## Slide 1 ![This slide is a presentation title page featuring the following elements:\n\n* **Top Left:** The "COM Express" logo with a green star.\n* **Top Right:** The "ADLINK" logo with the tagline "LEADING EDGE AI COMPUTING".\n* **Main Content (Red Background):** The title "COM Express Introduction" followed by the presenter's name, "Dylan Cheng".\n* **Lower Left (Grey Background):** The date "2026 Q1".\n* **Bottom Left Corner:** The text "ADLINK | Leading Edge AI Computing".\n* **Background:** A blurred image of computer hardware, specifically a circuit board with processors.](.introduction-com-express-q1-2026-2026-02-02/slide-001.jpg) ## Slide 2 ![**Header**\nMilestones\n30 years of driving “Open Standards” in embedded computing\n\n**Timeline (Top Row)**\n1998\nBuilt\nCompactPCI\nR&D center\n\n2004\nBecame\nSponsor\nMember of\nPXISA\n\n2006\nPICMG COM Express\nsubcommittee\nreleases\nspecification\n\n2013\nJoined\nVITA\n\n2021\nIntroduced\nCOM-HPC\n\n2023\nCreated MicroRAN\nprivate 5G network\nsolution\nMicroRAN\n\n**Timeline Logos (Middle Strip)**\nCompactPCI®\nAdvanced TCA®\nPXI\nSystems Alliance\nETX®\nCOM\nExpress\nPC104\nVITA\nOpen Standards, Open Markets\nSMARC\nmodule\nCOM-HPC\nOPEN\nSTANDARD\nMODULE™\nAXE\n\n**Timeline (Bottom Row)**\n2003\nIntel's Modular\nCommunications\nPlatforms AdvancedTCA &\nCompactPCI Ecosystem\nPartner\n\n2005\nETX Industrial\nGroup releases\nETX 3.0\n\n2008\nAcquired Ampro,\nFounding\nMembers of\nPC104\nConsortium\n\n2013\nIntroduced\nSMARC\nand\napproved by the\nSGet Consortium\n\n2022\nIntroduced\nOpen\nStandard\nModules\n\n2024\nLaunched AI GPU\nServer\n\n**Footer Section**\nStandardization Committees\n\nPICMG\nExecutive Member\n\nPC/104\nExecutive / Founding\nMember\n\nSGeT\nSTANDARDIZATION\nGROUP FOR\nEMBEDDED\nTECHNOLOGIES\nStandard Member\n\nPXI\nSystems Alliance\nSponsor Member\n\nVITA\nOpen Standards, Open Markets\nStandard Member\n\nADLINK | Leading Edge AI\nComputing\n3](.introduction-com-express-q1-2026-2026-02-02/slide-002.jpg) ## Slide 3 ![**Slide Title:** Embedded computing market size & forecast\n\n**Text Content:**\n* **Segment by Application** – Medical, Defense & Aerospace, Communications, Automotive & Transport, Automation and Control, Others\n* **Segment by Type** – ARM, x86, PowerPC, Others\n* **By Company** – Advantech, Kontron ADLINK 390M US$, Abaco, Artesyn Embedded (Advanced Energy), Curtis Wright Controls, Ennoconn, MSC Technologies (AVNET), DFI, Congatec AG, Axiomtek Co. Ltd, Portwell, Dell, Radisys, ....\n\n**Chart Data:**\n* A bar chart illustrates market growth.\n* One bar is labeled **US$ 39B**.\n* One bar is labeled **2024**.\n* An arrow points upward with the text **CAGR 6%**.\n* The final bar is labeled **US$ 52B**.\n* The final bar is labeled **2030**.\n\n**Footer:**\n* **ADLINK | Leading Edge AI Computing**\n* Page number: **4**](.introduction-com-express-q1-2026-2026-02-02/slide-003.jpg) ## Slide 4 ![The slide is titled "**ADLINK's Computer-on-Modules: full spectrum coverage**".\n\nIt displays a chart with "**Performance**" on the vertical axis and "**Power**" on the horizontal axis.\n\n**Modules and Categories:**\n* **COM+HPC** (top right)\n* **Server** (below COM+HPC)\n* **Client** (below Server)\n* **Mini** (below Client)\n* **COM Express** (center)\n* **type 2/6/7 Basic** (below COM Express)\n* **type 6 Compact** (left of center)\n* **Qseven** (left)\n* **SMARC module** (bottom left)\n* **type 10 Mini** (bottom left)\n* **OPEN STANDARD MODULE** (bottom left)\n\n**Horizontal Axis (TDP):**\nThe bottom axis lists power ranges labeled "**TDP**":\n* **TDP < 12W**\n* **TDP < 30W**\n* **TDP < 85W**\n* **TDP < 100W**\n* **TDP < 200W**\n\n**Logos and Labels:**\n* "**intel.**" logos appear above the TDP labels starting from < 30W.\n* "**arm**" labels appear at the bottom left and far right.\n\n**Footer:**\n* "**ADLINK | Leading Edge AI Computing**"\n* "**Confidential**"\n* "**5**"](.introduction-com-express-q1-2026-2026-02-02/slide-004.jpg) ## Slide 5 ![**Top Section:**\nCapturing Edge AI Growth and Sustaining Revenue Stability\nADLINK’s M-shaped COM portfolio\n\n**Top Right Text Box:**\nWhy Should Customers Care?\nBy optimizing silicon selection across platforms, we ensure the best balance of performance, cost, and scalability—helping customers accelerate deployment and maximize ROI\n\n**Y-Axis Label:**\nRelative Market Growth Potential\n\n**Graph Content (Left to Right):**\n* **Left Arrow:** Edge Node\n* **Left Peak:** Cost Effective COM\n * Optimized for High-Volume Deployments\n * IoT Gateway, Smart Sensors,\n* **Center Peak:** Mid-Range COM\n * Reliable Solutions\n * Balanced Cost & Performance\n * Factory Automation, Medical Equipment, Retail Kiosks General Embedded Applications..\n* **Right Arrow:** Edge Server\n* **Right Peak:** High Performance COM\n * Optimized for Performance and Scalability\n * Autonomous system, advanced robotics, AI-powered Edge\n\n**Bottom Row (Logos/Text):**\n* COM OPEN STANDARD MODULE™\n* SMARC module\n* COM-E Low-end\n* COM Express\n* COM-E High-end\n* COM-HPC™\n\n**X-Axis Label:**\nAverage Revenue Contribution\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n6](.introduction-com-express-q1-2026-2026-02-02/slide-005.jpg) ## Slide 6 ![The slide is titled "Synergy for the future" in red, followed by the subtitle "Building enduring alliances with strategic ecosystem partners" in grey. The body features a grid of company logos with associated partnership descriptions below each:\n\n**Row 1:**\n* **intel**: Prestige Partner\n* **AMD**: Embedded Partner\n* **ami**: BIOS Partner\n* **AUO**: Strategic Partner\n* **nVIDIA**: Preferred Member in NVIDIA Partner Network\n\n**Row 2:**\n* **arm**: Partner in Arm SystemReady, PSA Certified and PARSEC Compliance Program\n* **AMPERE**: Technology Partner\n* **NXP**: Gold Partner\n* **MEDIA TEK**: Powered by MediaTek Genio Partner\n* **Qualcomm**: Member of the Qualcomm Advantage Network\n\n**Row 3:**\n* **COLLABORA**: Supporting Partner\n* **linaro** / **ONELab**: Supporting Partner\n* **Microsoft Azure Certified**: Azure Certified for IoT Partner\n* **Canonical**: Ubuntu Linux OS Partner\n* **aws Qualified Device**: Devices qualified to work with AWS IoT Greengrass\n\n**Footer:**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 7](.introduction-com-express-q1-2026-2026-02-02/slide-006.jpg) ## Slide 7 ![This slide presents information about "COM Express" technology.\n\n**Header:**\n* **COM Express** (with a green star symbol between the words)\n* **PICMG** (logo in the top right corner)\n\n**Body Text:**\n* "COM Express is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board. The COM Express form factor defines mini-, compact-, basic-, and extended-size modules."\n* "The **COM Express Module specification** is hosted by PICMG. It is not freely available but may be purchased at the PICMG websit"\n* "The **COM Express Carrier design guide** can be freely downloaded at : https://www.picmg.org/resources/design-guides/" (URL is in red)\n* "**ADLINK’s CTO** has been the chairman of the PICMG COM Express subcommittee for the last 16 years"\n\n**Visuals:**\n* An image of a green circuit board (labeled ADLINK) is displayed on the right side.\n\n**Footer:**\n* **ADLINK | Leading Edge AI Computing** (bottom left)\n* **Confidential** (bottom center)\n* **8** (bottom right)](.introduction-com-express-q1-2026-2026-02-02/slide-007.jpg) ## Slide 8 ![**Header:** COM Express\n\n**Title:** High-speed connector\n\n**Bullet Points:**\n* Data transfer rates up to 25+ Gbit/s, for PCIe Gen4; 25Gbit Ethernet; USB4,\n* Either 8 mm or 5 mm board-to-board distance, 220 contacts, pitch 0.5 mm\n* Operating temperature : -40°C to +125°C\n\n**Image Captions:**\n* Module Receptacle 220-pin\n* Carrier Plug 220-pin, 5mm btb\n* Carrier Plug 220-pin, 8mm btb\n\n**Footer:**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 9](.introduction-com-express-q1-2026-2026-02-02/slide-008.jpg) ## Slide 9 ![**Title:** COM Express sizes and feature sets\n**Logo:** COM Express\n\n**Section 1: COM-Express® Mini**\n* **TYPE10**\n * One 220-pin connector (A)\n * 2 graphic interfaces either DP/HDMI/eDP/LVDS\n * 4 PCI Express max GEN4 lanes\n * 1x Ethernet interface NBASE-T max 10 Gbps\n * 2x USB3.2, 6x USB2.0, 2x SATA\n * Power envelope typ. up to 20W (68W max)\n* **Diagram Labels:** LPDDR, SOC, AB, 55, 84\n\n**Section 2: COM-Express® Compact and Basic**\n* **TYPE6**\n * Two 220-pin connectors (A-B)\n * 4 graphic interfaces either DP/HDMI/eDP/LVDS/VGA\n * 24 PCI Express max GEN4 lanes\n * 1x Ethernet interface NBASE-T max 10 Gbps\n * 2x USB 4.0, 4x USB3.2, 4x USB2.0, 4x SATA\n * Power envelope typ. up to 80W (135W max)\n* **Diagram Labels:** SODIMM, SOC, CD, AB, 95, 95\n\n* **TYPE7**\n * Dual 220-pin connectors (A-B)\n * 4x Ethernet interfaces 10GBASE-KR max 10Gbps\n * 32 PCI Express max GEN4 lanes\n * 1x Ethernet interface NBASE-T max 10 Gbps\n * 2x USB 4.0, 4x USB3.2, 4x USB2.0, 2x SATA\n * Power envelope typ. up to 80W (135W\n* **Diagram Labels:** SOC, SODIMM, AB, 95, 125\n\n**Footer:**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 10](.introduction-com-express-q1-2026-2026-02-02/slide-009.jpg) ## Slide 10 ![This slide is titled **"Current specification status"** and features the **COM Express** logo in the top right corner. It presents a timeline of specification updates under two headers: **"Module + Carrier Date"** and **"Major changes"**.\n\nThe content is listed as follows:\n\n* **Module + Carrier Date:** Early definition called ETXexpress)\n * **Major changes:** ADLINK / Advantech / Kontron (than August 2004\n\n* **Module + Carrier Date:** COM Express COM.0 R1.0 July 10, 2005\n * **Major changes:** ADLINK contribute to formalization of COM E in PICMG)\n\n* **Module + Carrier Date:** COM Express COM.0 R2.0 August 8, 2010 (Note: Small red text "ADLINK Chairman" appears next to the date)\n * **Major changes:** Add type 6 and type 10 and Compact size 95x95mm\n\n* **Module + Carrier Date:** COM Express COM.0 R2.1 May 14, 2012 (Note: Small red text "ADLINK Chairman" appears next to the date)\n * **Major changes:** Add mini-size 84x55mm targeting type 10,\n\n* **Module + Carrier Date:** COM Express COM.0 R3.0 March 31, 2017 (Note: Small red text "ADLINK Chairman" appears next to the date)\n * **Major changes:** Add type 7, Remove unused types 1,2,3,4,5\n\n* **Module + Carrier Date:** COM Express COM.0 R3.1 March 10, 2023 (Note: Small red text "ADLINK Chairman" appears next to the date)\n * **Major changes:** Support PCIe Gen 4, USB 4.0 to type 6 and add IPMB, CEI to type 7\n\n**Footer:** ADLINK | Leading Edge AI Computing (red text for ADLINK) | Confidential | 11](.introduction-com-express-q1-2026-2026-02-02/slide-010.jpg) ## Slide 11 ![This slide has a split background, white on the left and light grey on the right.\n\n**Text Content (Verbatim):**\n* **Top Left:** "Type 6"\n* **Center:** "COM" (in black) [Green four-pointed star graphic] "Express" (in black)\n* **Bottom Left:** "ADLINK | Leading Edge AI" (with "ADLINK" in red) followed by "Computing" on the line below.\n* **Bottom Center:** "Confidential"\n* **Bottom Right:** "12"](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_011.jpg) ## Slide 12 ![**Title:** COM Express Type 6 pin groups rev 3.1\n\n**Body Text:**\nCOM Express Basic size Type 6, with its robust graphics capabilities, is the most popular and widely used computer-on-module form factor on the market.\n\nSince type 6 pinout has a strong focus on multiple modern display outputs, it targets applications such as medical, gaming, test and measurement and industrial automation.\n\n**Diagram Labels:**\n* **Compact:** SODIMM, SOC, CD, AB, 95, 95\n* **Basic:** SOC, SODIMM, SODIMM, AB, 95, 125\n\n**Pin Group Blocks (Top Row, Left to Right):**\n* USB 3.x upgrade x4\n* PCIe x2\n* DDI_1 or USB4_1\n* DDI_2 or USB4_2\n* DDI_3\n* PCIe x16\n* 12V\n\n**Pin Group Blocks (Bottom Row, Left to Right):**\n* LPC or eSPI\n* NBASE-T LAN x1\n* SATA x4\n* HD A\n* USB 2.0 x8\n* PCIe x6\n* LVDS or eDP\n* CRT VGA\n* GP SPI x1\n* 5Vsb max 135W\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n13](.introduction-com-express-q1-2026-2026-02-02/slide-012.jpg) ## Slide 13 ![**Header:** COM Express\n**Legend:** In Production, Under Design, Under Consideration\n\n**Y-Axis Label:** type 6\n\n**Timeline (X-Axis):** In Production, 2025 Q1-Q2, 2025 Q3-Q4, 2026 Q1-Q2, 2026 Q3-Q4, 2027 Q1-Q2\n\n**Product Details (grouped by timeline column):**\n\n* **In Production:**\n * **Basic type 6:** Express-ADP / R... [EXTREME RUGGED stamp] 12th & 13th Gen. Intel® Xeon®, Core™ (Alder Lake-P / Raptor Lake-P), up 64GB DDR5 non-ECC memory\n * **Basic type 6:** Express-T... [EXTREME RUGGED stamp] 11th Gen. Intel® Xeon®, Core™ (Tiger Lake-H) Up 128GB DDR4 ECC/non-ECC memory 500 series PCH\n * **Compact type 6:** cExpress-AR AMD® Ryzen™ Embedded V2000 (Zen2) 32GB non-ECC DDR4\n * **Compact type 6:** cExpress-T... [EXTREME RUGGED stamp] 11th Gen Intel® Core™, Celeron® (Tiger Lake-UP3) 64GB non-ECC/IBEC DDR4\n * **Compact type 6:** cExpress-E... [EXTREME RUGGED stamp] Intel® Atom™ x6000 (Elkhart Lake) up 32GB non-ECC/IBEC DDR4\n\n* **2025 Q1-Q2:**\n * **Compact type 6:** cExpress-MTL [AI stamp] 1st Gen Intel® Core™ Ultra (Meteor Lake-H/U) Up 96GB DDR5 non-ECC / IBEC memory\n\n* **2025 Q3-Q4:**\n * **Compact type 6:** cExpress-RLP [EXTREME RUGGED stamp] 13th Gen. Intel® Core™ (Raptor Lake-H/U), up 64GB soldered LPDDR5 non-ECC/IBEC memory\n * **Compact type 6:** cExpress-ASL / ALN / TWL [EXTREME RUGGED stamp] Intel® Atom™ x7000 (Elkhart Lake) Amston, Alder and Twin Lak up 16GB soldered LPDDR5\n\n* **2026 Q1-Q2:**\n * **Compact type 6:** cExpress-R8 next gen AMD® Ryzen™ 8000 (Zen 4) 96GB DDR5 non-ECC / ECC memory\n * **Basic type 6:** Express-PT [AI stamp] New Gen. Intel® Core™ Ultra (Panther Lake-H), up 96GB DDR5 non-ECC/IBEC memory\n\n* **2026 Q3-Q4:**\n * **Compact type 6:** cExpress-PTL New Gen Intel® Core™ Ultra (Panther Lake-H), up 64GB LPDDR5 non-ECC / IBEC memory\n * **Compact type 6:** cExpress-WCL [AI stamp] New Gen Intel® Core™ Ultra (Wildcat Lake-U), up 96GB DDR5 non-ECC / IBEC memory\n\n* **2027 Q1-Q2:**\n * **Compact type 6:** cExpress-VRX [EXTREME RUGGED stamp] next gen AMD® Ryzen™ Vxxxx (zen 5) 128GB DDR5 non-ECC / ECC memory\n * **Basic type 6:** Express-NV [AI stamp] New Gen. Intel® Core™ Ultra (Nxxxxx-U), up 128GB DDR5 non-ECC/IBEC memory\n\n**Footer:** ADLINK | Leading Edge AI Computing, Confidential, 14](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_013.jpg) ## Slide 14 ![**Header:** Planning\n\n**Title:** Specifications cExpress-PTL\n\n**Left Column Text:**\n**Processor:** Intel® Core Ultra Processor (Panther Lake)\n* Core Ultra 9 H484 12Xe 4P+8E 25W (12Xe GPU)\n* Core Ultra 9 H484 4P+8E 25W (4Xe GPU) (additional extend temp. SKU)\n* Core Ultra 7 H484 4P+8E 25W (4Xe GPU) (additional extend temp. SKU)\n* Core Ultra 5 H404 4P 25W (4Xe GPU)\n* Other SKU not shown here. All SKU with 4 LP-E-Cores inside\n\n**NPU:** integrated with up to 50 TOPS\n\n**Memory :** Up to 64 GB LPDDR5 Soldered down non-ECC/IBECC\n\n**PCI Express:**\n* max. 9 PCIe based devices (H484 SKU), max. 7 PCIe based devices (H12Xe, H404 SKU) ; incl. GbE and SATA IC\n* 1 PEGx8 (only for H484 SKU, 1 x8 or 2 x4, PEG 0-7)\n* 7 PCIEx1 default, up to 8 PCIEx1 (build option, remove GbE) (4x1, 2x2, 1x4 at lane 0-3) (4x1, 2x2, 1x4 at lane 4-7)\n\n**Display and Audio (4 independent displays)**\n* DDI 1/2/3: DP/HDMI2.0b/DVI (2x USB4 overlap with DDI 1/2, build option) ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n* VGA: through DP to VGA IC (build option, in place of DDI3)\n* Camera: 2x MIPI-CSI 4lanes at onboard FFC connector (build option) (driver readiness is TBC)\n\n**Peripherals**\n* 2.5GbE LAN (TSN at Linux, build option, TBC), 4x SATA 6Gb/s (via PCIe-to-4x SATA IC, C-temp only, TBC)\n* 4x USB 3.x/2.0 (via USB hub), 4x USB 2.0. 2x UART, 8x GPIO\n* 1x I2C, 1x SMB, 1x GP_SPI (build option, TBC), LPC (via eSPI to LPC bridge)\n* NVMe Gen4 SSD (build option, remove SATA 0-3 support)\n\n**AMI EFI BIOS and Security** (TPM 2.0 chip on module) (dual BIOS as optional feature)\n\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n\n**Voltage Input :** AT/ATX: 8.5V to 20V\n\n**Operation Temperature :** Extended -40°C to +85°C (selected SKUs, TBC), Standard 0°C to 60°C\n\n**Right Column Elements:**\nStandard supported\nUbuntu\nWindows 11\nyocto PROJECT\n[AI Icon] Maximum Platform TOPS 180 50TOPS at NPU. Up to 120TOPS at iGPU (H12Xe)\n[intel Logo]\n[Image of circuit board]\nCOM Express Revision 3.1\n\n**Bottom Row Logos:**\nintel Core ULTRA Xe LPG\nHDMI\nDisplayPort\nVGA LVDS/ eDP\nPCI EXPRESS 4\nMIPI-CIS (TBC)\nSUPER SPEED USB 4.\n2.5GbE\nSERAIL ATA\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n15](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_014.jpg) ## Slide 15 ![**Function Diagram**\n**cExpress-PTL**\n**Planning**\n\n**PEG Gen4 x8 (PEG 0-7) (H484 SKU)**\n\n**DDI 1(USB4_1):**\nDP/HDMI/DVI\n**DDI 2(USB4_2):**\nDP/HDMI/DVI\n**DDI 3: DP/HDMI/DVT**\nVGA (build option)\n\n**LVDS 18/24-bit**\nsingle / dual\n**eDP x4 lanes (build option)**\n**4x USB 3.2/2.0 (via Hub)**\n**4x USB 2.0**\n\n**4K**\n**VGA**\nDP to VGA\neDP to LVDS\n\n**NVMe SSD**\n**up to 4x SATA 6Gb**\n(mux with PCIe 6/7)\nPCIe to SATA\n\n**COM Express®**\nRevision 3.1\n\n**intel**\n**core**\nULTRA\n\n**eSPI to LPC**\n**EC**\n**SPI**\n**BIOS**\n**TPM**\n\n**LPC**\n**2x UART**\n**8x GPIO**\n**GP_SPI**\n(build option)\n\n**Max. 64GB, LPDDR5**\nnon-ECC soldered down\n\n**Up 8x PCIe Gen4x1 (port 0-7)**\n(x4, x2, x1 config at lane 0-3)\n(x4, x2, x1 config at lane 4-7)\n\n**LAN controller**\n**2.5 GbE**\n\n**Lane 7 muxed with 2.5GbE (build option)**\n**Integrated 2.5GbE**\n(TSN at Linux, build option TBD)\n\n**HDA**\nHigh Def. Audio\n\n**1x MIPI-CSI x4 lanes**\n(on-board FFC connector)\n(build option)\n\n**ADLINK | Leading Edge AI Computing**\n**Confidential**\n**16**](.introduction-com-express-q1-2026-2026-02-02/slide-015.jpg) ## Slide 16 ![**Specifications**\n\n**Developing**\n\n**Express-PTL**\n\n**Processor:** Intel® Core Ultra Processor (Panther Lake)\n* Core Ultra 9 H484 12Xe 4P+8E 25W (12Xe GPU)\n* Core Ultra 9 H484 4P+8E 25W (4Xe GPU) (additional extend temp. SKU)\n* Core Ultra 7 H484 4P+8E 25W (4Xe GPU) (additional extend temp. SKU)\n* Core Ultra 5 H404 4P 25W (4Xe GPU)\n* Other SKU not shown here. All SKU with 4 LP-E-Cores inside\n\n**NPU:** integrated with up to 50 TOPS\n\n**Memory :** Up to 128 (2x 64) GB DDR5 SO-DIMM non-ECC/IBEECC\n\n**PCI Express:**\n* max. 9 PCIe based devices (H484 SKU). max. 7 PCIe based devices (H12Xe, H404 SKU) ; incl. GbE and SATA IC\n* 1 PEGx8 (only for H484 SKU, 1 x8 or 2 x4, PEG 0-7)\n* 7 PCIEx1 default, up to 8 PCIEx1 (build option, remove GbE) (4x1, 2x2, 1x4 at lane 0-3) (4x1, 2x2, 1x4 at lane 4-7)\n\n**Display and Audio (4 independent displays)**\n* DDI 1/2/3: DP/HDMI2.0b/DVI (2x USB4 overlap with DDI 1/2, build option) ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n* VGA: through DP to VGA IC (build option, in place of DDI3)\n* Camera: 2x MIPI-CSI 4lanes at onboard FFC connector (build option) (driver readiness is TBC)\n\n**Peripherals**\n* 2.5GbE LAN (TSN at Linux, build option, TBC), 4x SATA 6Gb/s (via PCIe-to-4x SATA IC, C-temp only, TBC)\n* 4x USB 3.x/2.0 (via USB hub), 4x USB 2.0. 2x UART, 8x GPIO\n* 1x I2C, 1x SMB, 1x GP_SPI (build option, TBC), LPC (via eSPI to LPC bridge)\n* NVMe Gen4 SSD (build option, remove SATA 0-3 support)\n\n**AMI EFI BIOS and Security (TPM 2.0 chip on module) (dual BIOS as optional feature)**\n\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n\n**Voltage Input :** AT/ATX: 8.5V to 20V\n\n**Operation Temperature :** Extended -40°C to +85°C (selected SKUs, TBC), Standard 0°C to 60°C\n\n**Standard supported**\nUbuntu\nWindows 11\nyocto PROJECT\nMaximum Platform TOPS 180 50TOPS at NPU. Up to 120TOPS at iGPU (H12Xe)\nintel\nCOM Express Revision 3.1\n\n**Bottom Logos/Text:**\nSeries 3 intel CORE ULTRA\nXe LPG\nHDMI\nDisplayPort\nVGA LVDS/ eDP\nPCI EXPRESS 4\nSUPERspeed USB 4.0\n2.5GbE\nMIPI-CIS (TBC)\nSERIAL ATA\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n17](.introduction-com-express-q1-2026-2026-02-02/slide-016.jpg) ## Slide 17 ![**Header:**\nFunction Diagram\nExpress-PTL\nDeveloping\n\n**Left Column:**\nPEG Gen4 x8 (PEG 0-7) (H484 SKU)\nDDI 1(USB4_1):\nDP/HDMI/DVI\nDDI 2(USB4_2):\nDP/HDMI/DVI\nDDI 3: DP/HDMI/DVT (crossed out)\nVGA (build option)\nLVDS 18/24-bit\nsingle / dual\neDP x4 lanes (build option)\n4x USB 3.2/2.0 (via Hub)\n4x USB 2.0\nCOM Express®\nRevision 3.1\n\n**Center (CPU & Components):**\nintel CORE ULTRA\n4K\nVGA\nDP to VGA\neDP to LVDS\nNVMe SSD\nPCIe to SATA\nup to 4x SATA 6Gb (mux with PCIe 6/7)\nLAN controller\n2.5 GbE\neSPI to LPC\nEC\nSPI\nBIOS\nTPM\nLPC\nGP_SPI (build option)\n2x UART\n8x GPIO\n\n**Right Column:**\nMax. 128GB (2x 64GB), DDR5 non-ECC SO-DIMM (64GB memory depends on supplier readiness)\nUp 8x PCIe Gen4x1 (port 0-7) (x4, x2, x1 config at lane 0-3) (x4, x2, x1 config at lane 4-7)\nLane 7 muxed with 2.5GbE (build option)\nIntegrated 2.5GbE (TSN at Linux, build option TBD)\nHDA High Def. Audio\n1x MIPI-CSI x4 lanes (on-board FFC connector) (build option)\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n18](.introduction-com-express-q1-2026-2026-02-02/slide-017.jpg) ## Slide 18 ![**Specifications**\n**cExpress-R8 (Ryzen 8000)**\n\n**Processor:** AMD® Embedded Ryzen 8000 APU (Hawk Point1, Zen4 Cores)\n• Ryzen 7 Pro 8845HS 3.8(5.1)GHz, 16MB L3, 45W(35-54W) (8C/16T) (6 WGP)\n• Ryzen 7 Pro 8840U 3.3(5.1)GHz, 16MB L3, 28W(15-30W) (8C/16T) (6 WGP)\n• Ryzen 5 Pro 8645HS 4.3(5.0)GHz, 16MB L3, 45W(35-54W) (6C/12T) (4 WGP)\n• Ryzen 5 Pro 8640U 3.5(4.9)GHz, 16MB L3, 28W(15-30W) (6C/16T) (4 WGP)\n\n**NPU:** integrated XDNA style NPU, 16 TOPS\n\n**Memory**\n• Up to 128 (2x 64) GB DDR5 non-ECC/ECC at max. 5600MT/s at two channel\n• 64GB DDR5 memory depends on memory supplier's readiness\n\n**PCI Express:** all up to Gen4\n• 1x PEG Gen4 x8 (1x8 or 2x4, PEG 0-7)\n• 8x PCIe Gen4 (4x1,2x2,1x4 at lane0-3) (x2, x4 at lane 5-7)\n\n**Display and Audio (RDNA3 Graphics)(4 independent displays)**\n• DDI 1/2/3: DP/HDMI2.0b/DVI ; HD Audio\n• Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n\n**Peripherals**\n• 2.5GbE LAN\n• 4x SATA 6Gb/s (via PCIe-to-SATA IC, C-temp only)\n• Up to 4x USB 3.x/2.0 (via USB Hub), 4x USB 2.0. 2x UART, 8x GPIO\n• 1x I2C, 1x SMB, LPC (via eSPI to LPC bridge)\n• NVMe Gen4 SSD (x2 lanes, in place of SATA, build option)\n\n**AMI EFI BIOS and Security (TPM 2.0 chip on module)**\n\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n\n**Voltage Input :** AT/ATX: 8.5V to 20V\n\n**Operation Temperature :** Standard 0°C to 60°C\n\n**Right Side Graphics/Text:**\nDeveloping\nStandard supported\nUbuntu\nWindows 11\nAMD\n[Image of circuit board] ADLINK\nCOM Express® Revision 3.1\nAMD RYZEN Embedded\nHDMI\nPCI EXPRESS 4\nLVDS/ eDP\n2.5GbE\nSUPER SPEED USB 10Gbps\nSERIAL ATA 6Gb/s\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n19](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_018.jpg) ## Slide 19 ![**Header:**\nFunction Diagram\ncExpress-R8 (Ryzen 8000)\nDeveloping\n\n**Left Side (Connectivity & Peripherals):**\nPEG Gen4 x8 (PEG 0-7)\nDDI 1: DP/HDMI/DVI\nDDI 2: DP/HDMI/DVI\nDDI 3: DP/HDMI/DVI\n4K\nLVDS 18/24-bit\nsingle / dual\neDP x4 lanes (build option)\neDP to LVDS\nup to 4x USB 3.2/2.0 (via hub)\n4x USB 2.0\n4x SATA 6Gb/s\nPCIe to SATA\nNVMe SSD\n\n**Center (Processor):**\nAMD\nRYZEN\nEMBEDDED\n\n**Right Side (Memory & Interfaces):**\nMax. 128GB (2x 64GB),\nDDR5 ECC/non-ECC\nSO-DIMM\n8x PCIe Gen4x1 (port 0-7)\n(1x4, 2x2,4 x1 config at lane\n0-3)\n(x2, x4 config at lane 4-7)\nLAN controller\n2.5 GbE\nIntegrated up to 2.5GbE\nHDA\nHigh Def.\nAudio\n\n**Bottom (System Control & Firmware):**\neSPI to LPC\nEC\nSPI\nBIOS\nTPM\nLPC 2x UART\n8x GPIO\n\n**Footer:**\nCOM Express\nRevision 3.1\nADLINK | Leading Edge AI\nComputing\nConfidential\n20](.introduction-com-express-q1-2026-2026-02-02/slide-019.jpg) ## Slide 20 ![**Specifications**\n**cExpress-MTL**\n\n**Processor:** Intel® 1st Core Ultra Processor Meteor Lake-H/U\n* Core™ Ultra 7 155H 6P+8E/20T, 28W (8 Xe GPU)\n* Core™ Ultra 5 125H 4P+8E/16T, 28W (8 Xe GPU)\n* Core™ Ultra 5 125U 2P+8E/12T, 15W (4 Xe GPU)\n* Additional vPRO/non-vPRO SKUs are not shown here, all have additional 2 Low Power E-cores\n\n**NPU:** integrated with up to 8.2 TOPS or 4.5 TOPS/Watt\n\n**Memory :** Up to 96 (2x48) GB DDR5 non-ECC at max. 5600MT/s at two SO-DIMM socket\n\n**PCI Express:** all up to Gen4\n* 1 PEGx8 (only for 28W SKU, x8 only, PEG 0-7), 2x PEGx4 (x4 only, PEG 8-11, PEG 12-15)\n* 6 PCIex1 default, up to 8 PCIex1 (build option, remove SATA 0/1)\n\n**Display and Audio (4 independent displays)**\n* DDI 1/2/3: DP/HDMI2.0b/DVI (2x USB4 overlap with DDI 1/2, build option) ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n* VGA: through DP to VGA IC (build option, in place of DDI3)\n\n**Camera:** 1x MIPI-CSI 4lanes at onboard FFC connector (build option)\n\n**Peripherals**\n* 2.5GbE LAN (TS at Linux, build option, TBC), up to 2x SATA 6Gb/s (SATA 0/1 mux with PCIe 7/6)\n* 4x USB 3.2 Gen2/2.0, 4x USB 2.0. 2x UART, 8x GPIO\n* 1x I2C, 1x SMB, 1x GP_SPI (build option), LPC (via eSPI to LPC bridge)\n* NVMe Gen4 SSD (256GB above, build option at PEG 12-15)\n\n**AMI EFI BIOS and Security (TPM 2.0 chip on module)**\n\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n\n**Voltage Input :** AT/ATX: 8.5V to 20V\n\n**Operation Temperature :** standard 0°C to 60°C\n\n**Right Side Content:**\nProduction\nintel\nStandard supported\nWindows 11 (late 2024)\nWindows 10\nUbuntu\nyocto (by request)\nPROJECT\nADLINK\nCOM+\nExpress\nCOM Express®\nRevision 3.1\n\n[Logos at bottom]\nintel CORE ULTRA Xe LPG\nHDMI\nPCI EXPRESS 4\nSERIAL ATA\nMIPI-CSI\nVGA\nLVDS/\neDP\n4. SUPERspeed USB\nSUPERspeed USB 10Gbps\n2.5GbE\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n21](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_020.jpg) ## Slide 21 ![**Header:**\nFunction Diagram\ncExpress-MTL\nProduction\n\n**Left Column:**\nPEG Gen4 x8 (PEG 0-7) (28W SKU)\nPEG Gen4 x4 (PEG 8-11)\nPER Gen4 x4 (PEG 12-15)\nDDI 1(USB4_1):\nDP/HDMI/DVI\nDDI 2(USB4_2):\nDP/HDMI/DVI\nDDI 3: DP/HDMI/DVI\nVGA (build option)\nLVDS 18/24-bit\nsingle / dual\neDP x4 lanes (build option)\n4x USB 3.2/2.0\n4x USB 2.0\n\n**Central Processor:**\nintel\nCORE\nULTRA\n\n**Diagram Labels (Icons & Boxes):**\nNVMe SSD\n4K\nVGA\nDP to VGA\neDP to LVDS\nup to 2x SATA 6Gb\n(mux with PCIe 6/7)\nLAN controller\n2.5 GbE\nEC\neSPI to LPC\nLPC\n2x UART\n8x GPIO\nGP_SPI\n(build option)\nSPI\nBIOS\nTPM\n\n**Right Column:**\nMax. 96GB (2x 48GB),\nDDR5\nnon-ECC SO-DIMM\n8x PCIe Gen4x1 (port 0-7)\n(x4, x2, x1 config at lane 0-3)\n(x4, x2, x1 config at lane 4-7)\nLane 6-7 mux with SATA\nIntegrated 2.5GbE\n(TSN at Linux, build option)\nHDA\nHigh Def.\nAudio\n1x MIPI-CSI x4 lanes\n(on-board FFC connector)\n(build option)\n\n**Footer & Logo:**\nCOM Express®\nRevision 3.1\nADLINK | Leading Edge AI Computing\nConfidential\n22](.introduction-com-express-q1-2026-2026-02-02/slide-021.jpg) ## Slide 22 ![**Specifications**\n**cExpress-RPL**\n**Production**\n\n**Processor:** 13th Intel® Core Processor Raptor Lake-H/U\n* Core™ i7-1380HE 6P+8E/20T, 24MB, 45W(35W cTDP) (Iris Xe 96EU)\n* Core™ i5-13600HE 4P+8E/16T, 18MB, 45W(35W cTDP) (Iris Xe 80EU)\n* Core™ i3-13300HE 4P+4E/12T, 12MB, 45W(35W cTDP) (UHD 48EU)\n* Pentium® U300E 1P+4E/5T, 8MB, 15W (UHD)\n* Additional 28W, 15W SKUs and Industrial SKUs are not shown here, check manual\n\n**Memory**\n* Up to 64 (4x 16) GB LPDDR5 non-ECC/IBECC at max. 6400MT/s at two channel\n* Memory range from 8/16/32/64GB\n\n**PCI Express**\n* 1x PEG Gen4 x8 (only for 45W SKU, x8 only, PEG 0-7), 2x PEG Gen4 x4 (x4 only, PEG 8-11, 12-15)\n* Up to 8x PCIe Gen3 x1 (SATA 0/1 disabled) or 6x PCIe Gen3 x1\n\n**Display and Audio (4 independent displays)**\n* DDI 1/2/3: DP/HDMI2.0b/DVI (2x USB4 overlap with DDI 1/2, build option) ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n* VGA: through DP to VGA IC (build option)\n\n**Peripherals**\n* 2.5GbE LAN (TSN at Linux, build option, also selected CPU SKU)\n* 2x SATA 6Gb/s (SATA muxed with PCIe 6/7)\n* 4x USB 3.2 Gen2/2.0, 4x USB 2.0. 2x UART, 8x GPIO\n* 1x I2C, 1x SMB, LPC (via eSPI to LPC bridge)\n* NVMe Gen4 SSD (build option at PEG 12-15)\n\n**AMI EFI BIOS and Security (TPM 2.0 chip on module)**\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n**Voltage Input :** AT/ATX: 8.5V to 20V\n**Operation Temperature :** Extended -40°C to +85°C (selected SKUs), Standard 0°C to 60°C\n\n**Standard supported**\nWindows 11\nWindows 10\nUbuntu\nyocto *(by request)*\n\nintel\n\nCOM Express®\nRevision\n3.1\n\nintel CORE\nHDMI\nPCI EXPRESS 4\nSERIAL ATA\nSUPERspeed USB 4\nSUPERspeed USB 10 Gbps\n2.5GbE\nEXTREME RUGGED\nVGA\nLVDS/\neDP\n\nADLINK | Leading Edge AI Computing\nConfidential\n23](.introduction-com-express-q1-2026-2026-02-02/slide-022.jpg) ## Slide 23 ![**Header**\nFunction Diagram\ncExpress-RLP\nProduction\n\n**Left Column**\nPEG Gen4 x8 (PEG 0-7) (45W SKu\nPEG Gen4 x4 (PEG 8-11)\nPER Gen4 x4 (PEG 12-15)\nDDI 1(USB4_1):\nDP/HDMI/DVI\nDDI 2(USB4_2):\nDP/HDMI/DVI\nDDI 3: DP/HDMI/DVT\nLVDS 18/24-bit\nsingle / dual\neDP x4 lanes (build\noption)\n4x USB 3.2/2.0\n4x USB 2.0\nUp to 2x SATA 6Gb.\n\n**Diagram Labels (Center/Bottom)**\nNVMe SSD\nDP to VGA\neDP to LVDS\nESPI\neSPI to LPC\nEC\nLPC\n2x UART\n8x GPIO\nSPI\nBIOS\nTPM\nLAN controller\n2.5 GbE\n\n**Right Column**\nMax. 64GB (4x 16GB),\nLPDDR5 non-ECC / IBECC\nUp to 8x PCIe Gen3x1 (port\n0-7)\n(x4, x2, x1 config at lane 0-3)\n(x4, x2, x1 config at lane 0-3)\n(Lan 6 muxed SATA 1)\n(Lane 7 muxed SATA 0)\nIntegrated 2.5GbE\n(TSN at Linux, build option)\nHDA\nHigh Def.\nAudio\n\n**Footer/Logos**\nCOM Express\nRevision 3.1\nEXTREME RUGGED\nADLINK | Leading Edge AI Computing\nConfidential\n24](.introduction-com-express-q1-2026-2026-02-02/slide-023.jpg) ## Slide 24 ![Specifications\nExpress-RPL\nProcessor: 13th Intel® Core Processor Raptor Lake-H/U\n• Core™ i7-13800HE 6P+8E/20T, 24MB, 45W(35W cTDP) (Iris Xe 96EU)\n• Core™ i5-13600HE 4P+8E/16T, 18MB, 45W(35W cTDP) (Iris Xe 80EU)\n• Core™ i3-13300HE 4P+4E/12T, 12MB, 45W(35W cTPD) (UHD 48EU)\n• Pentium® U300E 1P+4E/5T, 8MB, 15W (UHD)\n• Additional 28W, 15W SKUs and Industrial SKUs are not shown here, check manual\nMemory\n• Up to 64 (2x32) GB DDR5 non-ECC at max. 5200MT/s at two SO-DIMM socket (one top, one bottom)\nPCI Express\n• 1x PEG Gen4 x8 (only for 45W SKU, x8 only, PEG 0-7), 2x PEG Gen4 x4 (x4 only, PEG 8-11, 12-15)\n• 8x PCIe Gen3 x1 (via PCIe switch) or 5x PCIe Gen3 x1 (no PCIe switch)\nDisplay and Audio (4 independent displays)\n• DDI 1/2/3: DP/HDMI2.0b/DVI (2x USB4 overlap with DDI 1/2, build option) ; HD Audio\n• Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n• VGA: through DP to VGA IC (build option, in place of DDI3)\nPeripherals\n• 2.5GbE LAN (TSN at Linux, build option, also selected CPU SKU), 2x SATA 6Gb/s\n• 4x USB 3.2 Gen2/2.0, 4x USB 2.0. 2x UART, 8x GPIO\n• 1x I2C, 1x SMB, LPC (via eSPI to LPC bridge)\n• NVMe Gen3 SSD (build option at PEG 12-15)\nAMI EFI BIOS and Security (TPM 2.0 chip on module)\nDebug Connector: DB30 x86 access to I2C for POST code, test points, SPI, SMB\nVoltage Input : AT/ATX: 8.5V to 20V\nOperation Temperature : Extended -40°C to +85°C (selected SKUs), Standard 0°C to 60°C\n\nProduction\nStandard supported\nWindows 11\nWindows 10\nUbuntu\nyocto\nPROJECT\nintel\nADLINK\nCOM Express®\nRevision\n3.1\nintel CORE\nD HDMI\nPCI EXPRESS 4\nSUPERSpeed USB 4.\nVGA LVDS/ eDP\nSERIAL ATA 6Gb/s\nSUPERSpeed USB 10Gbps\n2.5GbE\nEXTREME RUGGED\nADLINK | Leading Edge AI Computing\nConfidential\n25](.introduction-com-express-q1-2026-2026-02-02/slide-024.jpg) ## Slide 25 ![**Header & Title:**\n* Function Diagram\n* Express-RLP\n* Production (in a blue button)\n\n**Left Side (Connectivity Specs):**\n* PEG Gen4 x8 (PEG 0-7) (45W SKU)\n* PEG Gen4 x4 (PEG 8-11)\n* PER Gen4 x4 (PEG 12-15)\n* DDI 1(USB4_1):\n* DP/HDMI/DVI\n* DDI 2(USB4_2):\n* DP/HDMI/DVI\n* DDI 3: DP/HDMI/DVT\n* LVDS 18/24-bit\n* single / dual\n* eDP x4 lanes (build\n* option)\n* 4x USB 3.2/2.0\n* 4x USB 2.0\n* 2x SATA 6Gb/\n\n**Center (Diagram Labels):**\n* NVMe SSD\n* 4K\n* VGA\n* DP to VGA\n* eDP to LVDS\n* PCIe swtich\n* LAN controller\n* 2.5\n* GbE\n* ESPI\n* eSPI to LPC\n* EC\n* LPC\n* 2x\n* UART\n* 8x\n* GPIO\n* SP I\n* BIOS\n* TPM\n\n**Right Side (Memory & Peripherals):**\n* Max. 64GB (2x 32GB),\n* DDR5 non-ECC SO-DIMM\n* 8x PCIe Gen3x1 (port 0-7)\n* (x4, x2, x1 config at lane 0-3)\n* (x1 config at lane 4-7, PCIe\n* switch)\n* Integrated 2.5GbE\n* (TSN at Linux, build option)\n* HDA\n* High Def.\n* Audio\n\n**Footer & Logos:**\n* COM Express®\n* Revision 3.1\n* EXTREME RUGGED\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 26](.introduction-com-express-q1-2026-2026-02-02/slide-025.jpg) ## Slide 26 ![**Specifications**\n**cExpress-AR**\n\n**Processor:** AMD® Embedded Ryzen V2000 Processor (Zen 2 Core)\n* V2748 2.9(4.15)GHz, 8MB L3, 35-54W (8C/16T) (7CU)\n* V2546 3.0(3.95)GHz, 8MB L3, 35-54W (6C/12T) (6CU)\n* V2718 1.7(4.15)GHz, 8MB L3, 10-25W (8C/16T) (7CU)\n* V2516 2.1(3.95)GHz, 8MB L3, 10-25W (6C/12T) (6CU)\n\n**Memory**\n* Up to 64 (2x32) GB DDR4 ECC/non-ECC at max. 3200MT/s at two SO-DIMM socket (one top, one bottom)\n\n**PCI Express**\n* 1x PEG Gen3 x8 (1 x8 or 2 x4, PEG 0-7)\n* 6x PCIe Gen3 x1 at PCIe 0-5 (x4, x2, x1 config. for port 0-3) (1 x1 at port 4 or 1 x2 at port 4-5)\n* PCIe switch is build option to offer more PCIex1 at port 5-7\n\n**Display and Audio (4 independent displays)**\n* DDI 1/2/3: DP/HDMI2/DVI ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n* VGA: through DP to VGA IC (build option, in place of DDI3)\n\n**Peripherals**\n* Up to 2.5GbE LAN, 2x SATA 6Gb/s , 4x USB 3.2 Gen2/2.0 (via hub for port 1-3), 4x USB 2.0. 2x UART, 8x GPIO\n* 1x I2C, 1x SMB, native LPC\n\n**AMI EFI BIOS and Security** (TPM 2.0 chip on module, build option)\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n**Voltage Input :** AT/ATX: 8.5V to 20V\n**Operation Temperature :** Standard 0°C to 60°C\n\n**Right Side / Graphics:**\nProduction\nAMD\nStandard supported\nWindows 10\nUbuntu\nyocto. PROJECT\nADLINK\nCOM Express®\nRevision 3.0\n\n**Bottom Logos:**\nAMD RYZEN EMBEDDED V\nP HDMI\nVGA LVDS/eDP\nPCI EXPRESS 4\nSERIAL ATA 6Gb/s\nSUPER SPEED USB 3.0 10Gbps\nSUPER SPEED USB 4.0\n2.5GbE\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n27](.introduction-com-express-q1-2026-2026-02-02/slide-026.jpg) ## Slide 27 ![**Header:**\nFunction Diagram\ncExpress-AR\nProduction\n\n**Left Column:**\nPEG Gen3 x8 (PEG 0-7)\nDDI 1: DP/HDMI/DVI\nDDI 2: DP/HDMI/DVI\nDDI 3: DP/HDMI/DVT\nVGA (build option)\nLVDS 18/24-bit single / dual\neDP x4 lanes (build option)\n4x USB 3.2/2.0 (via hub)\n4x USB 2.0\n2x SATA 6Gb/\n\n**Center Diagram Labels:**\n4K\nVGA\nDP to VGA\neDP to LVDS\nAMD RYZEN EMBEDDED\nPCIe swtic h\nLAN controle r\n2.5 GbE\nEC\nBIOS\nSP I\nTPM\nLPC\n2x UART\n8x GPIO\n\n**Right Column:**\nMax. 64GB (2x 32GB), DDR4 ECC/non-ECC SO-DIMM\nUp to 8x PCIe Gen3x1 (port 0-7)\n(x4, x2, x1 config at lane 0-3)\n(x1 config at lane 4-7, PCIe switch)\nIntegrated up to 2.5GbE\nHDA High Def. Audio\n\n**Footer/Logos:**\nCOM Express Revision 3.0\nADLINK | Leading Edge AI Computing\nConfidential\n28](.introduction-com-express-q1-2026-2026-02-02/slide-027.jpg) ## Slide 28 ![**Specifications**\n**Express-TL**\n\n**Processor:** Octa-core 11th Intel® Xeon®, Core™ (Tiger Lake-H)\n* Xeon® W-11865MRE 2.6(4.2)GHz, 24MB, 45W(35W cTDP) (8C/Iris Xe)\n* Core™ i7-11850HE 2.6(4.2)GHz, 24MB, 45W(35W cTDP) (8C/Iris Xe)\n* Core™ i5-11500HE 2.6(4.1)GHz, 12MB, 45W(35W cTDP) (6C/Iris Xe)\n* Core™ i3-11100HE 2.4(4.0)GHz, 8MB 45W(35W cTDP) (4C/Iris Xe)\n* Celeron® 6600HE 2.6GHz, 8MB, 35W (2C/Iris Xe)\n* Additional SKUs are not shown here\n\n**Memory**\n* Up four stacked SODIMMs, up to 128 GB DDR4 at max. 3200MT/s\n* Xeon CPU paired with RM590E support ECC (and non-ECC)\n\n**PCI Express**\n* 1x PEG Gen4 x16 (or 2 x8, 1 x8 plus 2 x4, PEG 0-15) and 8 PCIe Gen3 x1\n\n**Display and Audio (4 independent displays, 4x 4K)**\n* DDI 1/2/3: DP/HDMI2.0b/DVI; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS), eDP x4 lanes (build option)\n* VGA: in place of DDI 3 (build option)\n\n**Chipset** QM580E/HM570E/RM590E\n\n**Peripherals**\n* Up to 2.5GbE LAN (TSN at Linux, opt.) 4x SATA 6Gb/s, 4x USB 3.2 Gen2/2.0, 4x USB 2.0\n* 2x UART, 1x I2C, 1x SMB, LPC (through eSPI to LPC IC), 8x GPIO, NVMe SSD (build option)\n\n**AMI EFI BIOS and Security** (TPM 2.0 chip on module)\n\n**DB30 x86 Debug Connector** access to I2C for POST code, test points, SPI, SMB\n\n**Wide Voltage Input** AT/ATX: 8.5V to 20V\n\n**Operation Temperature** : Extended -40°C to +85°C (selected SKUs) or standard 0°C to 60°C\n\n**Standard supported**\nWindows 10\nUbuntu\nyocto PROJECT\nVxWorks (by request)\n\n**COM Express®**\nRevision 3.0\n\n[Logos at bottom right]:\n* HDMI\n* VGA / LVDS / eDP\n* PCI EXPRESS 4\n* PCI EXPRESS\n* 2.5 GbE\n* SUPERspeed USB 4.0\n* SUPERspeed USB 10 Gbps\n* SERIAL ATA\n* EXTREME RUGGED\n\n**ADLINK | Leading Edge AI Computing**\n**Confidential**\n**29**](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_028.jpg) ## Slide 29 ![**Function Diagram**\n**Express-TL**\n\n**Left Side (Connectivity):**\n* PEG Gen4 x16 or 2 x8 or 1 x8 + 2 x4\n* DDI 1: DP/HDMI/DVI\n* DDI 2: DP/HDMI/DVI\n* DDI 3: DP/HDMI/DVI\n* VGA (build option)\n* LVDS 18/24-bit single / dual\n* eDP x4 lanes (build option)\n* 4x SATA 6Gb/s\n* 4x USB 3.2 Gen2 / 2.0\n* 4x USB 2.0\n\n**Center Diagram Labels:**\n* 4K\n* VGA\n* DP to VGA\n* eDP to LVDS\n* intel 00701\n* 4 independent displays\n* DMI Gen3 (x8)\n* eSPI to LPC\n* LPC\n* 2x UART\n* 8x GPIO\n* EC\n* SPI\n* BIOS\n* TPM\n* BGA SSD (60, 120, 240GB)\n\n**Right Side (Connectivity):**\n* 5.2mm height, top\n* 4.0mm height, bottom\n* Max. 128GB (4x 32GB)\n* DDR4 3200 MT/s\n* 9.2mm height, top\n* 8.0mm height, bottom\n* 3rd, 4th SO-DIMM by project basis\n* 8x PCIe Gen3x1 (x4, x2, x1 support)\n* LAN Chip\n* 2.5 GbE\n* Integrated 2.5GbE (TSN at Linux, optional)\n* HDA High Def. Audio\n\n**Footer:**\n* COM Express® Revision 3.0\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 30](.introduction-com-express-q1-2026-2026-02-02/slide-029.jpg) ## Slide 30 ![**Specifications**\n**cExpress-TL**\n\n**Processor:** 11th Intel® Core™, Celeron® (Tiger Lake-UP3)\n* Core™ i7-1185G7E 2.8 (4.4) GHz 12MB 28W (15W/12w cTDP) (4C/Iris Xe)\n* Core™ i5-1145G7E 2.6 (4.1) GHz 8MB 28W (15W/12w cTDP) (4C/Iris Xe)\n* Core™ i3-1115G4E 3.0 (3.9) GHz 6MB 28W (15W/12w cTDP) (2C/UHD)\n* Celeron® 6305E 1.8 GHz 4MB 15W (2C/UHD)\n* Additional SKUs are not shown here\n\n**Memory**\n* Dual channel (one top, one bottom), max. 64GB (2x32) non-ECC/IBECC DDR4 at max. 3200MT/s\n* In Band ECC, IBECC (SKU depends, also need enable at BIOS setup)\n\n**PCI Express**\n* 1x PEG Gen4 x4 (PEG 0-3), 8x PCIe Gen3 x1 (via PCIe switch, opt.)\n\n**Display and Audio (4 independent displays, 4x 4K)**\n* DDI 1/2/3: DP/HDMI2.0b/DVI ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS), eDP x4 lanes (build option)\n* VGA: in place of DDI 3 (build option)\n\n**Peripherals**\n* Up to 2.5GbE LAN (TSN at Linux, opt.) 2x SATA 6Gb/s, 4x USB 3.2 Gen2/2.0, 4x USB 2.0\n* 2x UART, 1x I2C, 1x SMB, LPC (through eSPI to LPC IC), 8x GPIO\n\n**AMI EFI BIOS and Security (TPM 2.0 chip on module, build opt.)**\n**DB30 x86 Debug Connector** access to I2C for POST code, test points, SPI, SMB\n\n**Wide Voltage Input AT/ATX: 8.5V to 20V**\n**Operation Temperature :** Standard 0°C to 60°C or Extended -40°C to +85°C (selected SKUs)\n\n**Right Side Content:**\nintel\nStandard supported\nWindows 10\nUbuntu\nyocto PROJECT\nVxWorks (by request)\nCOM Express Revision 3.0\n\n**Bottom Logos/Text:**\nP\nHDMI\nVGA\nLVDS/\neDP\nPCI EXPRESS 4\nPCI EXPRESS\n2.5 GbE\nSUPER SPEED USB 4.0\nSUPER SPEED USB 10 Gbps\nSERIAL ATA\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n31](.introduction-com-express-q1-2026-2026-02-02/slide-030.jpg) ## Slide 31 ![Function Diagram\ncExpress-TL\n1x PEG Gen4 x4\n(PEG 0-3)\nDDI 1: DP/HDMI/DVI\nDDI 2: DP/HDMI/DVI\nDDI 3: DP/HDMI/DVT\nVGA (build option)\nLVDS 18/24-\nbit\nsingle / dual\neDP x4 lanes (build option)\n2x SATA 6Gb/s\n4x USB 3.2/2.0\n4x USB 2.0\nCOM Express®\nRevision 3.0\nSOC TDP is 28W (15W cTDP offered by BIOS\nsetting)\n4K\nVGA\nDP to\nVGA\neDP to\nLVDS\nESPI\neSPI to\nLPC\nEC\nLPC\n2x\nUART\n8x\nGPIO\nBIOS\nSPI\nTPM\nPCIe\nswtich\nLAN\nPHY\nMax. 64GB (2x 32GB), DDR4\nnon-ECC or IBECC\n(one SO-DIMM on top, one on\nbottom)\nIntegrated 2.5GbE\n(TSN at Linux, build opt.)\nHDA\nHigh Def.\nAudio\nADLINK | Leading Edge AI\nComputing\nConfidential\n32](.introduction-com-express-q1-2026-2026-02-02/slide-031.jpg) ## Slide 32 ![**Header:**\nSpecifications\ncExpress-ASL\nProduction (Blue badge)\n\n**Left Column (Specifications):**\n**Processor:** Intel® Atom Processor x7000RE & x7000C series, Amston Lake\n• Atom® x7835RE 1.3GHz 12W(8C) IBECC/non-ECC Atom® x7809C 2.4GHz 25W(8C) IBECC/non-ECC (no\n• Atom® x7433RE 1.5GHz 9W(4C) IBECC/non-ECCGPU)\n• Atom® x7213RE 2.0GHz 9W(2C) IBECC/non-ECC Atom® x7405C 2.2GHz 12W(4C) IBECC/non-ECC (no\n• Atom® x7211RE 1.0GHz 6W(2C) IBECC/non-ECC GPU)\n• Atom® x7203C 2.0GHz 9W(2C) IBECC/non-ECC (no GPU)\n**Memory:** soldered down\n• 32/16/8/4 GB LPDDR5 non-ECC at max. 4800MT/s via 2 memory chip, In-band ECC (SKU depends, build option)\n**PCI Express:**\n• 5x PCIe Gen3 x1 lanes (5x1 or 2x2 + 1x1, PCIe 0-4)\n• Additional 3 x1 build option at PCIe 5-7 (remove SATA 0-1, GbE LAN)\n**Display and Audio (3 independent displays)**\n• DDI 1/2: DP/HDMI2.0b/DVI (1x USB-C overlap with DDI 1, build option) ; HD Audio\n• Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n• VGA: through DP to VGA IC (build option, in place of DDI2)\n**Camera:** 1x MIPI-CSI 4lanes at onboard FFC connector (build option, TBC)\n**Peripherals**\n• 2.5GbE LAN (TSN at Linux, build option, with selected CPU SKU, TBC), up to 2x SATA 6Gb/s (SATA 0/1 mux with PCIe 6/5)\n• 4x USB 3.x/2.0 (via hub for port 1-3), 4x USB 2.0. 2x UART, 8x GPIO\n• 1x I2C, 1x SMB, 1x GP_SPI (build option), LPC (via eSPI to LPC bridge), eMMC (build option, 32/64/128GB)\n**AMI EFI BIOS and Security** (TPM 2.0 chip on module, build option)\n**Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n**Voltage Input :** AT/ATX: 8.5V to 20V\n**Operation Temperature :** Extended -40°C to +85°C (selected RE SKUs), Standard 0°C to 60°C\n\n**Right Column:**\nStandard supported\nWindows 11\nWindows 10\nUbuntu\nyocto PROJECT *(by request)\nWindows 11 IoT\nVxWorks *(by request)\nintel.\n[Image of Green Circuit Board]\nCOM Express® Revision 3.1\n\n**Bottom Logos Row:**\nintel. ATOM\nHDMI\nVGA LVDS/ eDP\nPCI EXPRESS\nSERIAL ATA\n2.5GbE\nUSB SUPERSPEED 10Gbps\nMIPI- CSI\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n33](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_032.jpg) ## Slide 33 ![**Specifications**\n**cExpress-ALN**\nAll I/O specification same as cExpress-ASL\nProduction\n\n* **Processor:** Intel® Atom Processor x7000E series, N series & Core i3-N305, Alder Lake-N\n * Atom® x7425E 1.5(3.4)GHz 12W(4C) IBECC Intel® Processor N200 1.0(3.7)GHz 6W(4C) non-ECC\n * Atom® x7213E 1.7(3.2)GHz 10W(2C) IBECC Intel® Processor N97 2.0(3.6)GHz 12W(4C) non-ECC\n * Atom® x7211E 1.0(3.2)GHz 6W(2C) IBECC Intel® Processor N50 1.0(3.4)GHz 6W(2C) non-ECC\n * Core i3-N305 1.8(3.8)GHz 15W(8C) non-ECC\n * N series is supported by project basis\n* **Memory:** soldered down\n * 32/16/8/4 GB LPDDR5 non-ECC at max. 4800MT/s via 2 memory chip, In-band ECC (SKU depends, build option)\n* **PCI Express:**\n * 5x PCIe Gen3 x1 lanes (5x1 or 2x2 + 1x1, PCIe 0-4)\n * Additional 3 x1 build option at PCIe 5-7 (remove SATA 0-1, GbE LAN)\n* **Display and Audio (3 independent displays)**\n * DDI 1/2: DP/HDMI2.0b/DVI (1x USB-C overlap with DDI 1, build option) ; HD Audio\n * Dual channel 18/24-bit LVDS (through eDP to LVDS) or eDP x4 lanes (build option)\n * VGA: through DP to VGA IC (build option, in place of DDI2)\n* **Camera:** 1x MIPI-CSI 4lanes at onboard FFC connector (build option, TBC)\n* **Peripherals**\n * 2.5GbE LAN (TSN at Linux, build option, with selected CPU SKU, TBC), up to 2x SATA 6Gb/s (SATA 0/1 mux with PCIe 6/5)\n * 4x USB 3.x/2.0 (via hub for port 1-3), 4x USB 2.0. 2x UART, 8x GPIO\n * 1x I2C, 1x SMB, 1x GP_SPI (build option), LPC (via eSPI to LPC bridge), eMMC (build option, 32/64/128GB)\n* **AMI EFI BIOS and Security (TPM 2.0 chip on module, build option)**\n* **Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n* **Voltage Input :** AT/ATX: 8.5V to 20V\n* **Operation Temperature :** Standard 0°C to 60°C\n\n**Standard supported**\n* Windows 11\n* Windows 10\n* Ubuntu\n* yocto (by request)\n* Windows 11 IoT\n* VxWorks (by request)\n\nintel\nCOM Express® Revision 3.1\n\nintel ATOM\nHDMI\nPCI EXPRESS\nSERIAL ATA\n2.5GbE\nMIPI-CSI\nVGA LVDS / eDP\nSUPER SPEED USB 10Gbps\n\nADLINK | Leading Edge AI Computing\nConfidential\n34](.introduction-com-express-q1-2026-2026-02-02/slide-033.jpg) ## Slide 34 ![**Title/Header:**\nFunction Diagram\ncExpress-ALS/ALN\nProduction\n\n**Left Column (Connectivity & Display):**\nDDI 1(USB-C):\nDP/HDMI/DVI\nDDI 2: DP/HDMI/DVI\nVGA (build option)\n\nLVDS 18/24-bit\nsingle / dual\neDP x4 lanes (build option)\n\n4x USB 3.2/2.0 (via hub)\n4x USB 2.0\n\nup to 2x SATA 6Gb/s\n(mux with PCIe 6/5)\n\nCOM Express®\nRevision 3.1\n\n**Center/Bottom Connections:**\n4K\nVGA\nDP to\nVGA\neDP to\nLVDS\neSPI to\nLPC\nESPI\nTPM\nEC\nBIOS\nSPI\nLPC 2x\nUART\n8x\nGPIO\neMMC\n(32-\n128GB)\n(build option)\nGP_SPI\n(build option)\n\n**Right Column (Memory & Expansion):**\nMax. 32GB (2x 8GB),\nLPDDR5\nnon-ECC or IBECC\n\nDefault 5x PCIe Gen3x1\n(port 0-4)\n(x2, x1 config at lane 0-3)\n\nAdditional 3 x1 (port 5-7)\n(build option, remove SATA,\nGbE)\n\nLAN controller\n2.5\nGbE\nIntegrated up to 2.5GbE\n(TSN at Linux, build option,\nTBC)\n\nHDA\nHigh Def.\nAudio\n\n1x MIPI-CSI x4 lanes\n(on-board FFC connector)\n(build option)\n\nEXTREME\nRUGGED\n\n**Footer:**\nADLINK | Leading Edge AI\nComputing\nConfidential\n35](.introduction-com-express-q1-2026-2026-02-02/slide-034.jpg) ## Slide 35 ![**Production**\n\n**Specifications**\n**cExpress-EL**\n\n**Processor:** new generation Intel® Atom™ x6000 series (Elkhart Lake)\n* Atom® x6425E 2.0(3.0)GHz 12W (4C) IBECC/non-ECC\n* Atom® x6413E 1.5(3.0)GHz 9W (4C) IBECC/non-ECC\n* Atom® x6211E 1.2(3.0)GHz 6W (2C) IBECC/non-ECC\n* Pentium® J6426 2.0(3.0)GHz 10W (4C) non-ECC\n* Other SKUs not listed above by project basis support\n\n**Memory**\n* Dual channel (one top, one bottom), max. 32GB non-ECC/IBECC DDR4 at max. 3200MT/s\n* In Band ECC, IBECC (SKU depends, also need enable at BIOS setup)\n\n**PCI Express**\n* **6x PCIe** Gen3 x1 lanes (x4, x2, x1 at lane 0-3) (2 x1 at lane 4-5)\n\n**Display and Audio (3 independent displays, 3x 4K)**\n* DDI 1/2: DP/HDMI2.0b/DVI ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS), eDP x4 lanes (build option)\n* VGA: in place of DDI 2 (build option)\n\n**Peripherals**\nUp to **2.5GbE** LAN (TSN at Linux, opt.) 2x SATA 6Gb/s, 2x USB 3.2/2.0, 6x USB 2.0 (max. 4x USB 3.0 via USB 3.0 hub, build option)\n2x UART, 1x I2C, 1x SMB, LPC (through eSPI to LPC IC), 8x GPIO/SD muxed (BIOS switch, SD 3.3V only, as storage at Win10, Yocto is TBC)\neMMC 5.1 (32, 64GB, build option) (boot-up device at Win10 enterprise and Yocto)\n\n**AMI EFI BIOS and Security** (TPM 2.0 chip on module, build opt.)\n**DB30 x86 Debug Connector** access to I2C for POST code, test points, SPI, SMB\n**Wide Voltage Input** AT/ATX: 8.5V to 20V\n**Operation Temperature** : Standard 0°C to 60°C, Extended -40°C to +85°C (selected SKUs)\n\nintel.\n\n**Standard supported**\nWindows 10\nUbuntu\nyocto PROJECT\n\nCOM Express®\nRevision 3.0\n\nintel. ATOM\nD DisplayPort\nHDMI\nVGA\nLVDS/ eDP\nPCI EXPRESS\nSUPERSPEED USB 3.0\nSERIAL ATA 6Gb/s\neMMC\nSD\nEXTREME RUGGED\n\n**ADLINK** | Leading Edge AI Computing\nConfidential\n36](.introduction-com-express-q1-2026-2026-02-02/slide-035.jpg) ## Slide 36 ![**Title:**\nFunction Diagram\ncExpress-EL\n\n**Left Side Specifications:**\nDDI 1: DP/HDMI/DVI\nDDI 2: DP/HDMI/DVI\nVGA (build option)\nLVDS 18/24-bit single / dual\neDP x4 lanes (build option)\n2x SATA 6Gb/s\n2x USB 3.2/2.0\n6x USB 2.0\n(max. 4x USB 3.0/2.0 by HUB, build option)\nSDIO muxed with GPIO\n\n**Right Side Specifications:**\nMax. 32GB, DDR4\nIBECC depends on SKUs (one on top, one on bottom)\n6x Physical PCIe Gen3 lanes\nLane 0-3 support x4, x2, x1 config.\nLane 4 support x1\nLane 5 support x1\nLAN controller\n2.5 GbE\nIntegrated Up to 2.5 GbE (TSN at Linux)\nHDA High Def. Audio\neMMC (32-64GB) (build option)\n\n**Bottom/Center Connections:**\neSPI to LPC\nLPC\n2x UART\nEC\nESPI\nSP I\nBIOS\nTPM (build option)\n8x GPIO Muxed with SDIO\n\n**Logos and Footer:**\nCOM Express® Revision 3.0\nADLINK | Leading Edge AI Computing\nConfidential\n37](.introduction-com-express-q1-2026-2026-02-02/slide-036.jpg) ## Slide 37 ![**Title and Legend:**\n"Product Lifecycle"\nLegend items: "Promotion" (blue square), "Maintenance" (grey square), "Last time buy" (yellow square), "Last shipment" (red square).\n\n**Y-Axis Labels (Product Names):**\ncExpress-MTL\ncExpress-ASL\ncExpress-RLP\nExpress-RLP\ncExpress-ALN\nExpress-ADP\ncExpress-AR\ncExpress-EL\nExpress-TL\ncExpress-TL\ncExpress-WL\nExpress-CFR\nExpress-CF / CFE\ncExpress-KL\nExpress-KL / KLE\ncExpress-SL\ncExpress-BT\n\n**X-Axis and Annotations:**\nYears: "2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 2036 2037"\nSmall grey boxes above years: "Rev 3.0" and "Rev 3.1".\n\n**Right Side Elements:**\nGrey box: "type 6"\nLogo text: "COM Express" (with a green star between words).\n\n**Footer:**\n"ADLINK | Leading Edge AI Computing"\n"Confidential"\n"38"](.introduction-com-express-q1-2026-2026-02-02/slide-037.jpg) ## Slide 38 ![The slide displays the text "Type 7" in the upper left corner. The central graphic features the words "COM Express" separated by a green four-pointed star. The bottom left corner contains the logo text "ADLINK | Leading Edge AI Computing," while the bottom right displays "Confidential" and the page number "39."](.introduction-com-express-q1-2026-2026-02-02/slide-038.jpg) ## Slide 39 ![**Title:** COM Express Type 7 pin groups rev 3.1\n\n**Description:** COM Express Type 7, is a headless computer on module supporting 32 PCI Express Gen 4 lanes and four 10GbE high speed Lan interfaces. Primary applications include network controllers, security appliances, storage servers, and edge computing infrastructure where robust, scalable, and reliable processing of massive data flows is required, often in ruggedized or space-constrained environments.\n\n**Diagrams (Compact & Basic):**\n* **Compact:** 95, SODIMM, SOC, CD, AB, 95, 95\n* **Basic:** 95, SOC, SODIMM, SODIMM, AB, 95, 125\n\n**Pin Groups (Blue Blocks):**\n* USB 3.x upgrade x4\n* PCIe x2\n* 10G-KR CEI mode (x4 blocks)\n* PCIe x16\n* 12V\n* LPC or eSPI\n* NBASE-T LAN x1\n* SATA x2\n* PCIe x2\n* USB 2.0 x4\n* PCIe x2\n* PCIe x6\n* NCSI\n* UART x2\n* GP SPI x1\n* 5Vsb\n* max 135W\n\n**Footer:** ADLINK | Leading Edge AI Computing, Confidential, 40](.introduction-com-express-q1-2026-2026-02-02/slide-039.jpg) ## Slide 40 ![The slide is a product roadmap for "COM Express" featuring a timeline from "In Production" to "2026 Q1-Q2".\n\n**Header & Legend:**\n* **Logo:** COM Express\n* **Status Legend:** In Production (Blue square), Under Design (Green square), Under Consideration (Orange square).\n\n**Vertical Axis Label:**\n* type 7\n\n**Product Listings (organized by timeline columns):**\n\n**Column 1 (In Production / 2024 Q1-Q2):**\n* **Express-ID7** (Blue square: Basic type 6)\n * EXTREME RUGGED\n * Intel® Xeon® D Ice Lake-D (D-1700)\n * Up 128GB ECC DDR4 (4x 32GB)\n * 4x 10G-KR + 1x GbE\n * 16x PCIe Gen4, 16x PCIe Gen3\n* **Express-BD7 / BD74** (Blue square: Basic type 6)\n * EXTREME RUGGED\n * Intel® Xeon® D Broadwell-DE (D1500)\n * BD74 : max 128GB ECC DDR4 (4x 32GB)\n * BD7 : max 64GB ECC DDR4 (2x 32GB)\n * 2x 10G-KR + 1x GbE,\n * Up to 32x PCIe lanes\n* **Express-DN7** (Blue square: Basic type 6)\n * EXTREME RUGGED\n * Intel® Atom® D Denverton-NS (C3000)\n * Up 48GB ECC DDR4\n * 4x 10G-KR + 1x GbE,\n * Up to 2x PCIex8 Gen3\n\n**Column 2 (2024 Q3-Q4):**\n* **Express-VR7** (Blue square: Basic type 6)\n * EXTREME RUGGED\n * AMD® Embedded Ryzen V3000\n * Up 64GB ECC DDR5 (2x32GB) 2x10G-KR + 2.5xGbE\n * Up to 14x PCIe Gen4\n\n**Column 3 (2025 Q3-Q4):**\n* **Express-ID7R** (Green square: Basic type 6)\n * EXTREME RUGGED\n * Intel® Xeon® Ice Lake-D Refresh (D-1800)\n * Up 128GB ECC DDR4 (4x 32GB)\n * 4x 10G-KR + 1x GbE\n * 16x PCIe Gen4, 16x PCIe Gen3\n\n**Timeline Axis:**\n* In Production\n* 2024 Q1-Q2\n* 2024 Q3-Q4\n* 2025 Q1-Q2\n* 2025 Q3-Q4\n* 2026 Q1-Q2\n\n**Footer:**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 41](.introduction-com-express-q1-2026-2026-02-02/slide-040.jpg) ## Slide 41 ![This slide presents the **Specifications** for the **Express-VR7** product, marked with a "Production" tag in the top right corner.\n\n**Left Column Text:**\n* **Processor:** AMD® Embedded Ryzen V3000 Series Processor (Zen 3 core)\n * V3C48 3.3/3.8GHz 16MB L3, 35-54W (8C/16T)\n * V3C44 3.5/3.8GHz 8MB L3, 35-54W (4C/8T)\n * V3C18 1.9/3.8GHz 16MB L3, 10-25W (8C/16T)\n * V3C18I 1.9/3.8GHz 16MB L3, 10-25W (8C/16T) (extend temp.)\n * V3C16 2.0/3.8GHz 16MB L3, 10-25W (6C/12T)\n * V3C14 2.3/3.8GHz 8MB L3, 10-25W (4C/8T)\n* **Memory**\n * Up to 64 GB DDR5 ECC/non-ECC at max. 4800MT/s (SKU dependent) at two SO-DIMM socket\n* **PCI Express : 14 lanes Gen4**\n * 1 PCIe x8 at Lane 16-23 (1 x8, 2 x4 config. two devices)\n * 4 PCIe at Lane 0-3 (x1, x2, x4 config. four devices), 2 PCIe at Lane 4-5 (only one device)\n* **Ethernet : 2x 10GbE + 1x 2.5GbE**\n * 10GbE: 2x 10GBASE-KR (or SFP+, 10GBASE-T, depends on PHY on carrier)\n * GbE: 2.5GbE & 10/100/1000M\n* **Peripherals**\n * 2x SATA 6Gb/s, 4x USB 3.2 Gen 2/2.0, 2x UART, 8x GPIO\n * 1x I2C, 1x SMB, 1x GP_SPI (build option), LPC (via eSPI to LPC bridge), IPMB (build option)\n* **AMI EFI BIOS and Security (TPM 2.0 chip on module)**\n* **Debug Connector : DB40-HPC access to I2C for POST code, test points, SPI, SMB**\n* **Voltage Input : AT/ATX: 8.5V to 20V**\n* **Operation Temperature : Extended -40°C to +85°C (selected SKUs) or standard 0°C to 60°C**\n\n**Right Column Visuals:**\n* **Standard supported:** Logos for **Ubuntu** and **Yocto Project**.\n* **AMD** logo.\n* An image of the green circuit board (COM Express module).\n* **COM Express® Revision 3.1** logo.\n* Row of certification logos at the bottom: **AMD Ryzen Embedded**, **Serial ATA**, **PCI Express 4**, **Extreme Rugged**, and **USB SuperSpeed**.\n* Three small icons at the very bottom indicating **10Gb E**, **10Gb E**, and **2.5GbE**.\n\n**Footer:**\n* **ADLINK | Leading Edge AI Computing**\n* **Confidential**\n* Page number **42**](.introduction-com-express-q1-2026-2026-02-02/slide-041.jpg) ## Slide 42 ![**Header**\nFunction Diagram\nExpress-VR7\nProduction\n\n**Left Side Connectivity**\nPCIe x8 Gen4 at Lane 16-23\n(1 x8, 2 x4) (2 devices)\n2x PCIe Gen4 at Lane 4-5\n(x2) (1 device)\n4x PCIe Gen4 at Lane 0-3\n(x1, x2, x4) (4 devices)\n4x USB 3.2 Gen2 /2.\n2x SATA 6Gb/s\n\n**Center Component**\nAMD\nRYZEN\nEMBEDDED\n\n**Bottom Center Bus/Interface**\nGP_SPI\n(build option)\neSPI to\nLPC\nEC\nSPI\nBIOS\nMMC\n(build option)\nTPM\n(build option)\nLPC\nIPMB\n2x\n8x\nUARTGPIO\n\n**Right Side Memory & Network**\nMax. 64GB (2x 32GB),\nDDR5\nECC / non-ECC\nTwo SODIMM socket\n2x 10GBASE-KR\nwith sideband\nLAN controller\nIntegrated 2.5GbE\nDedicated PHY add-on card\n10G-SFP+ (CS4227 PHY)\n10GBASE-T (AQR113C PHY)\n\n**Footer/Branding**\nCOM Express®\nRevision 3.1\nADLINK | Leading Edge AI\nComputing\nConfidential\n43](.introduction-com-express-q1-2026-2026-02-02/slide-042.jpg) ## Slide 43 ![**Header:**\nSpecifications\nExpress-ID7\n\n**Top Right Badge:**\nProduction\n\n**Left Column (Specifications List):**\nProcessor : Intel® Xeon® D-1700 Series Processor (Ice Lake-D LCC)\n• Xeon® D-1746TER 2.0/3.1GHz 15MB, 67W (10C) (eTEMP)\n• Xeon® D-1735TR 2.2/3.4GHz 15MB, 59W (8C)\n• Xeon® D-1732TE 1.9/3.0GHz 15MB, 52W (8C) (eTEMP)\n• Xeon® D-1715TER 2.4/3.5GHz 10MB, 45W (4C) (eTEMP)\n• Xeon® D-1712TR 2.0/3.1GHz 18MB, 40W (4C)\n• Additional non-IOTG SKUs not listed above, support by project basis\n\nMemory :\n• Up to 128 GB DDR4 ECC/non-ECC at max. 2933MT/s (SKU dependent)\n• Up four stacked SODIMMs (two on top, two on bottom)\n\nPCI Express : 32 lanes\n• 16 PCIe Gen4 at Lane 16-31 (1 x16, 2 x8, 4 x4 config)\n• 8 PCIe Gen3 at Lane 0-7 (1 x8, 2 x4, 4 x2/x1 config.)\n• 8 PCIe Gen3 at Lane 8-15 (1 x8, 2 x4, 2 x2/x1 config)\n\nEthernet : 4x 10GbE + 1x 1GbE\n• 10GbE: 4x 10GBASE-KR with PHY on carrier for Optical / Copper / SFP+\n• GbE: 10/100/1000M, NC-SI (Network Controller Sideband Interface): default connect to GbE\n\nPeripherals\n• 2x SATA 6Gb/s, 4x USB 3.0/2.0, 2x UART, 1x I2C, 1x SMB, LPC, 8x GPIO\n• combined HSIO (USB, PCIe, SATA, GbE) bandwidth cannot exceed 16 PCIe Gen3.0 lanes bandwidth\n\nAMI EFI BIOS and Security (TPM 2.0 chip on module)\nDebug Connector : DB30 x86 access to I2C for POST code, test points, SPI, SMB\nVoltage Input : AT/ATX: 12V +/- 5%\nOperation Temperature : Standard 0°C to 60°C, Extended -40°C to +85°C (selected SKUs)\n\n**Right Column (Logos & OS Support):**\nStandard supported\nWindows Server 2022\nWindows 11\nWindows 10\nUbuntu\nyocto . PROJECT\nintel\nCOM Express®\nRevision 3.0\n\n**Bottom Right Icons (Text within logos):**\nintel. xeon D\n10Gb E (x4)\n1GbE\nSERIAL ATA\nPCI EXPRESS 4\nSUPER SPEED USB\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n44](.introduction-com-express-q1-2026-2026-02-02/slide-043.jpg) ## Slide 44 ![Function Diagram\nExpress-ID7\nProduction\nPCIe x16 Gen4 at Lane 16-31 (1 x16, 2 x8, 4 x4)\nPCIe x8 Gen3 at Lane 0-7 (1 x8, 2 x4, 4 x2/x1)\nPCIe x8 Gen3 at Lane 8-15 (1 x8, 2 x4, 2 x2/x1)\n4x USB 3.0/2.0\n2x SATA 6Gb/s\nintel XEON Intel Xeon D-1700 Processor\nMax. 128GB (4x 32GB), DDR4 ECC / non-ECC (two on top, two on bottom)\n4x 10GBASE-KR (up to 25G)\n10G sideband signals NC-SI\nLAN controller\nIntegrated GbE\nTPM\nLPC\nSP I\nEC\nBIOS\nLPC 2x UART\n8x GPIO\nDedicated PHY add-on card 10G-SFP+ (C827 PHY) 10GBASE-T (X557-AT4 PHY)\nCOM Express® Revision 3.0\nADLINK | Leading Edge AI Computing\nConfidential\n45](.introduction-com-express-q1-2026-2026-02-02/slide-044.jpg) ## Slide 45 ![**Header:**\nAll I/O specification same as Express-ID7\nProduction\n\n**Title:**\nSpecifications\nExpress-ID7R (Refresh)\n\n**Left Column Content:**\nProcessor: Intel® Xeon® D-1800 Series Processor (Ice Lake-D Refresh LCC)\n• Xeon® D-1848TER 2.0/3.1GHz 15MB, 57W (10C) (eTEMP)\n• Xeon® D-1844NT 2.2/3.1GHz 15MB, 55W (10C)\n• Xeon® D-1813NT 2.2/2.4GHz 15MB, 42W (4C)\n• Additional non-IOTG SKUs not listed above, support by project basis\n\nMemory :\n• Up to 128 GB DDR4 ECC/non-ECC at max. 2933MT/s (SKU dependent)\n• Up four stacked SODIMMs (two on top, two on bottom)\n\nPCI Express : 32 lanes\n• 16 PCIe Gen4 at Lane 16-31 (1 x16, 2 x8, 4 x4 config)\n• 8 PCIe Gen3 at Lane 0-7 (1 x8, 2 x4, 4 x2/x1 config.)\n• 8 PCIe Gen3 at Lane 8-15 (1 x8, 2 x4, 2 x2/x1 config)\n\nEthernet : 4x 10GbE + 1x 1GbE\n• 10GbE: 4x 10GBASE-KR with PHY on carrier for Optical / Copper / SFP+\n• GbE: 10/100/1000M, NC-SI (Network Controller Sideband Interface): default connect to GbE\n\nPeripherals\n• 2x SATA 6Gb/s, 4x USB 3.0/2.0, 2x UART, 1x I2C, 1x SMB, LPC, 8x GPIO\n• combined HSIO (USB, PCIe, SATA, GbE) bandwidth cannot exceed 16 PCIe Gen3.0 lanes bandwidth\n\nAMI EFI BIOS and Security (TPM 2.0 chip on module)\nDebug Connector : DB30 x86 access to I2C for POST code, test points, SPI, SMB\nVoltage Input : AT/ATX: 12V +/- 5%\nOperation Temperature : standard 0°C to 60°C , extended -40°C to +85°C (selected SKUs)\n\n**Right Column Content (OS Support & Logos):**\nStandard supported\nWindows Server 2022\nWindows 11\nWindows 10\nUbuntu\nyocto . PROJECT\n\nintel\nCOM Express®\nRevision 3.0\n\nintel Xeon D\n10Gb\n10Gb\nSERIAL ATA\nPCI EXPRESS 4\n10Gb\n10Gb\n1GbE\nSUPER SPEED USB\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n46](.introduction-com-express-q1-2026-2026-02-02/slide-045.jpg) ## Slide 46 ![**Slide Title:** Product Lifecycle\n\n**Legend:**\n* Promotion\n* Maintenance\n* Last time buy\n* Last shipment\n\n**Chart Y-Axis (Product Lines):**\n* Express-ID7R\n* Express-VR7\n* cExpress-ID7\n* Express-DN7\n* Express-BD74\n* Express-BD7\n\n**Timeline Annotations:**\n* Rev .3.0\n* Rev .3.1\n* type 7\n\n**X-Axis (Years):**\n2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 2036 2037\n\n**Footer & Branding:**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* COM Express\n* 47](.introduction-com-express-q1-2026-2026-02-02/slide-046.jpg) ## Slide 47 ![The slide features a split background, white on the left and light grey on the right.\n\n**Text content (verbatim):**\n* **Top Left:** Type 10\n* **Center:** COM [green star icon] Express\n* **Bottom Left:** ADLINK | Leading Edge AI (with ADLINK in red) followed by "Computing" on the next line.\n* **Bottom Right:** Confidential 48](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_047.jpg) ## Slide 48 ![COM Express Type 10 pin groups rev 3.1\n\nThe COM Express Type 10 Mini is designed for ultra-compact and low-power embedded applications, it typically uses Atom level x86 processors with a focus on energy efficiency.\n\nIts small size and its soldered memory make it ideal for space-constrained, high-vibration environments. Primary applications include portable medical devices, wearable technology, advanced sensors, and other miniature IoT edge devices\n\nMini\n55\n84\nLPDDR LPDDR LPDDR LPDDR\nSOC\nAB\n\nLPC\nor\neSPI\n\nNBASE-\nT\nLAN\nx1\n\nSATA\nx4\n\nHD\nA\nSND\nW\n\nUSB\n3.x\nupgrad\ne\nx2\n\nUSB 2.0\nx8\n\nPCIe\nx4\n\nDDI_1\nHDMI /\nDP\n\nLVDS\nor\neDP\n\nGP\nSPI\nx1\n\n12V\n5Vsb\nmax\n135W\n\nADLINK | Leading Edge AI\nComputing\nConfidential\n49](.introduction-com-express-q1-2026-2026-02-02/slide-048.jpg) ## Slide 49 ![The slide presents a roadmap for "COM Express" products.\n\n**Header & Legend:**\n* **Title:** "COM Express" (with a green star logo).\n* **Legend:**\n * Blue square: "In Production"\n * Green square: "Under Design"\n * Orange square: "Under Consideration"\n\n**Chart Structure:**\n* **Y-axis Label:** "type 10"\n* **X-axis Timeline:** "In Production", "2024 Q1-Q2", "2024 Q3-Q4", "2025 Q1-Q2", "2025 Q3-Q4", "2026 Q1-Q2"\n\n**Product Details:**\n* **In Production Column (Blue boxes labeled "Mini type 10"):**\n * **nanoX-EL** (Stamped "EXTREME RUGGED"): "Intel® Atom™ x6000 (Elkhart Lake) up 16 GB non-ECC/IBECC, LPDDR4 up to 2.5GbE, TSN opt."\n * **nanoX-AL** (Stamped "EXTREME RUGGED"): "Intel® Atom™ Apollo Lake SOC, up 8 GB DDR3L non ECC"\n * **nanoX-BT** (Stamped "EXTREME RUGGED"): "Intel® Atom™ Baytrail SOC, up to 4 GB DDR3L non ECC"\n* **2026 Q1-Q2 Column (Green box labeled "Mini type 10"):**\n * **nanoX-ASL** (Stamped "EXTREME RUGGED"): "Intel® Atom™ x7000 (Amston Lake) up 16 GB non-ECC/IBECC, LPDDR5 up to 2.5GbE, TSN opt."\n* The columns for "2024 Q1-Q2", "2024 Q3-Q4", "2025 Q1-Q2", and "2025 Q3-Q4" are empty.\n\n**Footer:**\n* "ADLINK | Leading Edge AI Computing"\n* "Confidential"\n* "50"](.introduction-com-express-q1-2026-2026-02-02/slide-049.jpg) ## Slide 50 ![The slide is titled "Specifications" in red text followed by "nanoX-ASL" in large grey text.\n\n**Left Column (Specifications List):**\n* **Processor:** Intel® Atom Processor x7000RE & x7000C series, Amston Lake\n * Atom® x7835RE 1.3GHz 12W(8C) IBECC/non-ECC\n * Atom® x7433RE 1.5GHz 9W(4C) IBECC/non-ECC\n * Atom® x7213RE 2.0GHz 9W(2C) IBECC/non-ECC\n * Atom® x7211RE 1.0GHz 6W(2C) IBECC/non-ECC\n* **Memory:** soldered down\n * 32/16/8/4 GB LPDDR5 non-ECC at max. 4800MT/s via 2 memory chip, In-band ECC\n* **PCI Express:**\n * 4x PCIe Gen3x1 lanes (4 x1 or 2 x2 or 1 x4 or 1 x2 + 2 x1 or 2 x1 + 1 x2)\n* **Display, Camera and Audio (2 independent displays)**\n * DDI 0: DP/HDMI2.0b/DVI ; HD Audio\n * Single channel 18/24-bit LVDS (through eDP to LVDS), eDP x4 lanes (build option)\n* **Peripherals**\n * 2.5GbE LAN (TSN at Linux, build option, with selected CPU SKU, TBC), 2x SATA 6Gb/s\n * 2x USB 3.x/2.0, 6x USB 2.0. USB dual role (TBC, build option), 2x UART, 8x GPIO (SDIO, build option)\n * 1x I2C, 1x SMB, 1x GP_SPI (build option), LPC (via eSPI to LPC bridge), eMMC (build option, 32/64/128GB)\n* **AMI EFI BIOS and Security** (TPM 2.0 chip on module, build option)\n* **Debug Connector:** DB30 x86 access to I2C for POST code, test points, SPI, SMB\n* **Voltage Input :** AT/ATX: 8.5V to 20V\n* **Operation Temperature**\n * Standard 0°C to 60°C , Extended -40°C to +85°C (selected RE SKUs, TBC)\n\n**Right Side (Graphics & Logos):**\n* Top right corner: Green button reading "Developing"\n* "Standard supported" header with logos for:\n * Windows 11\n * Windows 10\n * Ubuntu\n * VxWorks (by request)\n* Image of a hardware module (COM Express)\n* "intel." logo\n* "COM Express® Revision 3.1" logo\n* Bottom row of technology logos:\n * intel. ATOM\n * HDMI\n * PCI EXPRESS\n * SUPER SPEED USB 10Gbps\n * EXTREME RUGGED\n * LVDS/ eDP\n * SERIAL ATA\n * 2.5GbE\n * MIPI-CIS\n\n**Footer:**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 51](.introduction-com-express-q1-2026-2026-02-02/slide-050.jpg) ## Slide 51 ![**Header**\n* Function Diagram\n* nanoX-ASL\n* Developing\n\n**Left Column (I/O & Connectivity)**\n* DDI 0: DP/HDMI/DVI\n* 4K\n* LVDS 18/24-bit single\n* eDP x4 lanes (build option)\n* eDP to LVDS\n* 2x SATA 6Gb/s\n* 2x USB 3.2/2.0\n* 6x USB 2.0\n* USB dual role (TBC)\n* SDIO (build option) (remove GPIO)\n\n**Bottom Left (Branding/Standard)**\n* COM Express®\n* Revision 3.1\n* ADLINK | Leading Edge AI Computing\n\n**Center Diagram (Internal Connections)**\n* eSPI to LPC\n* ESPI\n* EC\n* TPM\n* SPI\n* BIOS\n* eMMC (32-128GB)\n* (build option)\n* LPC 2x UART\n* 8x GPIO\n* GP_SPI (build option) (TBC)\n\n**Right Column (Memory & External Interfaces)**\n* Max. 16GB (2x 8GB), LPDDR5 non-ECC or IBECC\n* Default 5x PCIe Gen3x1 (port 0-4) (x2, x1 config at lane 0-3)\n* LAN controller\n* 2.5 GbE\n* Integrated up to 2.5GbE (TSN at Linux, build option, TBC)\n* HDA High Def. Audio\n\n**Footer**\n* Confidential\n* 52](.introduction-com-express-q1-2026-2026-02-02/slide-051.jpg) ## Slide 52 ![**Specifications**\n**nanoX-EL**\n\n**Production** (Blue button, top right)\n\n**Processor:** Intel® Atom™ x6000 series (Elkhart Lake)\n* Atom® x6425E 2.0(3.0)GHz 12W (4C) IBEECC/non-ECC\n* Atom® x6413E 1.5(3.0)GHz 9W (4C) IBEECC/non-ECC\n* Atom® x6211E 1.2(3.0)GHz 6W (2C) IBEECC/non-ECC\n* Additional SKUs not shown here is project basis support\n\n**Memory**\n* Soldered LPDDR4, max. 16GB non-ECC/IBEECC at max. 4276MT/s\n* 2/4/8/16GB (8/16GB by project basis)\n\n**PCI Express**\n* 4x PCIe Gen3x1 lanes (4 x1 or 2 x2 or 1 x4 or 1 x2 + 2 x1 or 2 x1 + 1 x2)\n\n**Display and Audio (2 independent displays, 2x 4K)**\n* DDI 0: DP/HDMI2.0b/DVI ; HD Audio\n* Dual channel 18/24-bit LVDS (through eDP to LVDS), eDP x4 lanes (build option)\n\n**Peripherals**\n* Up to 2.5GbE LAN (TSN at Linux, opt.) 2x SATA 6Gb/s, 2x USB 3.2/2.0, 6x USB 2.0\n* 2x UART, 1x I2C, 1x SMB, LPC (through eSPI to LPC IC), 8x GPIO/SD muxed (BIOS switch, SD 3.3V only, as storage at Win10, Yocto is TBC)\n* eMMC 5.1 (32, 64GB, build option) (boot-up device at Win10 enterprise and Yocto)\n\n**AMI EFI BIOS and Security (TPM 2.0 chip on module, build opt.)**\nDB30 x86 Debug Connector access to I2C for POST code, test points, SPI, SMB\n\n**Wide Voltage Input AT/ATX: 4.75V to 20V**\n\n**Operation Temperature :**\nStandard 0°C to 60°C or Extended -40°C to +85°C (selected SKUs)\n\n**Right Side Content:**\nStandard supported\nWindows 10 (Windows Logo)\nyocto PROJECT\nVxWorks (by request)\nintel.\n\nCOM Express®\nRevision 3.1\n\n**Bottom Row Logos:**\nintel. ATOM\nHDMI\nLVDS/ eDP\nPCI EXPRESS\nSUPER SPEED USB 10Gbps\nSERIAL ATA 6Gb/s\n2.5GbE\nMIPI-CIS\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n53](.introduction-com-express-q1-2026-2026-02-02/slide-052.jpg) ## Slide 53 ![The slide presents a "Function Diagram" for a module named "nanoX-EL". A "Production" tag is in the top right corner. The diagram is centered around a central processor chip labeled "INTEL CONFIDENTIAL QTHY SAMPLE".\n\n**Left Side Connections:**\n* **DDI 0:** "DP/HDMI/DVI" connected to a "4K" monitor icon.\n* **LVDS:** "18/24-bit single / dual" connected to a screen icon. Faint text reads "eDP x4 lanes (build option)".\n* A grey box labeled "eDP to LVDS".\n* **Storage:** "2x SATA 6Gb/s" connected to a hard drive icon.\n* **USB:** "2x USB 3.2 Gen2/2.0 6x USB 2.0" connected to USB port icons.\n* **GPIO:** "8x GPIO or SDIO muxed" connected to chip images.\n* **Bottom Left Logo:** "COM Express® Revision 3.1"\n\n**Right Side Connections:**\n* **Memory:** Four memory chip icons labeled "Max. 16GB LPDDR4 IBECC depends on SKUs (8GB/16GB is build option)".\n* **PCIe:** Four connector icons labeled "Default 4x PCIe Gen3x1 (0-3) (1 x4 or 2 x2 or 4x 1 or 1 x2 + 2 x1 or 2 x1 + 1 x2)".\n* **Network:** A grey box labeled "LAN controller" connects to a blue icon labeled "2.5 GbE". Text reads "Integrated Up to 2.5 GbE (TSN at Linux)".\n* **Audio:** An icon labeled "HDA High Def. Audio".\n\n**Bottom Connections:**\n* A grey box labeled "eSPI to LPC" connects to "LPC 2x UART".\n* A grey box labeled "ESPI" connects to a grey box labeled "EC".\n* A label "SPI" connects to a grey box labeled "BIOS".\n* A dashed box labeled "eMMC (32-64GB) (build option)".\n* A dashed box labeled "TPM (build option)".\n\n**Footer:**\n* "ADLINK | Leading Edge AI Computing"\n* "Confidential"\n* "54"](.introduction-com-express-q1-2026-2026-02-02/slide-053.jpg) ## Slide 54 ![**Product Lifecycle**\n\n**Legend:**\n* Promotion (Blue square)\n* Maintenance (Grey square)\n* Last time buy (Yellow square)\n* Last shipment (Red square)\n\n**Chart Rows:**\n* nanoX-EL\n* nanoX-AL\n* nanoX-BT\n\n**Timeline (2015–2037):**\n2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 2036 2037\n\n**Annotations:**\n* Rev .3.0 (Small grey box below 2018)\n* Rev .3.1 (Small grey box below 2023)\n* type 10 (Grey box on the far right)\n* COM [Green Star Icon] Express\n\n**Footer:**\n* ADLINK | Leading Edge AI\n* Computing\n* Confidential\n* 55](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_054.jpg) ## Slide 55 ![The slide contains the following text:\n\n* **Type 2**\n* Maintenance of type 2 is crucial for applications where longevity is measured in decades\n* **COM Express**\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 56](.introduction-com-express-q1-2026-2026-02-02/slide-055.jpg) ## Slide 56 ![**Title:** COM Express Type 2 pin groups rev 2.1\n\n**Body Text:**\nThe COM Express Type 2 specification is notable for its retention of legacy PCI and Parallel ATA (PATA) interfaces alongside modern PCIe and USB ports. Maintenance of type 2 is crucial for applications where longevity is measured in decades. PCI is still used to interface with specialized expansion cards in industrial automation, medical imaging, and T&M equipment. PATA (IDE) remains critical for upgrading or maintaining existing systems that rely on older storage drives and optical media, avoiding costly and complex full-system redesigns.\n\n**Diagrams:**\nTwo diagrams illustrate module sizes:\n* **Compact:** 95x95mm (showing SODIMM, SOC, CD, AB)\n* **Basic:** 125x95mm (showing SOC, SODIMM, AB)\n\n**Pin Group Chart (Blue Blocks):**\n* PATA / IDE\n* PCI\n* PCIe / x16\n* 12V / 5Vsb / max 135W\n* LPC\n* NBASE-T LAN x1\n* SATA x4\n* HD A\n* USB 2.0 / x8\n* PCIe / x6\n* LVDS\n* CRT VGA\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n57](.introduction-com-express-q1-2026-2026-02-02/slide-056.jpg) ## Slide 57 ![**COM Express**\n\n**Legend:**\nIn Production\nUnder Design\nUnder Consideration\n\n**Y-Axis Label:**\ntype 2\n\n**Product Blocks:**\n* **Express-KL2** (EXTREME RUGGED)\n * Basic type 2\n * Intel® 7th Gen. Xeon®, Core™ i7/i5/i3\n * PCH QM175/HM175/CM238\n * up 32GB DDR4 ECC/non-ECC support\n\n* **Express-SL2** (EXTREME RUGGED)\n * Basic type 2\n * Intel® 6th Gen. Xeon®, Core™ i7/i5/i3\n * PCH QM170/HM170/CM236\n * up 32GB DDR4 ECC/non-ECC support\n\n* **Express-BT2** (EXTREME RUGGED)\n * Compact type 2\n * Intel® Atom™ Baytrail SOC,\n * up 8GB non ECC DDR3L\n\n**Timeline:**\nIn Production\n2024 Q1-Q2\n2024 Q3-Q4\n2025 Q1-Q2\n2025 Q3-Q4\n2026 Q1-Q2\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n58](.introduction-com-express-q1-2026-2026-02-02/slide-057.jpg) ## Slide 58 ![**Specifications**\n**Express-KL2**\n\n**Production**\n\n**Processor:** 7th Intel® Xeon®, Core™ & Celeron® (Kaby Lake)\n* Xeon® E3-1505M v6 3.0(4.0)GHz 8MB 45W(35W cTDP) (4C/GT2)\n* Core™ i7-7820EQ 3.0(3.7)GHz 8MB 45W(35W cTDP) (4C/GT2)\n* Core™ i5-7440EQ 2.9(3.6)GHz 6MB 45W(35W cTDP) (4C/GT2)\n* Core™ i3-7100E 2.9GHz 3MB 35W (2C/GT2)\n\n**Memory**\n* Dual stacked SODIMMs up to 32 GB DDR4 at 1867/2133MHz\n* Xeon, i3 CPU paired with CM238 support ECC (and non-ECC)\n\n**Displays and Audio (3 independent displays)**\n* VGA, Dual channel 18/24-bit LVDS (through eDP to LVDS), eDP x4 lanes (build option)\n* DDI 1/2: DP / HDMI / DVI (build option, muxed with PCIex16)\n* HD Audio\n\n**Chipset (QM175/HM175/CM238)**\n\n**Peripherals and Busses**\n* PCI Express : PCIex16 Gen3 or two PCIe x8 or one PCIex8 plus two PCIe x4\n* 6x PCIex1 Gen3, PCI (through PCIe to PCI IC) and GbE\n* 3x SATA 6Gb/s, 1x PATA (through SATA to PATA IC) (max. 4x SATA, no PATA, build option)\n* 8x USB 2.0, 1x I2C, 1x SMB, LPC, 8x GPIO\n\n**AMI EFI BIOS with Intel AMT, TPM 2.0 on module**\n**DB40 Debug connector:** access to LPC for POST code, test points, SPI, SMB\n**Wide voltage input AT/ATX:** 8.5V to 20V\n\n**Operation Temperature**\nExtended -40°C to +85°C (selected 25W SKUs) or standard 0°C to 60°C\n\n**intel.**\n\n**Standard supported**\nWindows 10\nyocto™\nVxWorks\n(by request)\n\n**COM Express®**\nRevision 2.1\n\n[Logos at bottom]\nintel CORE i7 7th Gen\nVGA\nPCI EXPRESS\nPCI LOCAL BUS\nEthernet\nLVD S\nHI-SPEED CERTIFIED USB\nSERIAL ATA\nRAI\nEXTREME RUGGED\n\nADLINK | Leading Edge AI Computing\nConfidential\n59](.Introduction-COM-Express-Q1-2026-[2026-02-02]/slide_058.jpg) ## Slide 59 ![**Function Diagram**\n**Express-KL2**\n\n**Production**\n\n**Left Column Specifications:**\n* PEG PCIe Gen3 x16\n* or 2 x8 or 1 x8 + 2 x4\n* DDI 1: DP/HDMI/DVI\n* DDI 2: DP/HDMI/DVI\n* (build option) (muxed with PEG)\n* VGA (build option)\n* LVDS 18/24-bit single / dual\n* eDP x4 lanes (build option)\n\n**Center/IO Labels:**\n* 4K\n* VGA\n* DP to VGA\n* eDP to LVDS\n* intel\n* DMI Gen3\n* 3x SATA 6Gb/s\n* (4x SATA, if no PATA)\n* (build option)\n* 1x PATA\n* 8x USB 2.0\n* SATA to PATA\n\n**Right Column Specifications:**\n* Max. 32GB (2x 16GB), DDR4\n* PCIe to PCI\n* PCI 2.3, 32 bit 33MHz\n* 6x PCIe Gen3x1 (x4, x2, x1 support)\n* LAN PHY\n* Integrated GbE\n* HDA High Def. Audio\n\n**Bottom Connections/Labels:**\n* 8x GPIO\n* SMBus\n* SP\n* BMC\n* BIOS\n* TPM\n* LPC\n* LPC to UART\n* 2x UART\n\n**Footer:**\n* COM Express®\n* Revision 2.1\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 60](.introduction-com-express-q1-2026-2026-02-02/slide-059.jpg) ## Slide 60 ![**Header:**\nSpecifications\ncExpress-BT2\nProduction\n\n**Main Text (Left Column):**\nIntel® Atom™ & Celeron Processor (BayTrail)\n• Atom™ E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)\n• Atom™ E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)\n• Atom™ E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)\n• Atom™ E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)\n• Atom™ E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)\n• Atom™ E3805 1.33 GHz (No GFX) 3W (2C/1066)\n• Celeron® N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)\n• Celeron™ J1900 2.0/2.42GHz (Burst), 688/854 (Turbo) 10W (4C/1333)\n\nDual SODIMM up to 8 GB DDR3L at 1067/1333 MHz\n\nDisplay Support\n• Dual channel 18/24-bit LVDS\n• Analog VGA\n\nPeripherals\n• 3 free x1 PCI Express lanes Gen2\n• 2 SATA 3Gb/s, SDIO socket and optional eMMC on module (8/16/32GB)\n• 6 USB 2.0, and 1 USB 3.0, 2 Serial Ports\n• Intel GbE and HDA Audio\n\nAMI UEFI BIOS / optional TPM on module\n\nSEMA Board Controller :\n• BIOS failover, Voltage / Current & Temp monitor,\nPower sequence control and monitor, Watchdog, Board info\n\nDebug connector : access to LPC for POST CODE, Test Points, SPI, SMC\n\nWide voltage input AT/ATX : 5 ~ 20V\n\nOperating Temperature : Standard 0 to +60°C / Extreme Rugged -40 to +85°C\n\n**Right Side Graphics & Logos:**\nintel\nStandard Supported\nWindows 7\nyocto\nVxWorks\nCOM Express®\nRevision 2.1\n\n**Bottom Logos/Text:**\nintel Bay Trail\nVG A\nPCI EXPRESS\nPCI LOCAL BUS\nEthernet\nLVD S\nHI-SPEED CERTIFIED USB\nSERIAL ATA 3Gb/s\nRA A\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n61](.introduction-com-express-q1-2026-2026-02-02/slide-060.jpg) ## Slide 61 ![**Header:** Function Diagram, Express-BT2, Production\n\n**Central Component:** Intel processor chip.\n\n**Left Side Connections:**\n* VGA: Analog\n* LVDS 18/24-bit or (connected to box: eDP to LVDS)\n* USB 2.0 7 ports\n* 2x SATA at 6Gb/s\n* PATA 1 port (connected to box: SATA to PATA)\n* eMMC 8~32 GB optional (connected to box: eMMC 8~32 GB)\n* Label: SATA (dashed line)\n\n**Bottom/Center Connections:**\n* Label: SMB (connected to box: SEMA BMC)\n* Label: SPI (connected to box: Dual BIOS)\n* Box: TPM (optional)\n* Label: 2 UART ports\n* Label: High Def Audio\n\n**Right Side Connections:**\n* Max. 4GB SODIMM 1067/1333 MHz DDR3L (x2)\n* Standard 2 PCIe x1 GEN2\n* Box: PCIe to PCI (connected to slots: PCI 2.3, 32 bit / 33MHz)\n* Box: Intel LAN PHY (connected to card: Integrated GbE)\n\n**Footer/Branding:**\n* COM Express® Revision 2.1\n* ADLINK | Leading Edge AI Computing\n* Confidential\n* 62](.introduction-com-express-q1-2026-2026-02-02/slide-061.jpg) ## Slide 62 ![The slide displays a "Product Lifecycle" chart with a legend indicating four phases: "Promotion" (blue), "Maintenance" (grey), "Last time buy" (yellow), and "Last shipment" (red).\n\nThe chart lists three products on the vertical axis:\n* **Express-KL2**\n* **Express-SL2**\n* **cExpress-BT2**\n\nThe horizontal axis displays years from 2015 to 2037.\n\nAdditional text elements include:\n* **Rev .3.0** (located below the timeline around 2017)\n* **Rev .3.1** (located below the timeline around 2023)\n* **type 2** (in a grey box on the right)\n* **COM** (green star icon) **Express**\n\nFooter text reads:\n* **ADLINK | Leading Edge AI Computing**\n* **Confidential**\n* **63**](.introduction-com-express-q1-2026-2026-02-02/slide-062.jpg) ## Slide 63 ![The slide features a large red rectangle with a white geometric pattern of triangles in the center. At the bottom of this red section, there is contact information and branding:\n\n**Bottom Left:**\nADLINK Technology,\nInc\nNo. 66, Huaya 1st Rd., Guishan Dist.,\nTaoyuan City 333411, Taiwan\nTel: +886-3-216-5088\nFax: +886-3-328-5706\n\n**Bottom Right:**\nwww.adlinktech.com (accompanied by icons for Twitter, Facebook, YouTube, and LinkedIn)\n\n**Below the red rectangle (bottom left corner):**\nADLINK | Leading Edge AI\nComputing](.introduction-com-express-q1-2026-2026-02-02/slide-063.jpg) [🔗 Link to the original document](.introduction-com-express-q1-2026-2026-02-02/introduction-com-express-q1-2026-2026-02-02.pptx)