** 12-28V DC-In\n\n**Column 3: AmITX-RL-I**\n*   **Subtitle:** High-Performance\n*   **Price:** (\\$) (\\$) (\\$)\n*   **Target User:** High-performance enthusiasts\n*   **CPU:** 14/13/12th Gen Intel® Core™\n*   **Chipset:** Q670\n*   **DRAM:** DDR5\n*   **PCIe®:** PCIe 5.0\n*   **CPU PCIe Bifurcation:** one x16 or two x8\n*   **SATA:** 4\n*   **TPM:** Yes\n*   **M.2:** 4\n*   **Certification:** CE & FCC Class B\n*   **Sustainability Features:** Premium build quality for peak performance\n*   **Power Input:** ATX PWR or 12V DC-In\n\n**Footer:** ADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-046.jpg)

## Slide 47

![**Header and Logos:**\nNew Product\nintel prestige partner\nWindows 11\nWindows 10\nUbuntu\n\n**Main Title and Description:**\nAmITX-RL-WV\nNEW\nWide-voltage Mini-ITX with PCIe 4.0 for power-flexible, scalable edge deployments.\n\n**Features (Left to Right Columns):**\n\n**High Performance**\nSupports 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 Processors\nPCIe 4.0, DDR4 3200 MHz, up to 64GB\n\n**Industrial Connectivity**\n2.5 GbE LAN\nUSB 3.2 Gen2\nM.2 B-key, E-key, M-key\nCOM RS485/422/232\nSATA\n\n**Flexible Expansion**\nPCIe 4.0 x16 slot for add-on cards\n\n**Power Flexibility**\nWide range DC input 12V to 28V\nCompatible with standard mini-ITX chassis\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-047.jpg)

## Slide 48

![**Header:**\nStar Product\nintel prestige partner\nWindows 11\nWindows 10\nUbuntu\n\n**Main Title & Description:**\nAmITX-RL-I\nHigh-Performance Computing with PCIe 5.0 and DDR5.\nSupports 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 Processors, up to 65W TDP.\n\n**Feature Columns:**\n\n**Extreme Performance**\n*   Supports 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 Processors\n*   PCIe 5.0, DDR5 4800 MHz, up to 64GB\n\n**Abundant Connectivity**\n*   2.5 GbE LAN\n*   USB 3.2 Gen2\n*   M.2 B-key, E-key, M-key\n*   COM RS485/422/232\n*   SATA\n\n**GPU Integration**\n*   PCIe 5.0 x16, support GPU cards\n\n**Superior Integration**\n*   ATX (24+4 pin) or ATX 4pin 12V DC-in\n*   Compatible with standard mini-ITX chassis\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-048.jpg)

## Slide 49

![This slide is titled **'Star Product'** and displays logos for **intel prestige partner**, **Windows 11**, **Windows 10**, and **Ubuntu** in the top right corner.\n\nThe central heading is **AmITX-ALN**, accompanied by the description: 'Power efficient computing with Intel® N97 processor with ultra-low 12W power consumption. Ensuring efficient multitasking and robust performance for industrial applications.'\n\nBelow are three columns detailing features:\n\n**Ultra-Low Power**\n*   Intel® N97 Processor with ultra-low 12W power consumption\n*   RAM- DDR4 3200, up to 32GB\n*   PCIe 3.0 x1\n\n**Rich Connectivity**\n*   2.5 GbE LAN\n*   USB 3.2 Gen2\n*   M.2 B-key, E-key, M-key,\n*   COM RS485/422/232\n*   SATA\n\n**Seamless Integration**\n*   Wide range DC input 12V to 28V\n*   Compatible with standard Mini-ITX chassis\n\nThe bottom left corner contains the logo text: **ADLINK | Leading Edge Computing**.](.ecp-introduction-2026q2/slide-049.jpg)

## Slide 50

![**Slide Title & Header:**\n*   **Title:** IPC Roadmap\n*   **Subtitle:** AmITX / AmSTX\n*   **Logo:** ADLINK LEADING EDGE COMPUTING\n*   **Footer:** ADLINK | Leading Edge Computing\n\n**Timeline & Categories:**\n*   **Status Tabs (Top Right):** Released / M, Under, Under\n*   **Form Factors (Left Axis):** X, ITX\n*   **Timeline (Bottom Axis):** Available, 2026 H1, 2026 H2, 2027\n\n**Product Content by Timeline Column:**\n\n**Available (Red Tags):**\n*   AmSTX-CF\n*   AmITX-CF-\n    I\n*   AmITX-AL\n    I\n*   AmITX-RL-\n    I\n*   AmITX-RL\n*   AmITX-ALN\n\n**2026 H1 (Blue Tag):**\n*   **AmITX-RL-WV-**\n    Raptor Lake-S Refresh,\n    H610\n    DDR5, Low-profile, 12~28V\n\n**2026 H2 / 2027 (Green Tags):**\n*   **AmSTX-NL**\n    Nova Lake-S, MXM Gen4\n    x16\n*   **AmITX-RL-**\n    Raptor Lake-S Refresh,\n    W680\n    DDR5, Low-profile, 12~28V\n*   **AmITX-**\n    Nova Lake-S, Q970\n    DDR5, ATX / 12V DC-in\n*   **AmITX-NVL-**\n    Nova Lake-S,\n    B960\n    DDR5, Low\n    profile\n    12 - 28V DC-in](.ecp-introduction-2026q2/slide-050.jpg)

## Slide 51

![This slide features a presentation layout divided into a text-heavy left panel and a visual right panel.\n\n**Text Content:**\n*   **Header:** A large white '02' appears in the top left.\n*   **Title:** 'Matrix Series'\n*   **Subtitle:** 'Intelligent Embedded Computing for Industrial Automation'\n*   **Logo:** The top right corner displays the 'ADLINK' logo with the tagline 'LEADING EDGE COMPUTING'.\n*   **Icon Label:** One icon contains the text 'IOT'.\n\n**Visual Elements:**\n*   **Products:** The bottom left displays four black industrial computer units (embedded systems) of varying shapes and sizes, showcasing rear ports and heatsinks.\n*   **Background:** The right side features a blurred image of a person interacting with a holographic or transparent digital interface.\n*   **Icons:** The bottom right corner features eight circular icons representing technical features, including a thermometer, stopwatch, fanless symbol, connectivity arrows, IoT cloud, security shield, delivery box, and power battery.](.ecp-introduction-2026q2/slide-051.jpg)

## Slide 52

![This slide features a futuristic, blue-toned background resembling a digital tunnel. Five industrial computer units of varying sizes and designs are displayed in the center, ranging from small black boxes to larger units with cooling fins and antennas.\n\nThe main title at the top reads: **'Shaping the Future with Matrix Series'**\n\nThe bottom section contains a dark teal banner divided into four columns with the following text:\n\n**Flexible I/O and Expansion**\n*   Application specific connectors\n*   Add-on expansion slots\n\n**Versatile Platform Options**\n*   Featuring Intel® Core™, Atom® & Mediatek processors\n*   Integrated NVIDIA Ampere GPUs\n*   Multiple form factors\n\n**Resilient Engineering**\n*   -20 to 60°C fanless operating temperature\n*   Shock and vibration resistant\n*   Stainless steel enclosure, corrosion-resistant\n\n**Application Focused Design**\n*   Customizable I/O via AFM\n*   Modular motion, vision, and frame grabber cards\n*   Industrial-grade cameras and peripheral](.ecp-introduction-2026q2/slide-052.jpg)

## Slide 53

![This slide is titled 'Intelligent Embedded Computing for Industrial Automation' with a stylized automation icon. It presents three columns of industrial computer hardware categorized by their features:\n\n1.  **Left Column:** Labeled 'Versatile & High-Performance' at the top and 'MVP Series' at the bottom, displaying three industrial computers (two beige, one black).\n2.  **Middle Column:** Labeled 'Compact & Energy-Efficient' at the top and 'MXE/MXA Series' at the bottom, displaying three black industrial computers.\n3.  **Right Column:** Labeled 'Cost-Effective' at the top and 'MXC Series' at the bottom, displaying two black industrial computers.\n\nThe bottom left corner features the logo 'ADLINK | Leading Edge Computing,' and the bottom right corner shows the 'MATRIX' logo.](.ecp-introduction-2026q2/slide-053.jpg)

## Slide 54

![The slide features the large background text '**MVP**' and the sub-header '**Versatile and High-Performing**'. Below this are three columns detailing features with icons:\n\n*   **Versatile Function Expansion**: Bullet point text reads 'Optional from 0 slot to 2 slots'.\n*   **Unlimited I/O Expandability**: Bullet point text reads 'Customized Adaptive Function Module (AFM)'.\n*   **High Performance**: Bullet point text reads 'Intel Core I Processor'.\n\nTo the right are images of three industrial computer units labeled '**ADLINK**' and '**MATRIX**'.\n\nAt the bottom right are logos for '**Windows**', '**Canonical Ubuntu**', and '**intel prestige partner**'.\n\nThe bottom left footer reads '**ADLINK | Leading Edge AI Computing**'.](.ecp-introduction-2026q2/slide-054.jpg)

## Slide 55

![**Star Product**\n\n**MVP-3120**\n**MVP-3100**\n\n**MVP-3100**\n**Series**\nCompact, Fanless, and Economical Embedded System with Intel® Core™ 200S Series and 14/13/12th Gen Core™\nProcessors, Offering Expandability and Exceptional Value\n\n**Windows**\n**Canonical Ubuntu**\n**intel prestige partner**\n\n**High Performance**\n*   Intel® Core™ Processor, up to 16 cores and 24 threads\n*   64GB DDR5 4800MHz memory SO-DIMM\n\n**Modular Design**\n*   Compact dimension (192 x 240 x 77.2mm)\n*   Easy to upgrade memory and storage\n*   Support custom basic function module\n*   Effortless expansion with quick configuration via standard PCIe slots\n\n**Geared for Industrial Applications**\n*   High performance with fanless design\n*   Various IO interfaces (4x LAN, 8x USB2, RS-232/422/485 COM)\n*   -20 to 60°C operating temperature range\n*   Compact Design, Space-Saving\n\n**ADLINK | Leading Edge AI Computing**](.ecp-introduction-2026q2/slide-055.jpg)

## Slide 56

![**Slide Content Description**\n\n**Left Panel (Red Background):**\n*   **Logo:** A white circle containing a gear and puzzle piece icon with the text 'Quick Set'.\n*   **Headline:** 'Simplifying System Configuration with Flexible Modularity'\n*   **Body Text:** 'QuickSet is ADLINK's signature modular design feature, enabling industrial users to build, configure, and scale with confidence. Whether creating a new system or upgrading an existing one, its intuitive setup delivers tool-free, plug-and-play access to CPU, memory, and storage. Built on the Matrix product line's rugged architecture, QuickSet™ is proven to reduce deployment time and streamline field maintenance.'\n*   **Bullet Points:**\n    *   '→ Easy to assembly'\n    *   '→ Easy to install CPU and other parts'\n    *   '→ Easy to upgrade memory and storage'\n\n**Right Panel (Dark Blue Background):**\nThis section illustrates a three-step process labeled in large red text:\n1.  **Lift:** Accompanied by the text 'Lift top cover with only 8 screws' and an image of a heatsink/top cover being removed from a chassis.\n2.  **Swap:** Accompanied by the text 'Easy maintenance & reconfigurations for any setup'. The image shows an open chassis with labels pointing to 'CPU', 'Memory', and 'M.2 SSD'.\n3.  **GO:** Accompanied by the text 'Field-ready in minutes'. The image shows a fully assembled unit.\n\n**Footer:**\n'ADLINK | Leading Edge AI Computing'](.ecp-introduction-2026q2/slide-056.jpg)

## Slide 57

![The slide presents a comparison between two product lines, separated by a large 'VS' graphic.\n\n**Left Side:**\n*   **Header:** MVP-3100 Series\n*   **Table Content:**\n    *   \\$\\$\\$\n    *   H610E\n    *   2x DDR5 4800 SODIMM, up to 64GB\n    *   1x E Key 2230 (PCIe Gen3x1)\n        1x M Key 2280 (PCIe Gen3x2)\n    *   1x 2.5GbE\n        3x 1.0GbE\n    *   4x USB 3.2 Gen 1\n        4x USB 2.0\n    *   2\n\n**Center Column (Red Background):**\n*   Price\n*   PCH\n*   Memory\n*   M.2\n*   Ethernet\n*   USB\n*   Expansion Slot\n\n**Right Side:**\n*   **Header:** MVP-5200/6200 Series\n*   **Table Content:**\n    *   \\$\\$\\$\\$\\$\n    *   R680E\n    *   4x DDR5 3600 SODIMM, up to 192GB\n    *   1x E Key 2230 (PCIe Gen3x1)\n        1 x B key 3042/3052 (PCIe Gen3x1, USB)\n        1x M Key 2280 (PCIe Gen4x4 and SATA)\n    *   3x 2.5GbE\n    *   6x USB 3.2 Gen 2\n    *   2/4\n\n**Footer:**\nADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-057.jpg)

## Slide 58

![The slide presents a comparison table for three computer models:\n\n**MVP-310**\n**0**\n\n**VS**\n\n**MIC-770**\n**V3**\n\n**IPC92**\n**0**\n\n**Table Content:**\n\n*   **Intel® Core™ 200S Series and 14/13/12th Gen Core™** | **CPU** | **14th/13th/12th gen Intel® Core™ processor**\n*   **H610E** | **Chipset** | **H610E**\n*   **Dual-channel DDR5, up to 96GB** | **Memory** | **Dual-channel DDR5, up to 96GB**\n*   **1x DisplayPort** | **Display** | **1x VGA** | **1x DisplayPort**\n*   **1x HDMI** | | **1x HDMI** | **1x HDMI**\n*   **1x 2.5GbE** | **Ethernet** | **2x 1.0GbE** | **2x 2.5GbE**\n*   **3x 1.0GbE** | | | **1x 1.0GbE**\n*   **4 x USB 3.2 Gen1** | **USB** | **4 x USB 3.2 Gen1** | **2x USB 3.2 Gen2**\n*   **4 x USB 2.0** | | **4 x USB 2.0** | **2x USB 3.2 Gen1**\n*   **2 x 2.5' HDD/SSD** | **Storage** | **2 x 2.5' HDD/SSD** | **2 x 2.5' HDD/SSD**\n*   **1 x M.2 M-Key 2280 socket (PCIe)** | | **1 x M.2 M-Key 2280 socket (PCIe)** | **1 x M.2 M-Key 2280 socket (PCIe)**\n*   **12-24V** | **Power Input** | **9-36V** | **18-36V**\n*   **-20°C to +60°C** | **Operating Temperature** | **-20°C to +60°C**\n*   **5Grms, random, 5-500Hz** | **Vibration** | **3Grms, random, 5-500 Hz** | **3Grms, random, 5-500 Hz**\n*   **50G, 11ms** | **Shock** | **20G, 11ms** | **50G, 11ms**\n\n**Footer:**\nAdvantech Leading Edge Computing](.ecp-introduction-2026q2/slide-058.jpg)

## Slide 59

![This slide presents information about industrial computers under the header 'Star Product.'\n\n**Main Title and Specifications:**\n*   **MVP-5200/**\n*   Intel® Core™ 200S Series and 14/13/12th Gen Core™\n*   Processors\n*   **MVP-6200**\n*   Largest Modular Industrial Computers\n\n**Operating System and Partner Logos (Right Side):**\n*   Windows\n*   Canonical Ubuntu\n*   intel prestige partner\n\n**Key Features (Three Columns):**\n\n*   **Unmatched Performance**\n    *   Latest Intel® Core™ S200 Series processor\n    *   Support 8+8 cores, up to 65W TDP CPU\n\n*   **Ultimate Flexibility**\n    *   Optional 2 or 4 slots allows for effortless expansion\n    *   Optional FM modules for domain-specific customization\n\n*   **Edge AI-Ready Platform**\n    *   Built-in GPU power for AI-driven applications\n    *   Built-in machine vision capabilities for high-performance\n    *   AI applications\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-059.jpg)

## Slide 60

![The slide presents a comparison table featuring three computer models: MVP-520, MIC-770, and IPC92.\n\n**Header Section:**\n*   **Left:** Image of a black computer unit labeled 'MVP-520' and '0'.\n*   **Center:** Large white text 'VS'.\n*   **Right:** Images of two computer units. The first is labeled 'MIC-770' and 'V3'. The second is labeled 'IPC92' and '0'.\n\n**Comparison Table:**\nThe table is divided into three main sections: specifications for MVP-520 (left), category names in a red column (center), and specifications for MIC-770 and IPC92 (right).\n\n**Rows:**\n*   **CPU:**\n    *   MVP-520: Intel® Core™ 200S Series and 14/13/12th Gen Core™\n    *   Category: CPU (Red Background)\n    *   MIC-770/IPC92: 14th/13th/12th gen Intel® Core™ processor\n*   **Chipset:**\n    *   MVP-520: R680E (Red Star icon)\n    *   Category: Chipset (Red Background)\n    *   MIC-770: H610E\n*   **Memory:**\n    *   MVP-520: 4-channel DDR5, up to 192GB\n    *   Category: Memory (Red Background)\n    *   MIC-770: Dual-channel DDR5, up to 96GB\n*   **Display:**\n    *   MVP-520: 2x DisplayPort (Red Star icon), 2x HDMI\n    *   Category: Display (Red Background)\n    *   MIC-770: 1x VGA, 1x HDMI\n    *   IPC92: 1x DisplayPort, 1x HDMI\n*   **Ethernet:**\n    *   MVP-520: 3x 2.5GbE (Red Star icon)\n    *   Category: Ethernet (Red Background)\n    *   MIC-770: 2x 1.0GbE\n    *   IPC92: 2x 2.5GbE, 1x 1.0GbE\n*   **USB:**\n    *   MVP-520: 6x USB 3.2 Gen2 (Red Star icon)\n    *   Category: USB (Red Background)\n    *   MIC-770: 4 x USB 3.2 Gen1, 4 x USB 2.0\n    *   IPC92: 2x USB 3.2 Gen2, 2x USB 3.2 Gen1\n*   **Storage:**\n    *   MVP-520: 2 x 2.5' HDD/SSD, 1 x M.2 M-Key 2280 socket (PCIe)\n    *   Category: Storage (Red Background)\n    *   MIC-770: 2 x 2.5' HDD/SSD, 1 x M.2 M-Key 2280 socket (PCIe)\n    *   IPC92: 2 x 2.5' HDD/SSD, 1 x M.2 M-Key 2280 socket (PCIe)\n*   **Power Input:**\n    *   MVP-520: 9-36V (Red Star icon)\n    *   Category: Power Input (Red Background)\n    *   MIC-770: 9-36V\n    *   IPC92: 18-36V\n*   **Operating Temperature:**\n    *   MVP-520: -20°C to +60°C (Red Star icon)\n    *   Category: Operating Temperature (Red Background)\n    *   MIC-770: -20°C to +60°C\n*   **Vibration:**\n    *   MVP-520: 5Grms, random, 5-500Hz (Red Star icon)\n    *   Category: Vibration (Red Background)\n    *   MIC-770: 3Grms, random, 5-500 Hz\n    *   IPC92: 3Grms, random, 5-500 Hz\n*   **Shock:**\n    *   MVP-520: 50G, 11ms\n    *   Category: Shock (Red Background)\n    *   MIC-770: 20G, 11ms\n    *   IPC92: 50G, 11ms\n\n**Footer:**\n*   Bottom left corner: 'ADLINK Leading Edge Computing'](.ecp-introduction-2026q2/slide-060.jpg)

## Slide 61

![The slide features the headline: 'Build Your Own System with Limitless Functional Expansion!'\n\nIn the center is a black industrial computer unit labeled 'Matrix' with the 'ADLINK' logo. Surrounding it are exploded views of hardware components with labels:\n*   'Add-on Expansion Slots' (pointing to a top-left circuit board)\n*   'Std. Industrial I/O Ports' (pointing to a section of the board below)\n*   'AFM' (printed on a green circuit board at the bottom)\n*   'Integrated Circuit' (pointing to a circuit board on the right)\n\nThe footer reads: 'ADLINK | Leading Edge AI Computing'](.ecp-introduction-2026q2/slide-061.jpg)

## Slide 62

![**Header:** Matrix Roadmap, MVP Series\n\n**Timeline Columns:**\n\n*   **Available (Red Labels):**\n    *   MVP-6200: Intel® Core™ 12/13/14th Configurable Box IPC\n    *   MVP-5200: Intel® Core™ 12/13/14th Fanless Compact Box PC\n    *   MVP-3100: Intel® Core™ 12/13/14th Configurable Box IPC\n    *   MVP-6100: Intel® Core™ 8/9th Gen Configurable Box IPC\n    *   MVP-5100: Intel® Core™ 8/9th Gen Fanless Compact Box PC\n    *   Status Tag: Released / M\n\n*   **2026 H1 (Blue Labels):**\n    *   MVP-6200: Intel® Core™ 200S series Configurable Box IPC\n    *   MVP-5200: Intel® Core™ 200S series Fanless Compact Box PC\n    *   MVP-3100: Intel® Core™ 200S series Configurable Box IPC\n    *   Status Tag: Under\n\n*   **2027 (Green Labels):**\n    *   MVP-6300: Nova Lake-S Configurable Box IPC\n    *   MVP-5300: Nova Lake-S Fanless Compact Box PC\n    *   Status Tag: Under\n\n**Axis Labels:** MVP (Y-axis), Available, 2026 H1, 2026 H2, 2027 (X-axis)\n\n**Footer:** ADLINK | Leading Edge AI Computing, 62](.ecp-introduction-2026q2/slide-062.jpg)

## Slide 63

![The slide features the title **MXE/MXA** with a red banner underneath reading **Compact and Energy Efficient**.\n\nBelow three circular icons, three key features are listed:\n*   **Compact Form Factor**: 'Palm-sized and easy to install'\n*   **Customizable I/O**: 'Customized Adaptive Function Module (AFM)'\n*   **Atom-based Platform**: 'Energy efficient'\n\nOn the right side, three small black computer units are displayed; the front-most unit has 'Matrix' and 'ADLINK' labels.\n\nAt the bottom, logos for **Windows**, **Canonical Ubuntu**, and **intel prestige partner** are shown. The footer text reads '**ADLINK | Leading Edge AI Computing**'.](.ecp-introduction-2026q2/slide-063.jpg)

## Slide 64

![This slide presents a product announcement for the **MXE-330**.\n\n**Header and Imagery:**\n*   Top left corner: **'New Product'** in blue text next to a blue graphic.\n*   Below the header is a horizontal strip of three images depicting industrial automation, a medical surgical environment, and a retail kiosk interface.\n*   To the right, a blurred image shows the black hardware device itself.\n\n**Main Title and Description:**\n*   Large bold text: **'MXE-330'** followed by a red tag reading **'/ NEW'**.\n*   Subtext: **'Compact, Fanless, and Economical Embedded System with Intel® Core™ Ultra Series 3 Processors, Offering Expandability and Exceptional Value'** (with the processor name highlighted in red).\n*   Logos for **Windows**, **Canonical Ubuntu**, and **intel prestige partner** are displayed on the right.\n\n**Feature Columns:**\nThe bottom half features three columns detailing specifications:\n\n1.  **High-Performance AI Computing**\n    *   **'AI Power : 50 NPU TOPS/12 Xe-Cores'**\n\n2.  **Durable Space-saving Construction**\n    *   **'Compact dimensions at 165 x 150 x 63 mm with an embedded 3.5” SBC'**\n    *   **'Reliable, fanless operation in temperatures ranging from -20°C to 60°C'**\n\n3.  **Flexible I/O Scalability**\n    *   **'Compatible with Type-C, DP, and HDMI display connections'**\n    *   **'Various expansion slots including M.2 B-Key, E-Key, and M-Key options'**\n\n**Footer:**\n*   Bottom left text: **'ADLINK | Leading Edge AI Computing'**](.ecp-introduction-2026q2/slide-064.jpg)

## Slide 65

![**New Product**\n\n**MXE-310** **NEW**\n\nCompact, Fanless, and Economical Embedded System with 13th Gen Intel® Processors, Offering Expandability and Exceptional Value\n\n**(Product Image Labels)**\nMATRIX\nADLINK\nPower\nUSB 3.0\nReset\nCOM 1\nHDMI\nDisplay Port\nType-C\n2 - LAN - 1\n12-24 VDC\nUSB 2.0\nUSB 2.0\nUSB 2.0\nCOM 2\nAT11\nWLAN\n\n**(Logos)**\nWindows\nCanonical Ubuntu\nintel prestige partner\n\n**High-Performance AI Computing**\n*   Powerful 13th Gen Intel® Core™i7, i5, or i3 processor option\n*   DualDDR5 4800MHz memory, up to 64GB\n*   Integrated Hailo AI accelerator with 26-40 TOPS\n*   Integrated TPM 2.0 for enhanced security\n\n**Durable Space-saving Construction**\n*   Compact dimensions at 180 x 130 x 70 mm (1.64L) with an embedded 3.5” SBC\n*   Reliable, fanless operation in temperatures ranging from -20°C to 60°C\n\n**Flexible I/O Scalability**\n*   Compatible with Type-C, DP, and HDMI display connections\n*   Expandable to 2-6 LAN ports with customizable Adaptive Function Modules, based on configuration\n*   Various expansion slots including M.2 B-Key, E-Key, and M-Key options\n\nADLINK Leading Edge AI Computing](.ecp-introduction-2026q2/slide-065.jpg)

## Slide 66

![**Header:**\nStar Product\n\n**Main Title & Subtitle:**\nMXE-230 NEW\nUltra-Compact, Fanless, Low-Power Edge Computing Platform with Intel processor N-series & Atom X-series\n\n**Device Image Labels:**\nMatrix\nADLINK\n12-24 VDC\nUSB 2.0\nDisplay Port\nHDMI\nLAN 2\nLAN 1\nCOM 2\nCOM 1\nUSB 2.0\nUSB 3.0\nU1\nPower\nReset\nANT 1\nANT 2\n\n**Logos:**\nWindows\nCanonical Ubuntu\nintel prestige partner\n\n**Column 1:**\nLow-Power Consumption\n- Intel® Processor N97 with 12W low power consumption\n- Up to 16GB of DDR5 4800MHz memory\n- In-Band ECC support for enhanced data integrity\n- Integrated TPM 2.0 for security\nADLINK | Leading Edge AI Computing\n\n**Column 2:**\nSmall and Durable Construction\n- Space-saving design measuring 165 x 120 x 62 mm (1.2L) with an embedded 3.5” SBC\n- Reliable, fanless operation in temperatures ranging from -20°C to 60°C\n- Easy maintenance through top cover opening\n\n**Column 3:**\nVersatile I/O and AI Expandability\n- Extensive I/O options, including exclusive, customizable Adaptive Function Modules and M.2 slots, tailored to customer applications\n- Integrated with Hailo-8 AI accelerator offering 26 TOPS\n- Dual 4K 60fps display outputs for advanced visual applications](.ecp-introduction-2026q2/slide-066.jpg)

## Slide 67

![**New Product**\n\n**MXA-312M** **NEW**\nUltra-Compact, Fanless, Low-Power Edge Computing Platform with MediaTek Genio 520 & Genio 720.\n\n(Device Image Text)\nPWR\nWIFI\nLAN 2\nLAN 1\nUSB3.1\nHDMI 2\nRST\nANT\nADLINK\nUSB2.0\nHDMI 1\nANT\n\n(Inset Circle Text)\nMediaTek Genio 520\nMediaTek Genio 720\n\n**Low-Power Consumption**\n*   MediaTek Genio 520 & 720\n*   12W low power consumption, Idle mode (5W\n*   Up to 8GB of DDR5 4800MHz memory\n*   Integrated TPM 2.0 for security\n\n**Compact and Easy to Maintain**\n*   120 x 90 x 40 mm with an embedded 2.5” Pico ITX single board\n*   Fanless for -20° to 70°C operating temperature\n*   Easy maintenance through top cover opening\n\n**Versatile I/O and AI Expandability**\n*   Extensive I/O options, including exclusive, customizable Adaptive Function Modules (AFM)\n*   Dual HDMI display outputs for advanced visual applications, up to 4K, 60fps\n*   Up to 10 TOPS AI computing power\n\n**ADLINK | Leading Edge AI Computing**](.ecp-introduction-2026q2/slide-067.jpg)

## Slide 68

![The slide is titled '**Ultra-Compact and High Efficiency Designs**' against a dark blue background.\n\nIn the center, a black ADLINK device rests on a wireframe hand graphic. Yellow dimension lines indicate its size: **120 mm** (length), **90 mm** (width), and **40 mm** (height).\n\nSurrounding the device are three key features:\n*   **Left (Lightning Icon):** Text reads '**Low-Power Consumption 12W**'. Below this is a fan icon with the text '**Fanles**' on one line and '**s**' on the line below.\n*   **Right (Thermometer Icon):** Text reads '**Wide Operating Temperature -20° to 70°C**'.\n\nThe bottom left corner displays the logo and text '**ADLINK | Leading Edge AI Computing**'. The bottom right corner shows the page number '**68**'.](.ecp-introduction-2026q2/slide-068.jpg)

## Slide 69

![This slide features a presentation graphic titled 'Dual HDMI Monitors with 4K High Resolution'.\n\nBelow the title are two monitor screens displaying digital coffee menus:\n*   **Left Screen:** Displays 'YOUR LOGO', 'NEW BLENDS!', 'DARK ROAST', 'CARAMEL CREAM LATTE', 'HAZELNUT HEAVEN', 'COCO BLISS', and 'CONNECT TO WIFI'.\n*   **Right Screen:** Displays 'YOUR LOGO', 'NEW BREW!', a 'COFFEE' list (including 'CLASSIC ICED COFFEE', 'VANILLA ICED LATTE', 'ICED MACCHIATO', 'ICED MOCHA', 'PEPPERMINT ICED BREW', 'ICED CINNAMON LATTE', 'ICED HAZELNUT LATTE'), and a 'COLD DRINKS' list (including 'CHOCO-HAZELNUT', 'CHOCOLATE ICED LATTE', 'WHITE CHOCOLATE', 'CARAMEL SWIRL', 'CHILLED MOCHA TRUFFLE', 'CHOCOLATE BANANA', 'CHOCOLATE RASPBERRY', 'CLASSIC ICED TEA', 'GINGER LIME', 'BLUEBERRY ICED TEA', 'CUCUMBER MINT'), and 'CONNECT TO WIFI'.\n\nBelow the monitors is a black ADLINK device with the following labeled ports and buttons: 'PWR', 'WIFI', 'LAN 2', 'LAN 1', 'USB3.1', 'USB2.0', 'RST', 'ANT', 'HDMI 2', and 'HDMI 1'.\n\nTwo yellow boxes labeled '4K' connect via blue lines from the HDMI ports to the respective monitors.\n\nThe bottom left corner reads: 'ADLINK | Leading Edge AI Computing'.](.ecp-introduction-2026q2/slide-069.jpg)

## Slide 70

![**Slide Title & Subtitle:**\nExclusive Adaptive Function Module (AFM)\nCustomized Options Based on Project Needs, Accelerated Time-to-Market\n\n**Left Section:**\n*   **Top Unit:** PWR, WIFI, LAN 2, LAN 1, USB3.1, HDMI 2, ANT, RST, USB2.0, HDMI 1, ADLINK, ANT.\n*   **Symbol:** +\n*   **Bottom Module:** RS232, RS232, RS485, RS485.\n*   **Label:** AFM\n*   **Arrows:** )))\n\n**Middle Section:**\n*   **Top Unit (Highlighted):** PWR, WIFI, LAN 2, LAN 1, USB3.1, HDMI 2, ANT, RST, ADLINK, USB2.0, HDMI 1, ANT, SIM, WWAN.\n*   **Label:** AFM: LTE\n*   **Bottom Unit (Highlighted):** PWR, WIFI, LAN 2, LAN 1, USB3.1, HDMI 2, ANT, RST, ADLINK, USB2.0, HDMI 1, RS232, RS232, RS485, RS485.\n*   **Label:** AFM: 4x COM\n\n**Right Section:**\n*   **Unit:** PWR, WIFI, LAN 2, LAN 1, USB3.1, HDMI 2, ANT, RST, ADLINK, USB2.0, HDMI 1, ANT.\n*   **Graphic:** ? (inside a yellow box)\n*   **Text:** OR...\n*   **Description:** Customizable I/O for CAN, LAN, DI/DO](.ecp-introduction-2026q2/slide-070.jpg)

## Slide 71

![**Title:** Matrix Roadmap MXE/MXA\n**Logo:** ADLINK LEADING EDGE COMPUTING\n\n**Status Legend:**\n*   Released / M\n*   Under\n*   Under\n\n**Released Products (Red):**\n*   MXE-310\n*   MXE-210\n*   MXE-230\n*   MXA-312M\n*   MediaTek Genio 520 & Genio 720.\n\n**Under Development (Blue - 2026 H1):**\n*   MXE-320\n*   Meteor Lake U, DDR5, USB, COM, 3x M.2 expansion slot, MIPI, 12~24V DC\n\n**Under Development (Green - 2027):**\n*   MXE-330\n*   Panther Lake, DDR5, USB, COM, 3x M.2 expansion slot, MIPI, 12~24V DC\n*   MXE-240\n*   Wildcat Lake DDR5, USB, COM, 3x M.2 expansion slot, MIPI, 12~24V DC\n\n**Timeline:**\n*   Available\n*   2026 H1\n*   2026 H2\n*   2027\n\n**Y-Axis Label:**\n*   MXE/MXA\n*   A\n\n**Footer:**\n*   ADLINK | Leading Edge Computing](.ecp-introduction-2026q2/slide-071.jpg)

## Slide 72

![The slide features the large background text '**MXC**'. Below it, a red banner reads '**Cost-Effective**'.\n\nThree columns of features are listed on the left side, each under a circular icon:\n*   **Cost-Effective Solution**: Bullet point reads '**Intel Atom-based**'.\n*   **Core I/O Interface**: Bullet point reads '**Selected I/O to fulfill application needs**'.\n*   **Versatile Function Expansion**: Bullet point reads '**Optional from 0 slot to 4 slots**'.\n\nOn the right side, two black industrial computers are displayed; the vertical unit is labeled '**Matrix**' and '**ADLINK**', while the horizontal unit is labeled '**Matrix**' and '**ADLINK**'.\n\nThe footer text reads: '**ADLINK | Leading Edge AI Computing**'.](.ecp-introduction-2026q2/slide-072.jpg)

## Slide 73

![**Header:**\nNew Product\n\n**Main Title & Description:**\nMXC-3300/334 (NEW tag)\nCompact, Fanless, and Economical Embedded System with 14/13/12th Gen Intel® Processors, Offering Expandability and Exceptional Value\n\n**Product Labels (right side):**\nMXC-334\n0\nMXC-330\n0\n\n**Feature Columns:**\n\n**Industrial-Grade Reliability**\n*   Powerful Intel® N97 (MXC-3300) and Intel® Atom x7433RE (MXC-3340)\n*   Dual DDR4 memory, up to 32GB\n*   Dual Gigabit Ethernet ports\n\n**Versatile & Scalable Connectivity**\n*   Multiple USB 3.2, USB 2.0, and serial ports (RS-232/422/485)\n*   Isolated RS-232/485 (MXC-3340)\n*   Flexible expansion with 3 PCIe slots (MXC3340)\n\n**Certified for Harsh Environments**\n*   Designed for -20°C to 60°C operation\n*   Marine-Grade Certification (MXC-3340)\n*   Rugged, Fanless Design\n*   Wide Power Input Range 9~36V DC\n\n**Footer:**\nADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-073.jpg)

## Slide 74

![**Left Panel Text:**\nFeature\nVersatile I/O Interface\nMXC-3300 Front View\n\n**Top Annotations:**\nDC\nLAN\nHDMI\nDPx2\n\n**Text Printed on Device Panel:**\n12-24 VDC\nCAN 1\nCAN 2\nHDMI\nDP++ 1\nDP++ 2\nLAN (appears three times)\nUSB 2\nUSB 3 Gen2\nCOM 1\nCOM 2\nDI / DO\nWD\nPOWER\nRESET\nADLINK\n\n**Bottom Summary List:**\nDIO\nUSB 3.2\nUSB 2.0\nCOM x2\nCAN x2\n\n**Footer:**\nADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-074.jpg)

## Slide 75

![This slide is titled **'Competitor Comparison'** and features a table comparing three industrial computing devices: **ADLINK MXC-3300**, **NEXCOM NISE-110-A01**, and **ADVANTECH U210K**.\n\n**Chipset:**\n*   **ADLINK:** Processor N97\n*   **NEXCOM:** Processor N97\n*   **ADVANTECH:** Processor N97\n\n**DRAM:**\n*   All three list: 1x DDR5 SO-DIMMs, 4800MHz\n\n**Video output:**\n*   **ADLINK:** 1x HDMI, 2x DP++\n*   **NEXCOM:** 1x HDMI, 1x DP\n*   **ADVANTECH:** Type-C, HDMI\n\n**LAN:**\n*   **ADLINK:** 4x Intel® I210 1Gbe\n*   **NEXCOM:** 3 x Intel® I226 2.5GbE\n*   **ADVANTECH:** 3 x Intel® I226 2.5GbE\n\n**USB:**\n*   **ADLINK:** 1x USB 3.2 Gen 1, 4x USB 2.0\n*   **NEXCOM:** 2x USB 3.2 Gen 1, 2x USB 2.0\n*   **ADVANTECH:** 4x USB 3.2 Gen 1, 4X USB 2.0\n\n**COM:**\n*   **ADLINK:** 2x RS-232/422/485 (Isolated 1.5KV) Optional : 4 x RS232/4222/485\n*   **NEXCOM:** 2x RS-232/422/485, 2x RS232\n*   **ADVANTECH:** 4x RS232\n\n**CAN:**\n*   **ADLINK:** 2x CANbus (Isolated 1.5KV)\n\n**Storage:**\n*   **ADLINK:** M.2 2280 M-key (PCIe x2) 2.5” SSD\n*   **NEXCOM:** Mini PCIe for mSAT A, M.2 SATA & PCIex2\n*   **ADVANTECH:** M.2 2280 M-key x2\n\n**DIO:**\n*   **ADLINK:** 8DI/8DI(Isolated 1.5KV)\n*   **NEXCOM:** Optional\n\n**M.2/Mini PCIe:**\n*   **ADLINK:** M.2 2280 M (PCIex2), M.2 2230 E Key supports (Wi-Fi(PCIex1), BT(USB)), M.2 3042/ 3052 B-key supports 4G/SIM card\n*   **NEXCOM:** M.2 2280 M (SATA, PCIex2), Mini PCIe socket support optional Wi-Fi/4G LTE modules, M.2 Key B socket support optional 5G/ 4G LTE/ Storage modules\n*   **ADVANTECH:** M.2 2230 E Key supports (Wi-Fi(PCIex1), BT(USB))\n\n**Operating temp.:**\n*   **ADLINK:** -20~60C, -20~70C (For 6W CPU), 0.6 m/s Airflow\n*   **NEXCOM:** -20~60C, -20~70C (For 6W CPU), With Airflow\n*   **ADVANTECH:** 0~45 with 0.7 m/s Airflow\n\n**Dimension:**\n*   **ADLINK:** 219(W)x 210(D) x 80(H) mm\n*   **NEXCOM:** 185(W) x 131(D) x 56(H) mm\n*   **ADVANTECH:** 234 (W) x 145.77(D) x 58(H) mm\n\n**Power Supply:**\n*   **ADLINK:** 9V-36V (+/- 5% tolerance)\n*   **NEXCOM:** 9~30V\n\n**Footer:** ADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-075.jpg)

## Slide 76

![This slide presents a product roadmap for the ADLINK MXC Series.\n\n**Top Section:**\n*   **Title:** Matrix Roadmap\n*   **Subtitle:** MXC Series\n*   **Logo:** ADLINK LEADING EDGE COMPUTING\n*   **Legend:** Three colored banners indicate status: 'Released / M', 'Under', and 'Under'.\n\n**Main Graph Area:**\n*   **Y-Axis:** Labeled 'MXC' beneath an icon of a server rack.\n*   **X-Axis:** Labeled 'Available'.\n*   **Product Entries (Red Banners):**\n    *   **Left:** MXC-6600\n    *   **Right:** MXC-3300/3340\n        *   **Description:** Intel® ATOM Amston Lake\n        *   **Description:** Compact Box IPC](.ecp-introduction-2026q2/slide-076.jpg)

## Slide 77

![The slide is titled **03 DLAP | ROScube Series** with the subtext: **Delivering 24/7 AI-powered edge computing with reliable industrial-grade environmental compliance**. The top right corner displays the logo **ADLINK LEADING EDGE COMPUTING**.\n\nVisually, the left side features a blue background displaying three industrial computing units: a tall black chassis, a small black box with visible ports, and a flat gray unit with heat sinks. The right side shows a close-up of a white industrial robotic arm. At the bottom right, four circular icons depict a fanless design, ruggedness, AI processing, and edge computing.](.ecp-introduction-2026q2/slide-077.jpg)

## Slide 78

![The slide is titled 'How Edge AI is Changing the Game Across Industries' with the subtitle 'Two Faces of AI: Generative and Discriminative Models Revealed'.\n\nThe central graphic features the text 'Generati / Discriminati' on the top line and 've / ve' on the line below, followed by a large 'A' and 'I'.\n\nSurrounding this text are five circular icons containing:\n*   'Synthetic Data Generation'\n*   'Text, video, image Generation'\n*   'Voice Synthesi s'\n*   'Image analysis'\n*   'Video analysis'\n\nAt the bottom, four images depict a human interacting with a robot, brain scans, microchip manufacturing, and a grid of security monitors.](.ecp-introduction-2026q2/slide-078.jpg)

## Slide 79

![The slide presents information about 'Pioneering Edge AI Systems' with the subtitle 'Empowering Real-Time and Future-Proof Intelligence at Every Edge.'\n\nIt displays a progression of hardware devices along a blue flow, labeled with technical icons:\n*   **SOC** (System on Chip)\n*   **MXM** (Mobile PCI Express Module)\n*   **PEG** (PCI Express Graphics) - appearing twice near different hardware units.\n*   **5** and **TOPS** (large diagonal text) and **50** (near the largest server unit).\n\nAt the bottom, three blue boxes highlight key features:\n1.  **AI-Integrated Systems:** 'GPU/accelerator-ready with pre-validated I/O for plug-and-play AI integration'\n2.  **Comprehensive Portfolio:** 'From low-power inference to large model training — scalable across all' (text cuts off)\n3.  **GenAI-Ready Design:** 'Optimized for vision AI, predictive analytics, and on-device LLM inference'\n\nPartnership logos at the bottom right include **AMD EPYC**, **intel prestige partner**, and **NVIDIA Elite Partner**.](.ecp-introduction-2026q2/slide-079.jpg)

## Slide 80

![**Title:** Deep Learning Acceleration Platforms\n\n**Top Section (Three Columns):**\n\n*   **AI Powerhouse with Industrial-Grade Resilience**\n    *   MXM/PEG cards (Intel)\n    *   Up to 275 TOPS (NVIDIA)\n    *   Fanless, expandable, and versatile I/O\n*   **Diverse Sensor Integration and Software Support**\n    *   Advanced sensor connectivity (OOB)\n    *   EVA & EdgeGO® SDKs for AI/remote management\n    *   Custom BSP for OS/SDK\n*   **Versatile Application Scope with AI**\n    *   Automating factories\n    *   Managing traffic, parking & public safety\n    *   Monitoring agriculture and aquaculture\n\n**Bottom Section (Two Panels):**\n\n*   **Compact Edge GenAI Platform (Green Panel)**\n    *   Powered by NVIDIA® Jetson Modules\n    *   Elite Partner (NVIDIA Logo)\n    *   aiDAPTIV+ (Logo)\n    *   Elevate AI Power with Phison aiDAPTIV+\n    *   NVIDIA JetPack SDK (Logo)\n    *   Gear up for NVIDIA Jetson Orin Super Mode\n*   **Expandable Edge AI Platform (Blue Panel)**\n    *   Powered by Intel® Core™ Processors\n    *   intel prestige partner (Logo)\n    *   Embedded MXM GPU Modules\n    *   PCI Express Graphics Cards\n\n**Footer/Additional Elements:**\n*   ADLINK (On robot head)\n*   ADLINK Leading Edge Computing (Bottom Left)\n*   80 (Bottom Right)](.ecp-introduction-2026q2/slide-080.jpg)

## Slide 81

![**Header:**\nThe slide features the title 'Expandable Edge AI Platform with Intel® Core™ Processor' in white text against a dark blue background. Below the title are four Intel Core logos (i7, i9, i5, i3). The background includes three angled images depicting an offshore oil rig, a surgical operating room, and a factory conveyor belt.\n\n**Left Section (Compact Edge AI Platform):**\nThis section displays two small, black industrial computers.\n*   **Text:** 'Compact Edge AI Platform', 'DLAP-3000/5200', 'Rugged design for Harsh Environment', 'up to 17.66 TFLOPS (MXM A4500)'.\n*   **Graphic:** A blue box labeled 'MXM support' showing three small circuit boards (MXM modules).\n\n**Right Section (Expandable Edge AI Platform):**\nThis section displays two larger, black computer towers/racks.\n*   **Text:** 'Expandable Edge AI Platform', 'DLAP-4100/8100', 'Expandable Platform for Versatile Applications', 'up to 91.1 TFLOPS (RTX 6000 ADA)'.\n*   **Graphic:** A blue box labeled 'PEG support' showing two PCIe graphics cards.](.ecp-introduction-2026q2/slide-081.jpg)

## Slide 82

![The slide is titled **ADLINK X86-based Expandable Edge AI Platforms**. It is divided into sections based on expansion form factors:\n\n**MXM**\n*   **MXM Type A/B** (image of modules)\n    *   **DLAP-3100**: 9th Gen Intel® Core™ i7/i5/i3\n    *   **DLAP-3200**: 9th Gen Intel® Core™ i7/i5/i3 With 2 expansion slots\n    *   **DLAP-5200**: Intel® Core™ 200S Series and 14/13/12th Gen Core™\n\n**PEG**\n*   **X1** (image of a GPU)\n    *   **DLAP-4100**: Intel® Core™ 200S Series and 14/13/12th Gen Core™ • 2-slots expansion\n    *   **DLAP-8100**: Intel® Core™ 200S Series and 14/13/12th Gen Core™ • 4-slots expansion\n*   **~X4** (image of a GPU)\n    *   **AMD EPYC AXE-7220TR**: AMD 5th/ 4th Gen EPYC™ 9005/9004 Series • 2x FHFLDW GPU Gen5 x16\n    *   **AXE-7440GW**: Intel® 6th Generation Xeon Granite Rapids Workstation • 4x FHFLDW GPU Gen5 x16\n    *   **AMD EPYC AXE-7440TR**: AMD 5th/ 4th Gen EPYC™ 9005/9004 Series • 4x FHFLDW GPU Gen5 x16\n\nAt the bottom right, the text reads:\n**Performan**\n**ce**](.ecp-introduction-2026q2/slide-082.jpg)

## Slide 83

![**Slide Title:** Expandable X86-based Edge AI Platform\n\n**Table Content:**\n\n*   **Model:**\n    *   **DLAP-3200:** 8th/9th Gen Intel® Core™ i7/i5/i3\n    *   **DLAP-5200:** Intel® Core™ 200S Series and 14/13/12th Gen Core™\n    *   **DLAP-4100:** Intel® Core™ 200S Series and 14/13/12th Gen Core™\n    *   **DLAP-8100:** Intel® Core™ 200S Series and 14/13/12th Gen Core™\n*   **GPU Support:** MXM, MXM, PEG, PEG\n*   **PCIe slots:** 2, -, 1, 5\n*   **Memory (max.):** 64GB, 128GB, 64GB, 192GB\n*   **AI Performance:** 17.66 TFLOPS (MXM A4500), 17.66 TFLOPS (MXM A4500), 91.1 TFLOPS (RTX 6000ADA), 9... TFLOPS (RTX 6000ADA) *(Note: The number in the last column is partially obscured by a green circular logo containing the text 'QUAI IFIP')*\n*   **Certified:** -, -, (Blank), (Blank)\n\n**Footer:** * Products marked with * are under NVIDIA qualification review.](.ecp-introduction-2026q2/slide-083.jpg)

## Slide 84

![**Title:** DLAP x86 Platform with AI Acceleration for Edge & AI Applications\n\n**Hardware Models (Top Row):**\n*   DLAP-3000\n*   DLAP-3100\n*   DLAP-3200\n*   DLAP-5200\n*   DLAP-4100\n*   DLAP-8100\n\n**GPU Options (Middle Section):**\n\n*   **Left Panel:** Embedded MXM GPU Modules\n    *   NVIDIA-Based MXM (featuring NVIDIA RTX logo)\n    *   Intel-Based MXM (featuring intel ARC logo)\n\n*   **Right Panel:** PCI Express Graphics Cards & Portable GPU\n    *   NVIDIA PEG Card (featuring NVIDIA RTX logo)\n    *   Intel PEG Card (featuring intel ARC logo)\n\n**Footer:**\n*   *For detail MXM/PEG card support list, please visit ADLINK GPU solution page: https://www.adlinktech.com/en/adlink-gpu-solutions\n*   ADLINK | Leading Edge Computing\n*   84](.ecp-introduction-2026q2/slide-084.jpg)

## Slide 85

![The slide features an image of a black industrial computer chassis with the following text:\n\n**Main Title (Right):**\n'Rich I/O Design for Versatile Applications'\n\n**Top Left Text Block:**\n'Rich I/O Interfaces'\n*   DP\n*   HDMI\n*   Ethernet\n*   2.5GbE\n*   Serial port\n*   USB 3.2\n*   M.2\n*   Digital IO\n*   Audio\n*   TPM\n\n**Top Center Text Block:**\n'Swappable 2.5' SATA SSD try'\n\n**Footer:**\n'ADLINK | Leading Edge Computing' (Bottom Left)\n'85' (Bottom Right)](.ecp-introduction-2026q2/slide-085.jpg)

## Slide 86

![The slide features the title 'Expandable Design for Versatile Applications' in white text against a blue banner in the upper left corner.\n\nTwo black industrial computer towers are displayed against a blue background. The left unit is closed, showing a rear I/O panel and a gold-highlighted section at the bottom indicating expansion slots. The right unit is depicted in an exploded view, showing the internal motherboard and a card being inserted, with the corresponding internal area highlighted in gold.\n\nA label reading 'PCIe slots' connects the highlighted areas on both units with red lines. Small text on the sides of the computer cases reads 'DL4' and the 'ADLINK' logo.\n\nThe bottom left corner displays the text 'ADLINK | Leading Edge Computing' in red and white. The bottom right corner shows the number '86'.](.ecp-introduction-2026q2/slide-086.jpg)

## Slide 87

![**Top Header**\nStar Product\nDLAP\n\n**Main Title**\nDLAP-8100 Series\nSupreme AI Computing Workstation: Expandable, Robust Design for Industrial Automation\n\n**Left Column**\nSupreme AI Computing Workstation\n*   Intel® Core™ 200S Series and 14/13/12th Gen Core™ Processors\n*   Up to 192 GB LPDDR5 4800MHz memory\n*   Supports NVIDIA® RTX A6000 ADA 350W GPU with full-speed Gen4 x16 signal\n*   Microsoft® Windows® 10 IoT and Linux® Ubuntu 22.04\n\n**Middle Column**\nExpandable and Robust Design\n*   4x 2.5' SATA SSD trays with\n*   Embedded expansion includes 1x M.2 2230 E Key, 1x M.2 3042/3052 B Key, 1x M.2 2280 M Key, and 2x USIM\n*   Supports up to 4 displays with 2x DP++ and 2x HDMI, providing versatile connectivity options\n*   100- 240 AC input (1000W)\n\n**Right Column**\nMade For Industrial Automation\n*   Abundant I/O for connecting automated robotic arms includes 3x 2.5GbE (Gigabit Ethernet), 4x COM (serial ports), 8DI/8DO (digital inputs/outputs), and 6x USB\n*   Engineered for use in a wide variety of industries such as manufacturing, automotive, electronics, surgical, pharmaceutical, and logistics\n\n**Bottom Logos & Footer**\nEdgeGO\nCanonical Ubuntu\nWindows\nintel prestige partner\nADLINK | Leading Edge Computing\nadlinktech.com](.ecp-introduction-2026q2/slide-087.jpg)

## Slide 88

![**Header:**\nStar Product\nDLAP\n\n**Main Title & Subtitle:**\nDLAP-4100 Series\nSmall Mini-ITX System: Expandable Design for Industrial AI Applications\n\n**Column 1:**\n**AI Computing Workstation**\n*   Intel® Core™ 200S Series and 14/13/12th Gen Core™ Processors\n*   Up to 64 GB DDR5 4800MHz memory\n*   Supports NVIDIA® RTX A6000 ADA 350W GPU with full-speed Gen4 x16 signal Microsoft® Windows® 10/11 IoT and Linux® Ubuntu 22.04\n\n**Column 2:**\n**Expandable Design**\n*   Small form factor 230 (W) x 300 (D) x 150 (H) mm\n*   100- 240 AC input (500W)\n*   2x 2.5' SATA SSD trays for easy accessible\n*   Embedded expansion includes 1x M.2 2230 E Key, 1x M.2 3042/3052 B Key, 2x M.2 2242/2280 M Key,\n\n**Column 3:**\n**Made For Industrial Automation**\n*   Various I/O interfaces (1x 2.5GbE, 1xGbE, 2x RS-232/422/485, 8-bit GPIO, and 6x USB3.2)\n*   Engineered for use in a wide variety of industries such as manufacturing, automotive, DCS, AI inspection, and logistics\n\n**Bottom Logos & Footer:**\nEdgeGO\nCanonical Ubuntu\nWindows\nintel prestige partner\nADLINK | Leading Edge Computing\nadlinktech.com](.ecp-introduction-2026q2/slide-088.jpg)

## Slide 89

![Star Product\nDLAP\n\nDLAP-5200 Series\nHigh-Performance AI Engine: Sleek, Fanless Design for Advanced Automation Solutions\n\nHigh-Performance AI Engine\n*   Intel® Core™ 200S Series and 14/13/12th Gen Core™ Processors\n*   Supports max. 128 GB LPDDR5 4800MHz memory\n*   Supports MXM 3.1 Type A/B GPU module for AI inference and AI model execution\n*   Supports Microsoft® Windows® 10 IoT and Linux® Ubuntu 22.04\n\nEdgeGO\nCanonical Ubuntu\nWindows\nintel prestige partner\n\nSleek, Fanless Design\n*   Ensures quiet operation and reduces maintenance needs, enhancing reliability in industrial automation settings\n*   Maximizes space efficiency and provides better thermal management, making it suitable for compact and temperature-sensitive industrial environments\n\nIdeal For Advanced Automation\n*   Fanless design prevents malfunction in dusty environments ideal for applications like potato grading and waste or metal sorting\n*   Easily accessible front I/O ports include 4x USB 3.2, 2x USB 3.1, 2x HDMI, and 3x DisplayPort, providing convenient connectivity in industrial environments\n\nADLINK | Leading Edge Computing\nadlinktech.com](.ecp-introduction-2026q2/slide-089.jpg)

## Slide 90

![**DLAP-5200 (New)**\n\n*   Intel® Core™ Series 2 and 14/13/12th Gen Core™ Processors, support up to 65W CPU.\n*   DDR5 3200 up to 128GB (4 SODIMM slots)\n*   Support MXM 3.1 Gen4 x8 interface\n*   M.2 2280 NVMe Supported (Gen3 x4)\n*   Wide Power Input : 12/24 Vdc\n*   Operating temperature: -20~50C (65W CPU)\n\n**DLAP-5200-3DP** | **DLAP-5200-6DP**\n\n**Video Output**\n2x HDMI, 3x DP | 2x HDMI, 6x DP\n\n**LAN Port**\n6x 2.5 GbE | 3x 2.5GbE\n\n**COM**\n2x RS-232/ 422/ 485 | 2x RS-232/ 422/ 485\n | 1x RS-232](.ecp-introduction-2026q2/slide-090.jpg)

## Slide 91

![**Header:** Star Product\n**Title:** DLAP-5200 Support MXM module\n**Logo:** ADLINK LEADING EDGE COMPUTING\n\n**Column 1:**\n*   NVIDIA RTX A1000 MXM\n*   NVIDIA Ampere Architecture\n*   Standard MXM 3.1 Type A\n*   PCIe Gen 4 x8 interface\n*   2048 CUDA® cores, 16 RT Cores, and 64 Tensor Cores\n*   6.66TFLOPS peak FP32 performance\n\n**Column 2:**\n*   NVIDIA RTX A2000 MXM\n*   NVIDIA Ampere Architecture\n*   Standard MXM 3.1 Type A\n*   PCIe Gen 4 x8 interface\n*   2560 CUDA® cores, 20 RT Cores, and 80 Tensor Cores\n*   8.25TFLOPS peak FP32 performance\n\n**Column 3:**\n*   NVIDIA RTX A4500 MXM\n*   NVIDIA Ampere Architecture\n*   Standard MXM 3.1 Type B\n*   PCIe Gen 4 x16 interface\n*   58880 CUDA® cores, 46 RT Cores, and 184 Tensor Cores\n*   17.66 TFLOPS peak FP32 performance\n\n**Column 4:**\n*   Intel MXM-AXe A370E MXM\n*   Standard MXM 3.1 Type A\n*   PCIe Gen 4 x8 interface\n*   Ray Tracing Hardware Acceleration\n*   Dedicated AI Acceleration\n*   Supports Intel OpenVINOTM, OneAPI and Deep Link technologies](.ecp-introduction-2026q2/slide-091.jpg)

## Slide 92

![This slide is titled '**Next-Generation Edge AI Solutions With NVIDIA-Powered Module**' set against a background image featuring a warehouse with automated robots, a car dashboard with augmented reality overlays, and an electric vehicle charging station.\n\nBelow the header, five hardware devices are displayed in a row. From left to right, they are labeled with the following text:\n\n*   **RQX-59 Series**\n    **AGX Orin**\n*   **DLAP-211-Orin Series**\n    **Orin NX/Nano**\n*   **DLAP-411-Orin**\n    **AGX Orin**\n*   **DLAP-700 Series**\n    **Jetson Thor**\n*   **DLAP-IGX**\n    **IGX Thor**\n\nThe NVIDIA module names (e.g., AGX Orin) are printed in red text below the black product series names.](.ecp-introduction-2026q2/slide-092.jpg)

## Slide 93

![The slide is titled **'Powering up Edge AI'** with the subtitle **'Unlocking the Next Level of Intelligence.'** It features two ADLINK computing devices side-by-side.\n\n**Left Side (DLAP Super):**\n*   **Logo:** NVIDIA logo with text **'NVIDIA'** and **'JetPack SDK'**.\n*   **Product Name:** **'DLAP Super'** (in blue).\n*   **Description:** **'Gear up for NVIDIA Jetson Orin Super Mode'** (with 'Super Mode' in green).\n*   **Metrics:**\n    *   **'1.7X'** above **'AI TOPS'**.\n    *   **'2X'** above **'GenAI model performance'**.\n\n**Right Side (DLAP Supreme):**\n*   **Logo:** **'aiDAPTIV+'** logo.\n*   **Product Name:** **'DLAP Supreme'** (in blue).\n*   **Description:** **'Elevate AI Power with Phison aiDAPTIV+'** (with 'aiDAPTIV+' in orange).\n*   **Metrics:**\n    *   **'8X'** above **'Inference speed'**.\n    *   **'4X'** above **'Longer token length'**.](.ecp-introduction-2026q2/slide-093.jpg)

## Slide 94

![The slide presents a promotional graphic with the main headline 'Elevate AI with Phison'.\n\n**Top Section:**\n*   Left: 'aiDAPTIV+' and 'intel' next to a digital head profile.\n*   Right: 'NVIDIA.' logo.\n\n**Center Section:**\n*   Two black ADLINK industrial computers are shown. The left unit is labeled 'MATRIX' and 'ADLINK'. The right unit is labeled 'DLAS' and 'ADLINK'.\n*   Below them is the text 'Supreme Series' next to a yellow M.2 SSD module labeled 'PASCARI'.\n\n**Bottom Section:**\n*   Left text block: 'Intel Core Ultra (iGPU) MXE-310 MXE-320 SBC35-MTL/ARL'\n*   Center graphics: Two gray boxes displaying '8X Inference speed' and '4X Longer token length'.\n*   Right text block: 'Nvidia Jetson Orin DLAP-411 AGX Orin DLAP-212 Orin NX/Nano'](.ecp-introduction-2026q2/slide-094.jpg)

## Slide 95

![**Title:**\nADLINK NVIDIA-based Compact Edge AI Platforms\n\n**Section 1:**\nNVIDIA® Jetson Orin™\nAGX\nRQX-59 32/64G\nDLAP-411 32/64G\nDLAP-411 Supreme 32/64G\n\nNX/Nano\nSuper Mode\nDLAP-211-Orin Nano 4/8G NX 8/16G\nRQX-31G Nano 8G NX 8/16G\nSuper Mode\nDLAP-21 2 Nano 4/8G NX 8/16G\n\n**Section 2:**\n*NVIDIA® Jetson Thor™ & IGX Thor™\nDLAP-701 NVIDIA Jetson T5000/T4000™\nDLAP-711(GMS L2) NVIDIA Jetson T5000/T4000™\nDLAP-IGX NVIDIA IGX T7000™\n\n**Footer:**\nPerforman ce\n*Available for project-based requests.](.ecp-introduction-2026q2/slide-095.jpg)

## Slide 96

![**ADLINK's Edge AI Platforms**\n**NVIDIA Jetson-Powered Platforms**\n\n**Product Columns:**\n*   **DLAP-211-Orin Nano**: NVIDIA® Jetson Nano module. Label: **Super Mode**.\n*   **DLAP-212-Orin NX**: NVIDIA® Jetson Orin™ Nano or NX module. Label: **Super Mode**. Logo: **DLAP**.\n*   **DLAP-411-Orin**: NVIDIA® Jetson AGX Orin™ module. Logo: **DLAP**.\n\n**Specification Table:**\n*   **Module**: Orin Nano | Orin NX | AGX Orin\n*   **Power**: 25W | 40W | 60W\n*   **CUDA#**: 1024 Ampere | 1024 Ampere | 2048 Ampere\n*   **Tensor#**: 32 | 32 | 64\n*   **Memory**: 8GB | 16GB | 32/64GB\n*   **AI Performance**: 67 TOPS | 167 TOPS | 200/275 TOPS](.ecp-introduction-2026q2/slide-096.jpg)

## Slide 97

![This slide features a metallic humanoid robot on the right side against a dark blue background with electric streaks. The text content is as follows:\n\n**Main Heading:**\n'Powering the Future of Robotics and Humanoids'\n\n**Subheading:**\n'Explore NVIDIA® Jetson Thor & IGX'\n\n**Bottom Section (inside a blue box):**\n*   'Thor'\n*   'NVIDIA® Jetson Thor™'\n*   'DLAP-701'\n*   'NVIDIA Jetson T5000/T4000™'\n*   'NVIDIA® IGX Thor™'\n*   'DLAP-IGX'\n*   'NVIDIA IGX T7000™'\n*   'DLAP-711'\n*   'NVIDIA Jetson T5000/T4000™'](.ecp-introduction-2026q2/slide-097.jpg)

## Slide 98

![The slide presents 'ADLINK's Edge AI Platforms' featuring the title 'NVIDIA Jetson Thor™ & IGX Thor™-Powered Platforms'.\n\nIt displays four product columns with images:\n*   **DLAP-701**: NVIDIA® Jetson Thor™ module\n*   **DLAP-711**: NVIDIA® Jetson Thor™ module\n*   **DLAP-711-GMSL2**: NVIDIA® Jetson Thor™ module\n*   **DLAP-IGX**: NVIDIA® IGX Thor™ module\n\nBelow the product images is a specification table:\n*   **Module**: Jetson™ Thor T4000/T5000 (spanning the first three columns) | IGX Thor T7000 (fourth column)\n*   **Power**: 130W (spanning the first three columns)\n*   **CUDA#**: 2560/1536-core (spanning the first three columns) | 2560 Blackwell (fourth column)\n*   **Tensor#**: 96/64 (spanning the first three columns) | 96 (fourth column)\n*   **Memory**: 128/64GB (spanning the first three columns) | 128GB (fourth column)\n*   **GMSL2**: - (first column) | - (second column) | x8 (third column)\n*   **Time sync**: - (first column) | - (second column) | Camera + Lidar (third column)\n*   **AI Performance**: 2070/1200 TFLOPS (spanning the first three columns) | 4293 TFLOPS (fourth column)](.ecp-introduction-2026q2/slide-098.jpg)

## Slide 99

![**Top Left:**\n*   New Product\n\n**Device Image Labels (Left):**\n*   2x LAN\n*   1x QSFP28\n*   ANT\n*   ADLINK\n*   ANT\n*   DLAP\n*   Power\n*   USB\n*   LAN\n*   HDMI\n*   TYPE-C\n*   QSFP28\n*   DC IN 9-36 V\n*   GND\n*   4x USB\n*   2x HDMI\n*   2x Type-\n    C\n\n**Right Panel:**\n*   DLAP-701\n*   Compact Edge AI Platform\n*   Accelerated by NVIDIA® Jetson Thor™\n*   Extreme AI performance\n    *   Embedded with NVIDIA Jetson T5000™/ T4000™\n    *   Up to 2070 FP4 TFLOPS for multi-model generative AI workloads\n*   Rich High-Speed I/O\n    *   2x LAN\n    *   4x USB 3.0\n    *   2x Type C\n    *   2x HDMI\n    *   QSFP28 (4x 25GbE)\n*   Idea for advanced Applications\n    *   Multi-modal AI (vision + speech + motion) in robotics, autonomous machines, and industrial AI\n    *   Fully autonomous robots or AI-powered edge systems\n    *   Robotics, autonomous driving, smart manufacturing, and multi-agent AI systems on edge](.ecp-introduction-2026q2/slide-099.jpg)

## Slide 100

![**Top Left:**\nNew Product\n\n**Device Labels (Left Image):**\n2x LAN\n4x USB\n1x HDMI\n\n**Device Labels (Top Center Image):**\n1x Type-C\nRear side\n2x COM\n\n**Right Panel:**\nDLAP-212\nCompact Edge AI Platform\n\nEmbedded with NVIDIA® Jetson Orin NX/Nano™ module, delivering up to 157 TOPS\nWide-range 12V to 24V DC input with ignition power control for in-vehicle and industrial use\nCompact, fanless design optimized for edge AI deployments in smart city, retail, and manufacturing environments\nBuilt-in Out-of-Band (OOB) module for remote device control](.ecp-introduction-2026q2/slide-100.jpg)

## Slide 101

![The slide contains the following text:\n\n**Header:**\nStar Product\n\n**Main Title:**\nDLAP-411-Orin\nCompact AI Powerhouse: ADLINK’s Deep Learning Acceleration Platform\n\n**Left Column:**\n8X stronger AI performance\n*   Up to 275 TOPS AI performance via NVIDIA® Jetson AGX Orin™ System-on-module\n*   32/ 64 GB LPDDR5\n*   Supports the latest Linux® OS and Jetpack SDK\n\n**Middle Column:**\nSeamless Sensor Integration\n*   Connects up to 8 cameras with 4 PoE ports and 4 USB 3.2 Gen 2\n*   1 Type C USB 3.2 for OTG\n*   1 x CANbus (isolated)\n*   1 x COM(RS232/422/485)\n*   1 x IO pin (I2C, SPI, GPIO)\n\n**Right Column:**\nRobust Solution network\n*   Secure remote device management by EdgeGO\n*   Build AI application with trained AI network by EVA\n*   Mass AI models deployment at once with NetworkOptix\n*   Full remote power control with Allixon's physical Out-of-Band (OOB) module during system crashes](.ecp-introduction-2026q2/slide-101.jpg)

## Slide 102

![This slide presents product information for the **DLAP-211-Orin**.\n\n**Header:** Star Product\n\n**Main Title:** DLAP-211-Orin\n\n**Subtitle:** Compact AI Powerhouse: ADLINK’s Deep Learning Acceleration Platform\n\n**Key Features (Three Columns):**\n\n*   **High AI performance**\n    *   Embedded with NVIDIA® Jetson Orin NX/Nano™ module, delivering up to 100 TOPS\n    *   Support NVIDIA Super Mode to increase AI TOPS by up to 1.7X, memory bandwidth by up to 1.5X, and Gen AI model performance by up to 2X\n\n*   **Compact Design**\n    *   148mm x 120mm x 52mm with a fanless design\n\n*   **Idea for diverse Applications**\n    *   Smart City\n    *   Retail\n    *   Manufacturing](.ecp-introduction-2026q2/slide-102.jpg)

## Slide 103

![**Perception Design-in Service**\n\n**Frame Synchronization**\nSupport frame synchronization between a maximum of 8 GMSL2/FPD-Link III cameras and LiDAR\n\n**Real-time Sensor Fusion**\nCamera\nLIDAR\nRADAR\nRaw Data Fusion & Perception\n\n**Camera Integration**\n**Frame Synchronization**\n**Sensor Fusion**\n\n**RQX-59 Series**\n**AGX Orin**\n\n**Camera & LiDAR Integration (GMSL2/FPD-Link III)**\n\n**GMSL2 Cameras Pass Validation Test**\nTIER IV\nAutomotive HDR camera C1/C2\noToBrite\noToCAM223\noToCAM264ISP\noToCAM269\nStereoLa\nZED-X/ ZED-X mini\nLeopard\nLI-AR0233-GMSL2 ( non ISP)\nOrbbec\nIMX499_GW5400\nGemini 335Lg\n\n**FPD-Link III Cameras Pass Validation Test**\noToBrite\noToCAM222\noToCAM206\noToCAM264ISP\noToCAM251 (customized BSP)\n\n**LiDAR Pass Validation Test**\nOuster\nOS1-32](.ecp-introduction-2026q2/slide-103.jpg)

## Slide 104

![**Header:**\nADLINK's ROS 2 Robotic Controller\nNVIDIA Jetson-Powered Platforms\n\n**Comparison Columns:**\n*   **Left Column:** RQX-59G | NVIDIA® Jetson AGX Orin NX/Nano™ module\n*   **Right Column:** RQX-31G | NVIDIA® Jetson Orin™ Nano or NX module\n\n**Specifications Table:**\n*   **Module:** AGX Orin | Orin NX/Nano\n*   **Power:** 25W | 40W\n*   **CUDA#:** 1792 Ampere | 1024 Ampere\n*   **Tensor#:** 56 | 32\n*   **Memory:** 64GB | 8/16GB\n*   **AI Performance:** 200 TOPS | 100/70/40 TOPS](.ecp-introduction-2026q2/slide-104.jpg)

## Slide 105

![**New Product**\n\n**Hardware Labels:**\n*   1x Type-C\n*   ADLINK\n*   RECOVERY\n*   RESET\n*   12V FAN\n*   Rear side\n*   2x COM\n*   2x LAN\n*   4x USB\n*   1x HDMI\n*   ROScube\n*   1x Audio\n*   DI/DO\n*   2x GMSL2\n\n**Product Information Box:**\n*   **RQX-31G**\n*   **ROS 2 Robotic Controller**\n*   Embedded with NVIDIA® Jetson Orin NX/Nano™ module, delivering up to 100 TOPS\n*   Time synchronization for GMSL2 cameras\n*   9V to 36V wide-range DC input with built-in ignition power control\n*   Ideal for diverse AI applications for aftermarket autonomous vehicles, service robots, humanoid robot, AMR and more](.ecp-introduction-2026q2/slide-105.jpg)

## Slide 106

![This slide presents a product overview for the **RQX-59G**.\n\n**Top Left:**\n*   **Star Product**\n\n**Top Right (Main Title Area):**\n*   **RQX-59G** (in large, dark grey font)\n*   **ROS 2 Robotic Controller** (in blue font)\n\n**Bottom Section (Three Columns):**\n\n**Column 1: High AI performance**\n*   Powered by NVIDIA Jetson AGX Orin module\n*   32 GB 256-bit LPDDR5\n*   200 TOPS in AI performance\n*   64 GB eMMC\n\n**Column 2: High Speed Camera Support**\n*   GMSL2 and FPD-Link III\n*   Up to 8 cameras at the same time\n*   Supports top car camera brands\n\n**Column 3: Idea for diverse Applications**\n*   Service Robots\n*   AMR & Robotics\n\n**Visuals:**\n*   An image of a grey industrial computer (labeled **ROScube** on the front panel) is shown on the left.\n*   A glowing, wireframe brain graphic over a circuit board background is shown on the right.](.ecp-introduction-2026q2/slide-106.jpg)

## Slide 107

![**DLAP & ROScube Series**\n**DLAP - x86**\n\n**Timeline Headers:**\nReleased / M\nUnder\nUnder\n\n**Y-Axis Label:**\nx86\n\n**Product Entries:**\n\n*   **DLAP-300**\n    0\n*   **DLAP-400**\n    0\n*   **DLAP-520**\n    0\n    Intel® Core™ 12/13/14th,\n    Series 2\n    with MXM module support\n*   **DLAP-800**\n    0\n*   **DLAP-410**\n    0\n    Intel® Core™ 12/13/14th, Series\n    2 Configurable AI Box\n    1x FHFL GPU PEG card\n*   **DLAP-810**\n    0\n    Intel® Core™ 12/13/14th, Series 2\n    Configurable AI Box\n    AC 1000W, 1x FHFL-DW PEG\n*   **DLAP-3500** (Green Banner)\n    Nova Lake-S, MXM Gen4 x16\n\n**Timeline Axis:**\nAvailable\n2026 H1\n2026 H2\n2027\n\n**Footer:**\nADLINK | Leading Edge\nComputing](.ecp-introduction-2026q2/slide-107.jpg)

## Slide 108

![**Title:**\nDLAP & ROScube Series\nDLAP & ROSCube – Jetson\n\n**Legend (Top Right):**\nReleased / M\nUnder T\nUnder C\n\n**Y-Axis Label:**\nJetson\n\n**Product Lines (Red/Released Section):**\nDLAP-411-Orin\nDLAP-411-Orin Supreme\nDLAP-211\nDLAP-211-Orin Supreme\nROScube-X\nRQX-59 Series\nDLAP-401\n\n**Product Lines (Blue/2026 H1 Section):**\nDLAP-212\nJetson Orin NX/Nano Super\n4/8/16GB module support\nMIPI camera support\n\nDLAP-212 Supreme\nJetson Orin NX/Nano Super\n4/8/16GB module support\naiDAPTIV+\n\nDLAP-701\nJetson AGX Thor, Prototype\n\nRQX-31G\nJetson Orin NX/Nano Super\n4/8/16GB module support\nGMSL2 camera support\n\nRQX-711\nJetson AGX Thor\nGMSL2 camera support\n\n**Product Lines (Green/2026 H2 Section):**\nDLAP-IGX Thor\nJetson IGX Thor, T7000\nPrototype\n\n**Timeline Axis (Bottom):**\nAvailable\n2026 H1\n2026 H2\n2027\n\n**Footer:**\nADLINK | Leading Edge\nComputing](.ecp-introduction-2026q2/slide-108.jpg)

## Slide 109

![This slide features a split design. The left side has a red background displaying the number '04' and the text 'ASD+ SSD Series' followed by 'Optimized for Data-Heavy and Rugged Environments'. Below this text are images of five SSD drives branded with 'ASD+', including labels such as '2.5' SATA SSD', 'U.2 PCIe Gen4 x4 SSD', and 'U.2 PCIe Gen3 x4 SSD'. Four white icons (shield, document/chip, gear/clock, sun) are at the bottom left.\n\nThe right side shows a black-and-white close-up of a microchip with the binary sequence '0 10 1 0' overlaid. The top right corner displays the logo 'ADLINK LEADING EDGE COMPUTING'.](.ecp-introduction-2026q2/slide-109.jpg)

## Slide 110

![**ADLINK ASD+**\n**Industrial & Enterprise-Grade SSD Storage**\n\n**Data Security/ Flash Optimization/ Power Loss Protection/ Customization Service**\n\n**Enterprise Series**\n*   5 year Warranty\n*   Ultra-low latency with a maximum read-and-write speed of up to 7000 MB/s.\n*   Wide capacities range from 480 GB to an expansive 30.72 TB.\n*   Robust security with FIPS, TCG-OPAL compliance, secure erase features, and write protection.\n\n**Industrial Series**\n*   3 year Warranty\n*   Balances TLC NAND's high capacity with p-SLC's durability and speed, offering superior performance and longevity.\n*   Reliable in -40°C to 85°C thermal range for diverse environments.\n*   Power Loss Protection (PLP) ensures uninterrupted operation 24/7.\n\n110](.ecp-introduction-2026q2/slide-110.jpg)

## Slide 111

![**Header and Introduction**\n**ADLINK ASD+ SSDs**\nOptimized for Data-Heavy and Rugged Environments\nADLINK's embedded flash storage solutions include industrial and enterprise grades, designed for tough environments. They offer key flash technology benefits like high transfer speeds, lightweight design, and low power usage. Industrial-grade models ensure reliability in harsh conditions, and enterprise-grade versions deliver high performance and data integrity for data-heavy applications. This diverse portfolio boosts efficiency and reliability across numerous applications.\n\n**Key Features (Icons)**\n*   Reliable & Secure\n*   Customization\n*   Longevity\n*   Resilience\n\n**Product Labels and Form Factors**\n*   ASD+ Powered by ADLINK\n*   2.5' SATA SSD\n*   ADLINK\n*   ASD+EST M.2 2280 PCIe SSD\n*   U.2 PCIe\n*   M.2 PCIe\n*   M.2 SATA\n*   2.5' SATA\n\n**Detailed Specifications (Bottom Section)**\n\n**Security Features**\n*   FIPS certified\n*   TCG-OPAL compliant\n*   Secure Erase and Crypto Erase\n*   Write Protection\n\n**Flash Optimization**\n*   Garbage Collection and TRIM\n*   Advanced Wear Leveling to increase life cycle\n*   Bad Block Management\n*   Over Provision for enhanced performance\n\n**Power Loss Protection**\n*   Comprehensive protection ensures data integrity\n*   Built-in voltage stabilizer for internal power supply\n*   Reliable startup power\n\n**Customization Service**\n*   Time to market design-in service\n*   Early access to the latest Flash technology\n*   With a 3-5 year warranty\n\n**Device Management Software** (EdgeGO)\n*   Graphical web platform for monitoring device status and performance, including SSDs.\n*   Advanced security with onboarding, encryption, SSO (LDAP), and access controls.](.ecp-introduction-2026q2/slide-111.jpg)

## Slide 112

![This slide promotes a 'Custom-Built in 30 Days' service with the subtitle 'Built on Standard, Enhanced by Customization.' Central to the image is the 'ASD+ SSD Custom Service' logo above three storage devices, including a '2.5' SATA SSD' and an 'E1.S SSD'.\n\nSurrounding the products are two arcs of features:\n\n**Top Arc ('Customized'):**\n*   Tailored Form Factor\n*   Custom HW\n*   Wide Voltage )±10%\n*   Custom FW\n*   Conformal Coating\n*   Crypto Erase/ AES Encryption\n\n**Bottom Arc ('30-Day Customization Service'):**\n*   Power Loss Protection (PLP)\n*   Shock & Vibration\n*   Standard (text label)\n*   ECC & Data Integrity\n*   Long Lifecycle\n*   Wide Temp -40°C ~ +85°C](.ecp-introduction-2026q2/slide-112.jpg)

## Slide 113

![**Custom-Built in 30 Days**\nBuilt on Standard, Enhanced by Customization\n\n**Conformal Coating**\n- Protective layer against moisture, dust, and corrosion\n- Ensures reliability under high humidity and harsh climates\n- Industry-proven coating materials\n\n**Tailored From Factor**\n- Form Factor flexibility for 2.5”, M.2, E1.S or custom sizes\n- Fits seamlessly into legacy and next-gen systems\n- Optimized for space-constrained deployments\n\n**Custom Firmware**\n- Tailored for application-specific workloads\n- Supports advanced security & data integrity features\n- Flexible updates for evolving mission needs\n\n**Custom HW**\n- Ruggedized components for harsh environments\n- Optional connectors and thermal solutions\n- Reliability validated by industrial-grade testing\n\n**Wide Voltage**\n- Supports unstable or fluctuating power sources\n- Greater tolerance than industry-standard ±10%\n- Reliable operation in defense, rail, and energy sectors\n\n**Crypto Erase / AES Encryption**\n- Encrypt or data sanitization in seconds\n- Hardware-based AES-256 encryption for data security\n- Protects mission-critical information against unauthorized access\n\n**ASD+**\nSSD Custom Service](.ecp-introduction-2026q2/slide-113.jpg)

## Slide 114

![The slide is titled 'The Edge-Native Platform for ASD+ SSD Management' with the 'EdgeGO' logo centered below it.\n\nThe slide features two screenshots of a software interface displaying storage information. Below these screenshots are two key feature descriptions:\n\n**SSD Info Overview**\n*   A clear view of SSD details\n*   Easy maintenance via dashboard\n*   Only available for ADLINK ASD+ SSD\n\n**Lifetime Monitoring**\n*   Summary log of recording hours and capacities\n*   Lifetime estimation to prevent data loss\n*   Only available for ADLINK ASD+ SSD\n\nThe footer contains the text 'ADLINK | Leading Edge AI Computing' on the left and the page number '114' on the right.](.ecp-introduction-2026q2/slide-114.jpg)

## Slide 115

![**Designed For Heavy Data Logging**\n\n**Data Centers**\n*   High Classify Military Facility\n*   Financial Service\n*   AI Server\n\n**Automotive Data Logger**\n*   Autonomous Vehicle / AMR / UAV / UCAV\n*   Aviation /Railway\n*   Sensor Fusion Data Analysis\n\n**Artificial Intelligence (AI)**\n*   Generative AI (i.e. Digital Twin, NIVIDIA Omniverse)\n*   Machine Learning/Deep Learning\n*   Big Data Analysis\n\n**32 TB**\nHigh Capacity\n\n**High Speed**\n**7000 MB/s**\n\nADLINK | Leading Edge AI Computing\n115](.ecp-introduction-2026q2/slide-115.jpg)

## Slide 116

![The slide presents a comparison titled '**Enterprise-Grade ASD+ vs Industrial-Grade ASD+**'.\n\nBelow the title, a paragraph explains the differences: 'Industrial SSDs are built for harsh environments and demanding industrial applications, focusing on durability and longevity. Enterprise SSDs, on the other hand, are optimized for high-performance data center and server applications, emphasizing reliability and scalability. The choice between the two depends on your specific application requirements and environments.'\n\nA table compares the specifications:\n\n*   **Capacity:** Enterprise SSD (Up to 32TB) vs Industrial SSD (Up to 16TB)\n*   **Latency:** Enterprise SSD (Ultra-low) vs Industrial SSD (Low)\n*   **Operation Temperature Range:** Enterprise SSD (0 - 70°C) vs Industrial SSD (-40 - 85°C)\n*   **4K Random R/W:** Enterprise SSD (Up to 1,600K/480K IOPS (U.2 PCIe)) vs Industrial SSD (Up to 600K/200K IOPS (U.2 PCIe))\n*   **Sequential R/W:** Enterprise SSD (Up to 7000/6800 MB/s (U.2 PCIe)) vs Industrial SSD (Up to 3300/1000 MB/s (U.2 PCIe))\n*   **Power Consumption:** Enterprise SSD (Max. 3,800 mW) vs Industrial SSD (Max. 1,750 mW)\n*   **Warranty:** Enterprise SSD (5 years) vs Industrial SSD (3 years)\n*   **Dual Port:** Enterprise SSD (Yes) vs Industrial SSD (No)\n\nThe footer reads 'ADLINK | Leading Edge AI Computing' with page number '116'.](.ecp-introduction-2026q2/slide-116.jpg)

## Slide 117

![**Title:** ASD+ Enterprise Series Selection Guide\n\n**Headers:** SDC12, EDC18, EDCP1\n\n**Row 1: Form Factor**\n*   SDC12: 2.5' SSD\n*   EDC18: M.2 2280/2242 M Key\n*   EDCP1: U.2 SSD\n\n**Row 2: Interface**\n*   SDC12: SATA Gen 3\n*   EDC18: PCIe Gen4 x4 NVMe 1.4\n*   EDCP1: PCIe Gen4 x4 NVMe 1.4\n\n**Row 3: Flash Type**\n*   SDC12: 3D-TLC\n*   EDC18: 3D-TLC\n*   EDCP1: 3D-TLC\n\n**Row 4: Capacity**\n*   SDC12: 480, 960, 1920 GB\n*   EDC18: 480, 960, 1920 GB\n*   EDCP1: 1920, 3840, 7680, 15360, 30720 GB (Left Column) | 800, 1600, 3200, 6400, 12800, 25600 GB (Right Column)\n\n**Row 5: Cache Memory**\n*   SDC12: DDR4\n*   EDC18: DDR4\n*   EDCP1: DDR4\n\n**Row 6: 4K Random R/W**\n*   SDC12: Up to 98K/50K IOPS\n*   EDC18: Up to 800K/58K IOPS\n*   EDCP1: Up to 1,600K/480K IOPS\n\n**Row 7: Sequential R/W**\n*   SDC12: Up to 530/550 MB/s\n*   EDC18: Up to 5500/2000 MB/s\n*   EDCP1: Up to 7000/6800 MB/s\n\n**Row 8: Reliability (MTBF)**\n*   SDC12: More than 1.5M hrs\n*   EDC18: More than 2M hrs\n*   EDCP1: More than 2.5M hrs\n\n**Row 9: Reliability (DWPD)**\n*   SDC12: 1\n*   EDC18: 1\n*   EDCP1: 1 (Left Column) | 3 (Right Column)\n\n**Row 10: Temperature**\n*   SDC12: C-grade: 0°C ~ 70°C\n*   EDC18: C-grade: 0°C ~ 70°C\n*   EDCP1: C-grade: 0°C ~ 70°C\n\n**Row 11: Warranty**\n*   SDC12: 5 Years\n*   EDC18: 5 Years\n*   EDCP1: 5 Years\n\n**Footer:** ADLINK | Leading Edge AI Computing 117](.ecp-introduction-2026q2/slide-117.jpg)

## Slide 118

![The slide is titled 'Designed for Reliable Operation' and is divided into three main sections corresponding to specific use cases, followed by a storage technology comparison at the bottom.\n\n**Top Section (Use Cases):**\nThree columns feature images and text describing application requirements:\n\n*   **Left Column:** Under an image of a surveillance command center, the header reads '**Military/ Surveillance (AI)**'. The bullet points are:\n    *   'Write Intensive ) 50%'\n    *   'High Performance & Endurance'\n    *   'Low Latency'\n*   **Middle Column:** Under an image of slot machines, the header reads '**Gaming/ Medical**'. The bullet points are:\n    *   'Read Intensive ) 80%'\n    *   'Read Random IOPS'\n    *   'Low Latency'\n*   **Right Column:** Under an image of a person looking at a digital menu, the header reads '**Signage/ Retail**'. The bullet points are:\n    *   'Read Intensive ) 95%'\n    *   'Read Random IOPS'\n    *   'High Capacity'\n\n**Bottom Section (Storage Technology):**\nThis area contrasts two storage types with associated labels and images of SSDs:\n\n*   **Left Side:** The text '**p-**' is stacked above '**SLC**'. To its right is the text '**Write Intensive**'.\n*   **Center:** Two SSD drives are shown. One is a larger black drive with a red logo reading '**ASD+ Powered by ADLINK**'. The other is a smaller silver drive with a similar '**ASD+ Powered by ADLINK**' logo.\n*   **Right Side:** The text '**TLC**' is stacked vertically (T over L over C). To its left is the text '**Read Intensive**'.\n\n**Footer:**\n*   Bottom Left: '**ADLINK | Leading Edge AI Computing**'\n*   Bottom Right: '**118**'](.ecp-introduction-2026q2/slide-118.jpg)

## Slide 119

![**Title:** ASD+ Industrial Series Selection Guide (Cont.)\n\n**Headers:** S7T, S2D, E3T\n\n**Table Content:**\n\n*   **Form Factor:**\n    *   2.5' SSD\n    *   M.2 2280/2242 B+M Key\n    *   2.5' SSD\n    *   M.2 2280/2242 M Key\n*   **Interface:**\n    *   SATA Gen3\n    *   SATA Gen3\n    *   SATA Gen3\n    *   PCIe Gen3 x4 NVMe 1.3d\n*   **Flash Type:**\n    *   3D-TLC/p-SLC\n    *   3D-TLC/p-SLC\n    *   3D-TLC/p-SLC\n    *   3D-TLC/p-SLC\n*   **Capacity:**\n    *   3D TLC: 128GB ~ 2 TB\n    *   p-SLC: 32GB ~ 512GB\n    *   3D TLC: 128GB ~ 2 TB\n    *   p-SLC: 32GB ~ 512GB\n    *   3D TLC: 2TB ~ 8TB\n    *   p-SLC: 64GB ~ 2TB\n    *   3D TLC: 128GB ~ 2TB\n    *   pSLC: 32GB ~ 512GB\n*   **Cache Memory:**\n    *   DRAM-less\n    *   DRAM-less\n    *   DDR4\n    *   DRAM-less\n*   **4K Random R/W:**\n    *   44,500/78,500 IOPS\n    *   49,500/78,500 IOPS\n    *   98,000/88,000 IOPS\n    *   270,000/420,000 IOPS\n*   **Sequential R/W:**\n    *   550/530 MB/s\n    *   550/510 MB/s\n    *   520/510 MB/s\n    *   2450/1900 MB/s\n*   **Reliability (MTBF):**\n    *   More than 3M hrs\n    *   More than 2M hrs\n    *   More than 3M hrs\n    *   More than 2M hrs\n*   **Reliability (DWPD):**\n    *   3D TLC ) 0.64\n    *   p-SLC ) 44\n    *   3D TLC ) 0.64\n    *   p-SLC ) 28\n    *   3D TLC ) 0.64\n    *   p-SLC ) 44\n    *   3D TLC ) 0.7\n    *   p-SLC ) 28\n*   **Temperature:**\n    *   E-grade: -25°C - 85°C\n    *   I-grade: -40°C - 85°C\n    *   E-grade: -25°C - 85°C\n    *   I-grade: -40°C - 85°C\n    *   C-grade: 0°C - 70°C\n    *   I-grade: -40°C - 85°C\n    *   E-grade: -25°C - 85°C\n    *   I-grade: -40°C - 85°C\n*   **Warranty:**\n    *   3 Years\n    *   3 Years\n    *   3 Years\n    *   3 Years\n\n**Footer:** ADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-119.jpg)

## Slide 120

![**ASD+ Industrial Series Selection Guide**\n\n| | E2D | E1T | E8D | |\n| :--- | :--- | :--- | :--- | :--- |\n| **Form Factor** | U.2 SSD | M.2 2280 M Key | M.2 2280 M Key | E1.S |\n| **Interface** | PCIe Gen3 x4 NVMe 1.3d | PCIe Gen4x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 |\n| **Flash Type** | 3D-TLC | 3D-TLC | 3D TLC | 3D TLC |\n| **Capacity** | 480GB ~ 8TB | 256GB ~ 2TB | 480GB ~ 3840GB | 480GB ~ 7860GB |\n| **Cache Memory** | DDR4 | DRAM-less | DDR4 | DDR4 |\n| **4K Random R/W** | 600,000/200,000 IOPS | 700K/900K IOPS | 1000K/1000K IOPS | 650K/1200K IOPS |\n| **Sequential R/W** | 3300/1000 MB/s | 4900/3700 MB/s | 520/510 MB/s | 2450/1900 MB/s |\n| **Reliability (MTBF)** | More than 2M hrs | More than 1.5M hrs | More than 2M hours | More than 2M hours |\n| **Reliability (DWPD)** | 3D TLC ) 1.5 | 3D TLC ) 0.85 | - | 3D TLC ) 1.4 |\n| **Temperature** | C-grade: 0°C - 70°C I-grade: -40°C - 85°C | C-grade: 0°C - 70°C I-grade: -40°C - 85°C | C-grade: 0°C - 70°C I-grade: -40°C - 85°C | C-grade: 0°C to 70°C I-grade: -40°C to 85°C |\n| **Warranty** | 3 Years | 3 Years | 3 Years | 3 Years |\n\n**Footer:** ADLINK | Leading Edge AI Computing](.ecp-introduction-2026q2/slide-120.jpg)

## Slide 121

![This slide presents the **ADLINK Rugged SSD Series** with the tagline 'Faster Customization, Lower Risk, Mission Ready.'\n\nThe background features a collage of rugged environments: a drone flight, a train in snow, and oil pumps.\n\nThree SSD products are displayed centrally:\n*   A **2.5' SATA SSD** featuring the logo **ASD+** and text '**Powered by ADLINK**.'\n*   A blue M.2 module labeled **ADLINK** and **ASD+EDR18**.\n*   An **E1.S SSD** featuring the logo **ASD+** and text '**Powered by ADLINK**.'\n\nThe bottom section highlights three key categories in red text:\n1.  **Rugged Resilience**: Includes icons and text for '**Shock & Vibration**,' '**Wide Temperature Range**' (marked with **-40°C** and **85°C**), and '**Wide Power Range**.'\n2.  **30-Day Quick Customization Service**: Shown with a person working at a laptop icon.\n3.  **Data Security**: Includes icons and text for '**Secure Erase**,' '**Write Protect**,' and '**Full Power Loss Protection (PLP)**.'](.ecp-introduction-2026q2/slide-121.jpg)

## Slide 122

![ASD+\nPowered by ADLINK\nASD+ Rugged SSD Series\nPortfolio\n\n2.5'\nASD+\nSATA\nSeries\n\nLegacy\ncompatibility\n- Capacity up to 8TB\n- Sequential R/W 520 / 510\nMB/s\n- PLP, ECC, wide-temp\n-40°C~85°C\n\nM.2 PCIe\n2230/2242\nSeries\n\nCompact form\nfactor\n- Capacity up to 2TB\n- Sequential R/W 4900 / 3700\nMB/s\n- Compact size, wide-temp\n-40°C~85°C\n\nM.2 PCIe\n2280/22110\nSeries\n\nHigh capacity &\nperformance\n- Capacity up to 4TB\n- Sequential R/W 6000 MB/s\n- Compact size, wide-temp\n-40°C~85°C\n\nE1.S\nASD+\nPCIe\nSeries\n\nNext-gen scalable\ndesign\n- Capacity up to 8TB\n- Sequential R/W 7200 / 6300 MB/s\n- DRAM support, wide-temp\n--40°C~85°C\n\n3U VPX\nSOSATA+\nPCIe\n3U VPX\nStorage\n\nHigh capacity & Ultra\nSpeeds\n- PCIe Gen4x4 interface\n- Capacity up to 30.72TB\n- Conduction-cooled design\n- Optional FIPS 140-2, 140-3,\nCommon\nCriteria, TCG OPAL, Write\nProtect,\nSecure Erase](.ecp-introduction-2026q2/slide-122.jpg)

## Slide 123

![**Table Headers:** Interface, Model Name, Form Factor, Key Features, Recommended Applications\n\n**Row 1 (NVMe Group)**\n*   **Interface:** NVMe (PCIe 4.0)\n*   **Model Name:** ASD+E1T\n*   **Form Factor:** M.2 2230/2242\n*   **Key Features:**\n    *   - Up to 2TB\n    *   - Fast Transmission at 4900/3700 MB/ s\n    *   - Wide temp. -40°C~85°C\n*   **Recommended Applications:** Rai\n\n**Row 2**\n*   **Model Name:** ASD+E18DI\n*   **Form Factor:** M.2 2280/22110\n*   **Key Features:**\n    *   - PLP support\n    *   - Up to 4TB\n    *   - Fast Transmission at 6000 MB/s\n    *   - Wide temp. -40°C~85°C\n*   **Recommended Applications:** Defens Energy\n\n**Row 3**\n*   **Model Name:** ASD+E8D\n*   **Form Factor:** E1.S\n*   **Key Features:**\n    *   - DRAM support\n    *   - Up to 4TB\n    *   - Fast Transmission at 7200/6300 MB/s\n    *   - Wide temp. -40°C~85°C\n*   **Recommended Applications:** Energy Rai\n\n**Row 4**\n*   **Model Name:** 3U VPX Storage\n*   **Form Factor:** 3U VPX\n*   **Key Features:**\n    *   - Up to 30.72TB\n    *   - Conduction-cooled\n    *   - Optional FIPS 140-2/3\n    *   - Common Criteria, TCG OPAL\n*   **Recommended Applications:** Defens\n\n**Row 5 (SATA Group)**\n*   **Interface:** SATA Gen3\n*   **Model Name:** ASD+S2D\n*   **Form Factor:** 2.5' SATA\n*   **Key Features:**\n    *   - PLP support\n    *   - Up to 8TB\n    *   - Fast Transmission at 520/510 MB/s\n    *   - Wide temp. -40°C~85°C\n*   **Recommended Applications:** Defens](.ecp-introduction-2026q2/slide-123.jpg)

## Slide 124

![This slide features a solid red background with the text 'Thank You' in large white font at the top left. Below this is a repeating geometric pattern of white triangular outlines. The bottom section contains contact information in white text: 'ADLINK Technology, Inc.', followed by the address 'No. 66, Huaya 1st Rd., Guishan Dist., Taoyuan City 333411, Taiwan', telephone '+886-3-216-5088', and fax '+886-3-328-5706'. To the right are social media icons and the website 'www.adlinktech.com'. Finally, a footer outside the red box reads 'ADLINK | Leading Edge Computing'.](.ecp-introduction-2026q2/slide-124.jpg)

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