## Slide 1

![This slide is a presentation title page with the following text and visual elements:\n\n**Top Right Corner:**\n*   ADLINK\n*   LEADING EDGE AI COMPUTING\n\n**Left Side (Red Background):**\n*   SMARC /Q7 / OSM\n*   Roadmap\n*   2026 Q1\n\n**Bottom Left (Grey Background Strip):**\n*   Henri Parmentier 16 Jan. 2026\n\n**Bottom Left Corner (White Background):**\n*   ADLINK | Leading Edge AI Computing\n\n**Visual Background:**\nThe right side of the slide features a background image of a circuit board with glowing blue and orange traces.](.q1-26-smarc-q7-osm-3-2026-01-28/slide-001.jpg)

## Slide 2

![The slide is titled "**ADLINK’s Computer on Modules: Full spectrum coverage**". It features a chart with "**Performance**" on the vertical Y-axis and "**Power**" on the horizontal X-axis.\n\nThe X-axis categorizes modules by Thermal Design Power (TDP) in the following ranges:\n*   **TDP <15W**\n*   **TDP <30W**\n*   **TDP <85W**\n*   **TDP <100W**\n*   **TDP <200W**\n\nVarious module standards and types are plotted across the chart, moving from lower power/performance on the left to higher on the right:\n*   **OPEN STANDARD MODULE™**\n*   **SMARC module**\n*   **Qseven** (stylized logo)\n*   **type 10 Mini**\n*   **COM Express®**\n*   **type 6 Compact**\n*   **type 2/6/7 Basic**\n*   **Mini**\n*   **COM-HPC™**\n*   **Client**\n*   **Server**\n\nImages of the corresponding hardware modules are displayed above their respective labels.\n\nThe footer contains the text "**ADLINK | Leading Edge AI Computing**", "**Confidential**", and the page number "**2**".](.q1-26-smarc-q7-osm-3-2026-01-28/slide-002.jpg)

## Slide 3

![**Title:** Computer on Modules\n\n**Bullet Points:**\n*   Modularized computer with core components integrated into a single module, bring out generic interfaces to carrier\n*   Let customer focus on added value, their custom carrier design and the specific application implementation that brings the value to the product\n*   Offloads BOM maintenance for critical parts\n*   Simplify sourcing process\n\n**Diagram Labels (pointing to components on the circuit board):**\n*   WIFI (split as WIF / I)\n*   DDR (split as DD / R)\n*   CPU (split as CP / U)\n*   USB (split as US / B)\n*   eMMC\n*   LAN (split as LA / N)\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   SMARC module 3](.q1-26-smarc-q7-osm-3-2026-01-28/slide-003.jpg)

## Slide 4

![The slide contains the following text:\n\n**Header/Logo Area**\n*   **Top Right:** SGeT STANDARDIZATION GROUP FOR EMBEDDED TECHNOLOGIES\n*   **Main Title:** SMARC module\n\n**Body Text**\nSMARC® is based on the earlier ULP-COM (Ultra Low Power ) form factor which was introduced by the companies Kontron and ADLINK in February 2012 . During the adaption process in SGeT the technical specifications remained largely the same, but was rebranded to SMARC®. SGeT approved the SMARC® 1.0 specification in December 2012.\n\nThe SMARC® (“Smart Mobility ARCHitecture”) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use arm SOCs and low power x86 SOCs. The Module power envelope is typically under 10W.\n\nSMARC® is increasingly taking over the market of the now considered legacy Qseven formfactor.\n\nModule & Carrier design specifications can be freely downloaded at: https://sget.org/standards/s\nmarc/\n\n**Footer**\n*   ADLINK | Leading Edge AI\n*   Computing\n*   Confidential\n*   4](.q1-26-smarc-q7-osm-3-2026-01-28/slide-004.jpg)

## Slide 5

![**Slide Title:** Current specification status\n**Logo:** SMARC module\n\n**Section 1: Module**\n*   **Module Rev 1.0** (20-12-2012)\n    *   **Major changes:** Initial ULP-COM specification by Kontron and ADLINK renamed to SMARC\n*   **Module Rev 1.1** (29-05-2014)\n    *   **Major changes:** Minor modifications to adapt for Intel Baytrail\n*   **Module Rev 2.0** (02-06-2016)\n    *   **Major changes:** Remove parallel camera/display, add 2nd LVDS + 2nd GbE, 4th PCIe, 2nd DP++, extra USB\n*   **Module Rev 2.1** (23-03-2020)\n    *   **Major changes:** Allow Serdes over PCIe, add CSI 2/3, ad 2x GPIO\n*   **Module Rev 2.2 (active)** (05-08-2024)\n    *   **Major changes:** SMARC Specification V2.2 introduces several maintenance updates\n\n**Section 2: Carrier Design Guide**\n*   **Carrier DG Rev 1.0** (09-07-2013)\n    *   **Major changes:** Initial SMARC Carrier Design Guide for Module 1.0\n*   **Carrier DG Rev 2.0** (23-03-2017)\n    *   **Major changes:** Remove parallel camera/display, add 2nd LVDS + 2nd GbE, 4th PCIe, 2nd DP++, extra USB\n*   **Carrier DG Rev 2.1.1** (01-06-2021)\n    *   **Major changes:** Full USB-C support, SerDes over PCIe examples, SPI / eSPI topology\n*   **Carrier DG Rev 2.2** (25-06-2025)\n    *   **Major changes:** Align with module 2.2 specification, SD Card / GPIO advise, higher Ethernet speed layout suggestions, USB-C updates\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   5](.q1-26-smarc-q7-osm-3-2026-01-28/slide-005.jpg)

## Slide 6

![**Title:** SMARC connector and pinout / functions\n\n**Left Text:**\n*   SMARC is (re) using the widely available 314-pin MXM 3.0 connector.\n*   The connectors can max support PCIe GEN4 speeds\n*   Board to board stacked heights of 2.7mm and 5.0mm\n*   The most common\n*   [Blue Box]: 82 mm X 50 mm\n*   [Logo]: SMARC module\n\n**Connector Diagram (Center/Right):**\n*   [On Connector]: SMARC 2.1 = MXM 3.0\n*   [Green Labels]: GBE1, GBE2\n*   [Grey Label]: PCIe x4\n*   [Pink Label]: SATA\n*   [Yellow Labels]: USB 3.0, USB 2.0, SPI2 eSPI, I2 C, UART, GPIO\n*   [Blue Labels]: eDP1, DSI1, eDP2, LVDS 1, DSI2, LVDS 2, HDM I, DP+ + (appears twice), CSI 1, CSI 2\n*   [Blue Labels (Right)]: CSI 3, CSI 4\n*   [Grey Label]: Flat cable connectors on module\n*   [Yellow Labels]: CA N, SDI O\n*   [Blue Label]: HDA I2S\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   6](.Q1-26_SMARC_Q7_OSM-3-[2026-01-28]/slide_006.jpg)

## Slide 7

![**Header:**\nSMARC module\nIn Production Under Design Under Consideration\n\n**Main Chart (COM x86 Timeline):**\n*   **LEC-EL** (Blue box: Short, 2.1 rev, EXTREME RUGGED stamp)\n    Intel® Atom™, Elkhart Lake SOC, up to 16GB non ECC/ECC DDR4\n*   **LEC-AL** (Blue box: Short, 2.0 rev, EXTREME RUGGED stamp)\n    Intel® Atom™ Apollo Lake SOC, up 8GB non ECC DDR3L\n*   **LEC-BT** (Blue box: Full-size, 1.1 rev, EXTREME RUGGED stamp)\n    Intel® Atom™ Baytrail SOC, up 4GB with ECC DDR3L\n*   **LEC-ALN** (Blue box: Short, 2.2 rev)\n    Intel® Atom™, Alder Lake SOC, up to 16GB non ECC/ECC LPDDR5 DSI/CSI, dual LAN/ TSN\n*   **LEC-ASL** (Blue box: Short, 2.2 rev, EXTREME RUGGED stamp)\n    Intel® Atom™, Amston Lake SOC, up to 16GB non ECC/ECC LPDDR5 DSI/CSI, dual LAN/TSN\n*   **LEC-TWL** (Blue box: Short, 2.2 rev)\n    Intel® Atom™, Twin Lake SOC, up to 16GB non ECC/ECC LPDDR5 DSI/CSI, dual LAN/ TSN\n*   **LEC-HY** (Purple box: 2.2 rev)\n    Hygon Quad SOC, up to 16GB non ECC/ECC LPDDR5 DP/HDMI/eDP, dual LAN/ TSN\n\n**Timeline:**\nIn Production 2023 2024 2025 2026 2027\n\n**Footer:**\nADLINK | Leading Edge AI Computing Confidential 7 intel](.q1-26-smarc-q7-osm-3-2026-01-28/slide-007.jpg)

## Slide 8

![**Slide Header:** SMARC module\n**Legend:** In Production (Blue square), Under Design (Green square), Under Consideration (Purple square)\n\n**Y-Axis Label:** COM arm\n\n**Timeline (X-Axis):** In Production, 2023, 2024, 2025, 2026, 2027\n\n**Product Listings (Left Column - In Production/2023):**\n*   **LEC-RB5N** (Short 2.1 rev) [EXTREME RUGGED] Qualcomm\n    *   Arm Cortex 8x A77 LPDDR5 POP, 4K HDMI , 15 TOPS NPU\n*   **LEC-MTK-I1200** (Short 2.1 rev) [EXTREME RUGGED] MEDIATEK\n    *   ARM Cortex: Quad A78, Quad A55 5 TOPS NPU (Neural Processing Unit)\n*   **LEC-iMX8M Plus** (Short 2.1 rev) [EXTREME RUGGED] NXP\n    *   ARM Quad Cortex A53 + M7 64-bit, DSI, LVDS, HDMI , LPDDR4, NPU\n*   **LEC-iMX8M** (Short 2.0 rev) [EXTREME RUGGED] NXP\n    *   ARM Quad Cortex A53 + M4 64-bit, 4K HDMI, DDR3L\n*   **LEC-iMX8M Mini** (Short 2.1 rev) [EXTREME RUGGED] NXP\n    *   ARM Quad Cortex A53 + M4 64-bit, DSI, LVDS, HDMI , LPDDR4\n*   **LEC-PX30** (Short 2.0 rev) [EXTREME RUGGED] Rackchip\n    *   ARM Cortex Quad A35, 64-bit MIPI DSI, LVDS, DDR3L\n\n**Product Listings (Middle/Right Columns - 2025/2026):**\n*   **LEC-iMX95** (Short 2.2 rev) [EXTREME RUGGED] NXP\n    *   ARM Cortex A55 Hexa core integrated NPU (Neural Processing Unit)\n*   **LEC-MTK-520/720** (Short 2.2 rev) [EXTREME RUGGED] MEDIATEK\n    *   Arm Cortex, dual A78, six A55 up to 16GB LPDDR5, up to 256 GB eMMC DSI/CSI/HDMI/eDP/PCIe\n*   **LEC-iMX937** (Short 2.2 rev) [EXTREME RUGGED] NXP\n    *   ARM Cortex A55 Quad core integrated NPU (Neural Processing Unit)\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n8](.Q1-26_SMARC_Q7_OSM-3-[2026-01-28]/slide_008.jpg)

## Slide 9

![The slide displays a grid of SMARC modules against a white background, along with branding and footer information.\n\n**Top Right:**\n*   Logo: A green cross shape next to the text "SMARC module".\n\n**Main Content (Modules):**\nThe slide features eight blue circuit boards, each labeled with a manufacturer logo and a model name:\n\n1.  **Top Left:** Logo "Qualcomm" above a board. Text below: "LEC-RB5".\n2.  **Top Right:** Logo "MEDIATEK" (orange box) above a board. Text below: "LEC-MTK".\n3.  **Middle Left:** Logo "NXP" above a board. Text below: "LEC-iMX95".\n4.  **Middle Center-Left:** Logo "NXP" above a board. Text below: "LEC-iMX8M" followed by "Plus" on a second line.\n5.  **Middle Center-Right:** Logo "NXP" above a board. Text below: "LEC-iMX8M".\n6.  **Middle Right:** Logo "NXP" above a smaller board. Text below: "LEC-iMX8M" followed by "Mini" on a second line.\n7.  **Bottom Left:** Logo "Rockchip" above a board. Text below: "LEC-PX30".\n8.  **Bottom Center:** Logo "NXP" above a board. Text below: "LEC-iMX6".\n\n**Footer:**\n*   Bottom Left: Text "ADLINK | Leading Edge AI Computing".\n*   Bottom Center: Text "Confidential".\n*   Bottom Right: Text "arm" (blue logo) and the page number "9".](.q1-26-smarc-q7-osm-3-2026-01-28/slide-009.jpg)

## Slide 10

![The slide displays four circuit boards arranged horizontally, labeled from left to right as follows:\n*   LEC-ALN / ASL\n*   LEC-EL\n*   LEC-AL\n*   LEC-BTS\n\nIn the top right corner is the **SMARC module** logo. In the bottom right corner is the **intel** logo.\n\nThe footer contains the following text:\n*   Bottom left: **ADLINK | Leading Edge AI Computing**\n*   Bottom center: **Confidential**\n*   Bottom right: **10**](.q1-26-smarc-q7-osm-3-2026-01-28/slide-010.jpg)

## Slide 11

![**Slide Title:** Product Lifecycle\n\n**Legend:**\n*   Promotion\n*   Maintenance\n*   Last time buy\n*   Last shipment\n\n**Product List (Y-Axis):**\n*   LEC-MTK\n*   LEC-RB5\n*   LEC-iMX8M Mini\n*   LEC-iMX8M Plus\n*   LEC-iMX8M\n*   LEC-PX30\n*   LEC-iMX6R2\n*   LEC-iMX6\n*   LEC-ALS\n*   LEC-ALN\n*   LECL-EL\n*   LEC-AL\n*   LEC-BT\n\n**Timeline (X-Axis):**\n2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 2036 2037\n\n**Revision Labels:**\n*   Rev .1.1\n*   Rev .2.0\n*   Rev .2.1\n*   Rev .2.2\n\n**Footer/Branding:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   11\n*   SMARC module](.q1-26-smarc-q7-osm-3-2026-01-28/slide-011.jpg)

## Slide 12

![The slide displays a white background with the following text and graphics:\n\n**Center:**\n*   A green lightning bolt logo followed by the stylized text "QSEVEN".\n*   Below that, "SGET COM Specification" in grey text.\n*   Below that, "Q7 R2.1" (with "Q7" in grey and "R2.1" in red).\n\n**Footer:**\n*   **Bottom Left:** "ADLINK | Leading Edge AI Computing" ("ADLINK" is in red).\n*   **Bottom Center:** "Confidential"\n*   **Bottom Right:** "12"](.q1-26-smarc-q7-osm-3-2026-01-28/slide-012.jpg)

## Slide 13

![**Title:** Q7 Standard\n\n**Logo:** Q SEVEN\n\n**Bullet Points:**\n- 7 CM in Square\n- Available from many tier 1 players\n- Allows dual sourcing\n- Cross platform x86/arm (mainly x86)\n- Low power, up to 15W\n- Older platform (2008) limited interfaces\n- Limited follow up in terms of new launches\n\n**Graphic Labels (Connector):**\n- MXM 2.0\n- 1x GBe\n- 4x PCIe\n- 2x SATA\n- 3x USB 3.x\n- 8x USB 2.0\n- LPC\n- I2C\n- CAN\n- 1x DP\n- LVDS 2Ch\n- SPI\n- SDIO\n- UART\n- HDA/I2S\n\n**Footer:**\n- ADLINK | Leading Edge AI Computing\n- Confidential\n- 13](.q1-26-smarc-q7-osm-3-2026-01-28/slide-013.jpg)

## Slide 14

![**Header:** Q SEVEN\n**Legend:** In Production, Under Design, Under Consideration\n**Y-axis:** reliability\n**X-axis:** In Production, 2022, 2023 Q1~Q2, 2023 Q3~4, 2024 Q1, 2024 Q2\n\n**In Production (Blue Boxes):**\n*   **Q7 (Rev 1.1)**\n    *   Q7-AL\n    *   Intel® Atom™ Apollo Lake SOC, up 8GB non ECC DDR3L\n    *   EXTREME RUGGED\n*   **Q7 (Rev 1.1)**\n    *   Q7-BT\n    *   Intel® Atom™ Baytrail SOC, up 4GB with ECC DDR3L\n    *   optional eMMC on module\n\n**Under Design (Green Box):**\n*   **Q7 (Rev 2.1)**\n    *   Q7-EL\n    *   Intel® Atom™, Elkhart Lake SOC, up to 16GB non ECC/ECC DDR4\n    *   DSI/CSI, dual 2,5Gb TSE\n    *   EXTREME RUGGED\n\n**Under Consideration (Yellow Box):**\n*   **Q7 (Rev 2.1)**\n    *   Q7-AML\n    *   Intel® Atom™, Amston Lake SOC, up to 16GB non ECC/ECC DDR5\n    *   DSI/CSI, dual LAN/WIFI/TSE\n    *   EXTREME RUGGED\n\n**Footer:** intel, ADLINK | Leading Edge AI Computing, Confidential, 14](.q1-26-smarc-q7-osm-3-2026-01-28/slide-014.jpg)

## Slide 15

![The slide features a stack of four green circuit boards on the left, fanned out with white tabs labeled L, M, S, and O. On the right, the logo and text read "OPEN STANDARD MODULE™". Below that, the description states: "OSM provides an open standard for embedded computer modules that come in different packages for direct PCB soldering without connector."](.q1-26-smarc-q7-osm-3-2026-01-28/slide-015.jpg)

## Slide 16

![**Current specification status**\n\n**Module**\n*   **Module Rev 1.0** (Date: 09-12-2020) | **Major changes:** Initial OSM specification\n*   **Module Rev 1.1** (Date: 03-05-2022) | **Major changes:** Minor modifications, Bootselect, add Ethernet MDIO, PCIe / USB control signals to 1.8V, add display VDD/BL control signals\n*   **Module Rev 1.2 (active)** (Date: 08-11-2024) | **Major changes:** Minor modifications, changes in Required and Optional Feature, Feature Fill Order, Function Tables\n\n**Carrier Design Guide**\n*   **Carrier DG Rev 1.0** (Date: 04-05-2022) | **Major changes:** Initial OSM Carrier Design Guide for Module Rev 1.0\n*   **Carrier DG Rev 1.1** (Date: 07-11-2024) | **Major changes:** Update OSM Carrier Design Guide to match Module Rev 1.1 Changed IO voltage PCIe signals control to 1.8 V\n\n**Footer:** ADLINK | Leading Edge AI Computing | Confidential | 16\n**Logo:** OPEN STANDARD MODULE ™](.q1-26-smarc-q7-osm-3-2026-01-28/slide-016.jpg)

## Slide 17

![**OSM : Open Standard Module™**\n\n*   Just 50% of the board estate compared to SMARC (L-size)\n*   Completely machine processible during soldering, assembly and testing of module + carrier\n*   662 pins, allowing output of all SOC provided I/O\n*   up to 42.5-Watt max input power\n*   Just bring out SOC functions (incl Analog) + memory + SSD only\n*   Zero overhead solution, all what is on the module is needed\n\nOPEN STANDARD MODULE™\n\nADLINK | Leading Edge AI Computing\nConfidential](.q1-26-smarc-q7-osm-3-2026-01-28/slide-017.jpg)

## Slide 18

![**Header**\n*   Logo: "OPEN STANDARD MODULE™" with "OSM rev 1.1" underneath.\n*   Legend:\n    *   Blue square: "In Production"\n    *   Green square: "Under Design"\n    *   Purple square: "Under Consideration"\n*   Top Right: Two images of circuit boards.\n\n**Left Column (Timeline: In Production - 2025 Q1)**\n*   **OSM-IMX8MP** (Blue square "L-size rev 1.1")\n    *   Logos: "EXTREME RUGGED", "NXP"\n    *   "Arm Cortex-A quad core A53"\n    *   "up to 8GB LPDDR4, up to 256 GB eMMC"\n    *   "DSI/CSI/LVDS/eDP 2.3 TOPS"\n*   **OSM-IMX93** (Blue square "L-size rev 1.1")\n    *   Logos: "EXTREME RUGGED", "NXP"\n    *   "Arm Cortex-A dual core A55"\n    *   "up to 2GB LPDDR4, up to 256 GB eMMC,"\n    *   "LVDS / RGB /CSI"\n*   **OSM-MTK510/700** (Green square "L-size rev 1.1")\n    *   Logos: "EXTREME RUGGED", "MEDIATEK"\n    *   "Arm Cortex-A dual core A78 + quad core A55"\n    *   "up to 8GB LPDDR4, up to 256 GB eMMC"\n    *   "DSI/CSI/HDMI/eDP/PCIe"\n\n**Right Column (Timeline: 2025 Q2 - 2025 Q3)**\n*   **OSM-MTK-520/720** (Green square "L-size rev 1.2")\n    *   Logos: "EXTREME RUGGED", "MEDIATEK"\n    *   "Cortex-A, dual core A78 + six core A55"\n    *   "up to 16GB LPDDR5, up to 256 GB eMMC"\n    *   "DSI/CSI/HDMI/eDP/PCIe"\n*   **OSM-IMX95** (Green square "L-size rev 1.2")\n    *   Logos: "EXTREME RUGGED", "NXP"\n    *   "Arm Cortex-A, 6 core A55"\n    *   "up to 8GB LPDDR5, up to 256 GB eMMC"\n    *   "DSI/CSI/LVDS/eDP/ 2x Gbe, 1x 10Gbe"\n*   **OSM-IMX94** (Purple square "L-size rev 1.2")\n    *   Logos: "EXTREME RUGGED", "NXP"\n    *   "Arm Cortex-A, 6 core A55"\n    *   "up to 8GB LPDDR5, up to 256 GB eMMC"\n    *   "DSI / CSI / LVDS / eDP / LAN"\n*   **OSM-IMX91** (Purple square "L-size rev 1.2")\n    *   Logos: "EXTREME RUGGED", "NXP"\n    *   "Arm Cortex-A single core A55"\n    *   "up to 2GB LPDDR4, up to 256 GB eMMC,"\n    *   "RGB Display /RGB Camera"\n\n**Footer/Timeline Axis**\n*   "In Production", "2025 Q1", "2025 Q2", "2025 Q3", "2025 Q4", "2026 Q1"\n*   "ADLINK | Leading Edge AI Computing"\n*   "Confidential"\n*   "18"](.q1-26-smarc-q7-osm-3-2026-01-28/slide-018.jpg)

## Slide 19

![The slide displays a presentation title card with a large red background.\n\n**Top Section:**\nThe text "Product Slides" appears in large white font at the top left. Below this is a wide, repeating geometric pattern of white triangles.\n\n**Bottom Section (Inside Red Box):**\n*   **Left:** "ADLINK Technology, Inc." followed by the address: "No. 66, Huaya 1st Rd., Guishan Dist., Taoyuan City 333411, Taiwan".\n*   **Center-Left:** "Tel: +886-3-216-5088" and "Fax: +886-3-328-5706".\n*   **Right:** Four social media icons (Twitter, Facebook, YouTube, LinkedIn) followed by the URL "www.adlinktech.com".\n\n**Footer (Outside Red Box):**\nIn the white area below the red block, the text reads: "ADLINK | Leading Edge AI Computing".](.q1-26-smarc-q7-osm-3-2026-01-28/slide-019.jpg)

## Slide 20

![**Specifications**\n**LEC-RB5**\n\n**Processor:** Qualcomm® QRB5165\n*   Kryo™ 585 Octa-core CPU: 1 Kryo Gold Prime @ 2.84 GHZ + 3 Kryo Gold @ 2.42 GHz + 4 Kryo Silver @ 1.81 GHz\n\n**Memory**\n*   4 or 8 GB POP LPDDR5\n\n**Graphic and Video**\n*   Adreno™ GPU 650, Fmax at 587 MHz – 4K 60 fps or 2X 2K 60 fps\n*   1x HDMI 2.0b 4K@60 Hz, 1x DSI 4 Lane DSI max. 1K p60 with 24-bit RGB\n\n**Storage**\n*   1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0\n*   UFS 32, 64, 128 or 256 GB (build option)\n\n**Audio and Camera**\n*   I2S or SWD audio codec located on carrier,\n*   CSI0 2L, CSI1 4L additional CSI2/3/4/5 on feature connector (6 cameras)\n\n**PCI Express**\n*   1x PCIex1 Gen3 (2x Gen2 if switch used),\n\n**Peripherals**\n*   Dual GbE Ethernet controller (one with TSN), Optional WIFI/BT\n*   1x USB 3.1/ 4x USB 3.0 and 4x USB 2.0 / (OTG support on USB0),\n*   14x GPIO, 2x SPI, 3x I²C, 4x UART, 1x CAN, optional TPM\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Right Side Graphics & Logos:**\n*   **Production** (Blue button)\n*   **Qualcomm**\n*   **Standard Supported**\n    *   **yocto . PROJECT**\n    *   **Ubuntu**\n    *   **Project based**\n    *   **android**\n*   **SMARC module Revision 2.1**\n*   **Qualcomm Snapdragon**\n*   **6x MIPI CSI** (Below camera icons)\n*   **DSI** (Below grey box)\n*   **Ultra HD 4K HDMI**\n*   **PCI EXPRESS**\n*   **Wi-Fi**\n*   **Bluetooth**\n*   **CAN FD**\n*   **SD**\n*   **UFS 3.1**\n*   **USB**\n*   **EXTREME RUGGED**\n\n**Footer:**\n*   **ADLINK | Leading Edge AI Computing**\n*   **Confidential**\n*   **20**](.q1-26-smarc-q7-osm-3-2026-01-28/slide-020.jpg)

## Slide 21

![**Function Diagram**\n**LEC-RB5**\n**Production**\n\n**Central Component:**\n**Qualcomm**\n**QRB5165**\n\n**Top/Right Peripherals:**\n**QCA AC/BT5**\n**4 MIPI CSI (4 lanes) on module**\n**4/8 GB POP LPDDR5**\n**2x PCIe 2 lane GEN3**\n**TPM Data Security**\n**Soundwire or i2s Audio**\n**14x GPIO**\n**2x I2C**\n**2x SPI**\n**2x UART**\n**Crypto Authentication**\n\n**Left Peripherals:**\n**HDMI 2.1a**\n**MIPI DSI 4L**\n**Optional 2nd LAN use USB 3.1**\n**1000 Mbps LAN + 4 x USB 3.0**\n**LAN + USB HUB**\n**USB3.1**\n**USB 3.1 Host OTG**\n**USB2.0**\n**UFS (build option) (64 ~256 GB)**\n**Gear3 UFS**\n**SDIO 3.0**\n\n**Bottom Peripherals:**\n**Lite BMC**\n**2x MIPI CSI 2L/4L**\n**CAN + FD on SPI**\n**CAN**\n\n**Footer:**\n**ADLINK | Leading Edge AI Computing**\n**Confidential**\n**21**\n**SMARC module Revision 2.1**](.q1-26-smarc-q7-osm-3-2026-01-28/slide-021.jpg)

## Slide 22

![**Specifications**\n**LEC-MTK**\n**Production**\n\n**Processor:** MediaTek Genio 1200\n*   4x Arm Cortex-A78 (64KB L1 per core) + 4x Cortex-A55 (32KB L1 per core)\n*   Integrated MediaTek AI Processor (dual core)\n\n**Memory**\n*   4 or 8 GB soldered LPDDR4 x16\n\n**Graphic and Video**\n*   Mali G57 MC5 3D GPU, h.265/4 and VP9/8 decode, and 1080p60 h.264 encode\n*   HDMI 2.0 / single/dual channel LVDS or MIPI-DSI (4-lane) at 4KHz\n\n**Storage**\n*   1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0\n*   UFS 32, 64,128 or 256 GB (build option)\n\n**Audio and Camera**\n*   I2S audio codec located on carrier,\n*   3x MIPI CSI 4 lane (3 cameras)\n\n**PCI Express**\n*   1x PCIex1 Gen3 (2x Gen2 if switch used),\n\n**Peripherals**\n*   Dual GbE Ethernet controller (one with TSN), Optional WIFI/BT\n*   2x USB 3.0, 2x USB 2.0 and 1x USB 2.0 OTG\n*   14x GPIO, 2x SPI, 3x I²C, 4x UART, 1x CAN, optional TPM\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Supported OS/Platforms (Logos):**\n*   Standard Supported yocto PROJECT\n*   Ubuntu\n*   FOUNDRIES.IO\n*   android\n\n**Hardware/Branding:**\n*   MEDIATEK\n*   SMARC module Revision 2.1\n\n**Icons/Graphics:**\n*   MediaTek Genio 1200\n*   Ultra HD 4K HDMI\n*   PCI EXPRESS\n*   Wi-Fi Bluetooth\n*   CAN FD\n*   Ethernet\n*   3x MIPI CSI\n*   DSI\n*   SD\n*   UFS 3.1\n*   SUPER SPEED USB\n*   EXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n22](.q1-26-smarc-q7-osm-3-2026-01-28/slide-022.jpg)

## Slide 23

![This slide presents a "Function Diagram" for "LEC-MTK" featuring a central black chip labeled "MediaTek Genio 1200".\n\n**Peripherals and Connections:**\n\n*   **Top Left:** HDMI 2.1a, MIPI DSI 4L.\n*   **Left Side:** 2nd LAN (connected via "USB to LAN"), 2 x USB 3.0, LAN + USB HUB (connected via USB3.1), and 2 x USB 2.0 OTG (connected via USB2.0).\n*   **Top Center:** Bluetooth and WiFi icons surrounding "QCA AC/BT5".\n*   **Top Right:** Camera icon and "1 MIPI CSI (4lanes) on module".\n*   **Right Side:** 4/8/16 GB LPDDR4, PCIe0 Gen3 x2, PCIe1 Gen3 x1, TPM Data Security, and PHY.\n*   **Bottom Right:** Soundwire or i2s Audio, 14x GPIO, 2x I2C, 2x SPI, 2x UART, and Crypto Authentication.\n*   **Bottom Center:** Lite BMC, 2x MIPI CSI 2L/4L, CAN, and CAN + FD on SPI.\n*   **Bottom Left:** SDIO 3.0 and UFS (build option) (64 ~256 GB) with a "UFS" box.\n\n**Footer and Header:**\n*   Top Right: "Production"\n*   Bottom Left: "ADLINK | Leading Edge AI Computing"\n*   Bottom Center: "Confidential"\n*   Bottom Right: SMARC logo, "SMARC module Revision 2.1", and page number "23".](.q1-26-smarc-q7-osm-3-2026-01-28/slide-023.jpg)

## Slide 24

![**Specifications**\nLEC-iMX95\n\n**Top Right Corner:**\nDeveloping\nSamples available\nMP target April 2025\n\n**Main Text Body:**\n**Processor:** NXP® i.MX95\n*   Up to 6x 2.0GHz Arm Cortex-A55\n    + 800MHz Arm Cortex-M7 + 250MHz Arm Cortex-M33\n*   OPTIONAL NPU (incorporated on SoC)\n**Memory**\n*   Up to 16 GB soldered LPDDR5 x32\n**Graphic and Video**\n*   Mali G310 GPU 4Kp30\n*   H.265 and H.264 encode and decode\n*   HDMI 2.0 / single/dual channel LVDS or MIPI-DSI (4-lane) at 1920x1080\n**Storage**\n*   1x SDIO to carrier, Onboard from 32GB up to 128GB eMMC 5.0 (build option)\n**Audio and Camera**\n*   I²S audio codec on carrier, 2x MIPI CSI cameras (4 lanes)\n**PCI Express**\n*   2x PCIex1 Gen3\n**Peripherals**\n*   Dual GbE Ethernet controller (one with TSN), Optional WIFI/BT\n*   2x USB 3.0, 4x USB 2.0, 1x USB2.0 OTG, 12x GPIO, 2x SPI, 3x I²C,\n    4x UART, 2x CAN + FD (native) optional hardware TPM\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Logos and Graphics (Right Side):**\nStandard Supported yocto PROJECT\nFOUNDRIES.IO\nandroid\nNXP\nSMARC module Revision 2.2\n\n**Logos and Icons (Bottom Right):**\nNXP i.MX 95\nUltra HD 4K HDMI\nPCI EXPRESS\nWi-Fi Bluetooth\nCAN FD\nEthernet (icon)\nCamera (icon)\nLVDS\nSD\neMMC\nUSB SuperSpeed\nMIPI CSI / DSI\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n24](.q1-26-smarc-q7-osm-3-2026-01-28/slide-024.jpg)

## Slide 25

![**Title:** Function Diagram LEC-iMX95\n\n**Top Right Status:** Developing (Green Box)\nSamples available\nMP target April 2025\n\n**Central Component:**\nA large black chip labeled "NXP i.MX95".\n\n**Top Connections (Wireless):**\nBluetooth Icon\nMarvel AC/BT5\nWifi Icon\n\n**Left Side Connections (Display & USB):**\n4K (Inside Monitor Icon)\nHDMI 2.0a\nMIPI DSI (Next to Screen Icon)\nLVDS 18/24-bit\nsingle / dual\nUSB 2.0 with OTG\n2x USB 3.0/2.0\n2x USB 2.0\nUSB 3.0 HUB (Gray Box)\nUSB 3.0/2.0\nUSB2.0\nDSI to HDMI (Gray Box)\n\n**Bottom Connections:**\neMMC 5.0 (build option)\n(8/16/32/64 GB)\neMMC 5.0 (Gray Box)\nSDIO 3.0 (Next to SD Card Icon)\nPMIC (Orange Box)\n1x MIPI CSI (4L / 2L)\n\n**Right Side Connections (Memory, PCIe, Network, IO):**\nTPM\nData Security\nLPDDR5 up to 16GB\n2x Gen 3 PCIe x1\nLAN (Gray Box)\nIntegrated GbE with IEEE-1588\nLAN (Gray Box)\nIntegrated GbE with IEEE-1588\nI2S Audio\n12x GPIO\n4x I2C\n2x SPI\n4x UART\nCAN +FD\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\nSMARC module Revision 2.1\n25](.q1-26-smarc-q7-osm-3-2026-01-28/slide-025.jpg)

## Slide 26

![**Header**\n*   Specifications\n*   LEC-iMX8M Plus\n*   Production\n\n**Left Column (Specifications)**\n*   **Processor:** NXP® i.MX8M Plus\n    *   64-bit Quad/Dual Core Cortex A53 1.8Ghz + M7 800Mhz\n    *   Optional 2.3 TOPS NPU (incorporated on SoC)\n*   **Memory**\n    *   Up to 8 GB soldered LPDDR4 x32\n*   **Graphic and Video**\n    *   GC7000 UL 3D GPU, GC520 2D GPU,1080p60 h.265/4 and VP9/8 decode,\n    *   and 1080p60 h.265/4 encode\n    *   HDMI 2.0 / single/dual channel LVDS or MIPI-DSI (4-lane) at 1920x1080\n*   **Storage**\n    *   1x SDIO to carrier, Onboard from 16GB up to 128 GB eMMC 5.0 (build option)\n*   **Audio and Camera**\n    *   I²S audio codec on carrier, 2x MIPI CSI cameras (4 lanes)\n*   **PCI Express**\n    *   1x PCIex1 Gen3 (2x Gen2 if switch used),\n*   **Peripherals**\n    *   Dual GbE Ethernet controller (one with TSN), Optional WIFI/BT\n    *   2x USB 3.0, 4x USB 2.0, 1x USB2.0 OTG, 12x GPIO, 2x SPI, 3x I²C,\n    *   3x UART, 2x CAN + FD (native) optional hardware TPM\n*   **Operation Temperature**\n    *   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n*   **Power**\n    *   4.75 V ~ 5.25 V input\n\n**Right Column (Software & Hardware Logos)**\n*   Standard Supported\n*   yocto PROJECT\n*   FOUNDRIES.IO\n*   android\n*   Windows 10 IoT Enterprise\n*   NXP\n*   SMARC module Revision 2.1\n*   NXP i.MX 8M Plus\n*   Full HD 1080p HDMI\n*   PCI EXPRESS\n*   WiFi Bluetooth\n*   CAN FD\n*   Ethernet\n*   MIPI CSI / DSI\n*   LVDS\n*   SD\n*   eMMC\n*   SUPER SPEED USB\n*   EXTREME RUGGED\n\n**Footer**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   26](.q1-26-smarc-q7-osm-3-2026-01-28/slide-026.jpg)

## Slide 27

![**Header:**\nFunction Diagram\nLEC-iMX8M Plus\nProduction\n\n**Center Chip:**\nNXP\ni.MX8MP\n\n**Top Center:**\nMarvel AC/BT5\n\n**Left Side:**\nFull HD\nHDMI 1.4\nMIPI DSI 4 lanes\nLVDS 18/24-bit single/dual\nUSB 2.0 with OTG\nUSB 2.0 x4\nUSB 3.0 x2\nUSB2. 0\neMMC 5.0 (build option) 32/64/128 GB)\nSDIO 3.0\n\n**Right Side:**\nTPM Data Security\n1GB, 2GB, 4 GB or 8GB soldered LPDDR4\n2x PCIe Gen 2 x1 with switch\n1x PCIe Gen 3 x1 without\nch\nLAN PHY\nIntegrated GbE with TSN\nLAN PHY\nIntegrated GbE\nI2S Audio\n\n**Bottom Right:**\n12x GPIO\n4x I2C\n2x SPI\n3x UART\n2x CAN\n\n**Bottom Center:**\nPMIC\nMIPI CSI (2L)\nMIPI CSI (4L)\n\n**Bottom Left:**\neMMC 5.0 (build option) 32/64/128 GB)\n\n**Bottom Right Corner:**\nSMARC module\nRevision 2.1\n\n**Bottom Left Corner:**\nADLINK | Leading Edge AI\nComputing\n\n**Bottom Center:**\nConfidential\n\n**Bottom Right:**\n27](.q1-26-smarc-q7-osm-3-2026-01-28/slide-027.jpg)

## Slide 28

![**Header:**\nNOT RECOMMENDED FOR NEW\nProduction\n\n**Title:**\nSpecifications\nLEC-iMX8M\n\n**Main Content (Left Column):**\n**Processor:** NXP® i.MX8M Series\n*   i.MX8M Quad: 4 x Cortex-A53 at 1.3 - 1.5GHz, 1 x Cortex-M4, GPU, VPU Decode\n*   i.MX8M QuadLite: 4 x Cortex-A53 at 1.3 - 1.5GHz, 1 x Cortex-M4, GPU\n*   i.MX8M Dual: 2 x Cortex-A53 at 1.3 - 1.5GHz, 1 x Cortex-M4, GPU, VPU Decode\n\n**Memory**\n*   Up to 4 GB soldered DDR3L\n\n**Graphic and Video**\n*   Vivante GC7000Lite 2D/3D : 4K H.265 decode & 1080p h.264 enc / dec capable VPU\n*   1x HDMI 2.0a , single/dual channel LVDS optional 1x MIPI-DSI (4-lane)\n\n**Storage**\n*   1x SDIO to carrier, Onboard from 8GB up to 64 GB eMMC 5.0 (build option)\n\n**Audio and Camera**\n*   I²S audio codec on carrier, 2x MIPI CSI cameras (1x 4 and 1 x2 lanes lanes)\n\n**PCI Express**\n*   2x PCIex1 Gen2\n\n**Peripherals**\n*   2x USB 3.0, 2x USB2.0 , 1x USB2.0 OTG\n*   12x GPIO, 2x SPI, 3x I²C, 4x UART, 1x CAN + FD (SPI to CAN controller)\n*   4x UART, 2x CAN + FD (native) optional hardware TPM\n*   Cryptographic co-processor for end-to-end IOT security\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Visuals (Right Side):**\n*   [Image of a circuit board]\n*   NXP Logo\n*   Standard Supported yocto PROJECT\n*   android Logo\n*   SMARC module Revision 2.0\n*   [Row of logos at bottom]: NXP i.MX 8M, Ultra HD 4K HDMI, PCI EXPRESS, CAN FD, Ethernet icons, MIPI CSI / DSI, LVDS, SD, eMMC, SUPER SPEED USB, EXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n28](.Q1-26_SMARC_Q7_OSM-3-[2026-01-28]/slide_028.jpg)

## Slide 29

![**Header:**\nNOT RECOMMENDED FOR NEW\nFunction Diagram\nLEC-iMX8M\nProduction\n\n**Left Side Connections:**\n4K\nHDMI 2.0a\nMIPI DSI\nLVDS 18/24-bit single / dual\nUSB 2.0 with OTG\n2x USB 3.0/2.0\n2x USB 2.0\neMMC 5.0 (build option) (8/16/32/64 GB)\nSDIO 3.0\nDSI to LVDS\nUSB 3.0 HUB\n\n**Center Chip:**\nNXP\ni.MX 8M\nUSB2.0\n\n**Right Side Connections:**\n1GB, 2GB or 4GB soldered DDR3L\n2x PCIe x1\nLAN\nLAN\nOptional i210 GbE with IEEE-1588 Integrated GbE with IEEE-1588\n\n**Bottom/Peripheral Connections:**\neMMC 5.0\nBMC Light\nIOT Crypto\n2x MIPI CSI (4L / 2L)\n12x GPIO 6x I2C 2x SPI 3x UART CAN +FD\nI2S Audio\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\nSMARC module Revision 2.0\n29](.q1-26-smarc-q7-osm-3-2026-01-28/slide-029.jpg)

## Slide 30

![**Header:**\nSpecifications\nLEC-iMX8M Mini\nProduction\n\n**Main Text List:**\n**Processor:** NXP® i.MX8M Mini\n*   Single skew 64-bit Quad/Dual Core Cortex A53 up to 1.8Ghz + M4\n**Memory**\n*   Up to 4 GB soldered LPDDR4 x32\n**Graphic and Video**\n*   GC Nano Ultra3D GPU, GC520 2D GPU,1080p60 h.265/4 and VP9/8 decode,\n*   and 1080p60 h.265/4 encode\n*   single/dual channel LVDS (option) or MIPI-DSI (4-lane) at 1920x1080\n**Storage**\n*   1x SDIO to carrier, Onboard from 16GB up to 128 GB eMMC 5.0 (build option)\n**Audio and Camera**\n*   I²S audio codec on carrier, 1x MIPI CSI cameras (4 lanes)\n**PCI Express**\n*   1x PCIex1 Gen2\n**Peripherals**\n*   GbE Ethernet controller (2nd optional lose PCIe), Optional WIFI/BT\n*   2x USB 3.0, 4x USB 2.0, 1x USB2.0 OTG, 12x GPIO, 2x SPI, 3x I²C,\n*   3x UART, 2x CAN + FD (native) optional hardware TPM\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Logos and Graphics:**\n*   NXP (Logo)\n*   Standard Supported\n*   yocto PROJECT\n*   FOUNDRIES.IO\n*   android (Logo)\n*   SMARC module Revision 2.1 (Logo)\n*   NXP i.MX 8M MINI (Logo)\n*   PCI EXPRESS (Logo)\n*   Wi Fi Bluetooth (Logo)\n*   CAN FD (Logo)\n*   Ethernet (Icons)\n*   MIPI CSI / DSI\n*   LVD S (Logo)\n*   SD (Logo)\n*   eMMC (Logo)\n*   SUPER SPEED USB (Logo)\n*   EXTREME RUGGED (Stamp)\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n30](.q1-26-smarc-q7-osm-3-2026-01-28/slide-030.jpg)

## Slide 31

![**Header:** Function Diagram LEC-iMX8M Mini (Production badge)\n\n**Center:** A large chip labeled **NXP i.MX8M Mini**.\n\n**Surrounding Connections (Clockwise):**\n*   **Top:** Bluetooth icon, **Marvel AC/BT5**, WiFi icon.\n*   **Right:** **TPM Data Security**, **1GB, 2GB or 4 GB soldered LPDDR4**, **1x PCIe x1**, **Optional GbE**, **Integrated GbE** (with LAN/LAN PHY boxes).\n*   **Bottom Right:** **I2S Audio**, **12x GPIO**, **4x I2C**, **2x SPI**, **3x UART**, **2x CAN**.\n*   **Bottom Center:** **MIPI CSI (4L)**, Orange box labeled **PMIC**.\n*   **Bottom Left:** **SDIO 3.0**, **eMMC 5.0 (build option) 32/64/128 GB)**.\n*   **Left:** **USB 2.0 x4**, **USB 2.0 with OTG** (connected to a USB box), **LVDS 18/24-bit single / dual**, **MIPI DSI 4 lanes**, **USB2.0**.\n\n**Footer:** ADLINK | Leading Edge AI Computing | Confidential | 31 | SMARC module Revision 2.1](.q1-26-smarc-q7-osm-3-2026-01-28/slide-031.jpg)

## Slide 32

![**Header:** NOT RECOMMENDED FOR NEW | Production\n\n**Title:** Specifications LEC-PX30\n\n**Body Text:**\n*   **Processor:** Rockchip™ PX30\n    *   Single skew 64-bit Quad/Dual Core Cortex A53 up to 1.8Ghz + M4\n*   **Memory**\n    *   Up to 4 GB soldered LPDDR4 x32\n*   **Graphic and Video**\n    *   Mali-G31\n    *   1080p 60 h.264/h.265 decode, 1080p30 h.264 encode\n    *   MIPI DSI 4 lanes (1080p@60fps) or LVDS 24-bit (1280x800@60fps)\n*   **Storage**\n    *   1x SDIO to carrier, onboard from 8GB up to 64 GB eMMC 5.0 (build option)\n*   **Audio and Camera**\n    *   I²S audio codec on carrier, 1x MIPI CSI cameras (4 lanes)\n*   **Peripherals**\n    *   2x 100 Mbps Ethernet controller (2nd through USB)\n    *   4x USB 2.0 host (hub), 1x USB2.0 OTG\n    *   12x GPIO, 2x SPI, I²C, 2x UART, 1x CAN FD\n*   **Operation Temperature**\n    *   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n*   **Power**\n    *   4.75 V ~ 5.25 V input\n\n**Right Side Graphics & Logos:**\n*   Rockchip logo\n*   Standard Supported\n*   yocto PROJECT logo\n*   android logo\n*   SMARC module Revision 2.0 logo\n*   PX30 box logo\n*   LVDS\n*   MIPI CSI / DSI\n*   CAN FD\n*   SD\n*   eMMC\n*   SUPER SPEED USB 3.0\n*   EXTREME RUGGED\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   32](.q1-26-smarc-q7-osm-3-2026-01-28/slide-032.jpg)

## Slide 33

![The slide presents a "Function Diagram" for the "LEC-PX30". At the very top, a banner reads "NOT RECOMMENDED FOR NEW" and a blue button in the top right says "Production".\n\nThe central image is a blue chip labeled "PX30" with the logo "Rockchip" underneath. Lines connect this chip to various peripherals and specifications listed around it:\n\n**Left Side:**\n*   "MIPI DSI 4 lanes or LVDS 24-bit" (connected to display icons)\n*   "USB 2.0 with OTG"\n*   "USB 2.0 x4"\n*   A grey box labeled "LAN + USB HUB" connected to port icons.\n*   "LAN 10/100 MPS" (next to a network card image).\n*   "eMMC 5.0 (build option) (8/16/32/64 GB)"\n*   A grey box labeled "eMMC 5.0"\n*   "SDIO 3.0" (next to a memory card icon).\n\n**Bottom/Center:**\n*   A grey box labeled "BMC Light"\n*   "IOT Crypto" (next to a lock icon).\n*   "MIPI CSI (4L)" (next to a camera lens icon).\n*   A list of interfaces: "12x GPIO 6x I2C 2x SPI 3x UART 1x CAN + FD".\n*   "I2S Audio" (next to speaker/microphone icons).\n\n**Right Side:**\n*   Four black chips labeled "1GB, 2GB or 4GB soldered DDR3L".\n*   A grey box labeled "LAN PHY" connected to a network card icon labeled "LAN 10/100 MPS".\n\n**Footer:**\n*   Bottom left: "ADLINK | Leading Edge AI Computing"\n*   Bottom center: "Confidential"\n*   Bottom right: Page number "33" and a logo for "SMARC module Revision 2.0".](.q1-26-smarc-q7-osm-3-2026-01-28/slide-033.jpg)

## Slide 34

![**Header:**\nNOT RECOMMENDED FOR NEW\n\n**Title Section:**\nSpecifications\nLEC-iMX6 R2\n\n**Specifications List:**\n**Processor:** NXP® i.MX6 Series\n*   i.MX6 Quad Plus or Quad (industrial), 4 A9 cores, 1 GHz / 800MHz, 1 MB L2 cache\n*   i.MX6 Dual Plus or Dual (industrial) , 2 A9 cores, 1 GHz / 800MHz, 1 MB L2 cache\n*   i.MX6 Dual Lite (industrial), 2 A9 cores, 800 MHz, 1 MB / 512KB L2 cache\n*   i.MX6 Solo (industrial), 1 core, 800 MHz, 512 kB L2 cache\n\n**Memory**\n*   512MB, 1GB or 2GB GB soldered DDR3L\n\n**Graphic and Video**\n*   1080p 60 h.264 decode, 1080p30 H.264 BP/ Dual 720p encode\n*   1x HDMI (1080p) , single/dual channel LVDS (1080p), optional MIPI-DSI (1366 x 768)\n\n**Storage**\n*   1x SDIO to carrier, Onboard from 8GB up to 64 GB eMMC 5.0 (build option)\n\n**Audio and Camera**\n*   I²S audio codec on carrier, 1x MIPI CSI cameras (4 lanes)\n\n**PCI Express**\n*   1x PCIex1 Gen2\n\n**Peripherals**\n*   Ethernet controller 1x GbE and secondary 10/100 Mbps trough USB hub\n*   4x USB 2.0 host (hub), 1x USB2.0 OTG, 12x GPIO, 2x SPI, I²C, 4x UART, 2x CAN\n*   Cryptographic co-processor for end-to-end IOT security\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Right Side Graphics & Logos:**\n*   Production\n*   Standard Supported\n*   yocto PROJECT\n*   android\n*   NXP\n*   SMARC module Revision 2.0\n*   i.MX 6 Series\n*   Full HD 1080p HDMI\n*   PCI EXPRESS\n*   CAN FD\n*   MIPI CSI / DSI\n*   LVDS\n*   SD\n*   eMMC\n*   USB SUPER SPEED\n*   EXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n34](.q1-26-smarc-q7-osm-3-2026-01-28/slide-034.jpg)

## Slide 35

![Here is the verbatim content of the slide:\n\n**Header:**\nNOT RECOMMENDED FOR NEW\nFunction Diagram\nLEC-iMX6 R2\nProduction\n\n**Center Chip:**\nNXP\ni.MX6\n\n**Left Side Connections:**\nFull HD\nHDMI 1.4\nMIPI DSI 2 lanes\nLVDS 18/24-bit\nsingle / dual\nUSB 2.0 with OTG\nUSB 2.0 x4\nLAN + USB HUB\nLAN 10/100 MPS\neMMC 5.0 (build option) (8/16/32/64 GB)\neMMC 5.0\n\n**Bottom/Center Connections:**\nUSB2.0\nSDIO 3.0\nBMC Light\nIOT Crypto\nMIPI CSI (4L)\n\n**Right Side Connections:**\n512MB, 1GB or 2 GB soldered DDR3L\n1x PCIe x1\nLAN PHY\nIntegrated GbE\nI2S Audio\n12x GPIO\n6x I2C\n2x SPI\n3x UART\n2x CAN\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\nSMARC module Revision 2.0\n35](.q1-26-smarc-q7-osm-3-2026-01-28/slide-035.jpg)

## Slide 36

![The slide displays the "SMARC module" logo in the upper right corner. Below, four computer modules are arranged horizontally. From left to right, they are labeled:\n*   **LEC-ALN / ASL** (blue circuit board)\n*   **LEC-EL** (blue circuit board)\n*   **LEC-AL** (green circuit board)\n*   **LEC-BTS** (green circuit board)\n\nTo the right of the fourth module is the "intel" logo.\n\nFooter text includes "ADLINK | Leading Edge AI Computing" on the left, "Confidential" in the center, and the page number "36" on the right.](.q1-26-smarc-q7-osm-3-2026-01-28/slide-036.jpg)

## Slide 37

![**Specifications**\n**LEC-ALN/ASL**\n\n**Production** (Blue button top right)\n\n**Processor :** Intel® Atom® processors x7000E Series,\n*   Atom® x7835RE 1.3(3.6)GHz 12W (8C) IBECC/non-ECC\n*   Atom® x7433RE 1.5(3.4)GHz 9W (4C) IBECC/non-ECC\n*   Atom® x7213RE 2.0(3.4)GHz 9W (2C) IBECC/non-ECC\n*   Atom® x7211RE 1.0(3.2)GHz 6W (2C) IBECC/non-ECC\n*   Intel® Core™ i3 processor, Intel® Processors N Series targeted for IoT by project\n\n**Memory**\n*   4/8/16GB LPDDR5, non-ECC/IBECC at max. 4800MT/s\n\n**Graphic and Video**\n*   HEVC VP9, OpenGL ES 3.1/3.0/2.0/1.1, OpenCL™, 1.2, Microsoft* DirectX 12\n*   4Kp30 (10b, 444), 4Kp60 (10b/8b 420) - Decode , 4Kp60(10b/8b 420) – Encode\n*   DP 1.4: 8kx4k@60, HDMI 2.0a/DP 1.4: 4kx2k@60, MIPI DSI 1.2 or eDP 1.4\n\n**Storage**\n*   1x SDIO to carrier, onboard eMMC 5.0 (build option)\n*   1x SATA GEN3 at 6Gb/s\n\n**Audio**\n*   1x HDA for audio codec on carrier\n\n**PCI Express**\n*   4x PCIex1 Gen3\n\n**Peripherals**\n*   Ethernet controller , 2x 2.5 GbE both supporting TSN\n*   2x USB 3.1/2.0, 3x USB2.0 , 1x USB2.0 OTG\n*   14x GPIO, 1x eSPI 2CS, Smbus/I²C, 4x UART, 2x CAN + FD\n*   Optional TPM\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Middle Column (Software/OS):**\n*   **Standard**\n    *   Windows 10\n    *   Windows 11\n    *   yocto PROJECT\n    *   FOUNTRIES.IO\n*   **Project Based**\n    *   VxWorks\n\n**Right Side:**\n*   intel logo\n*   (Image of circuit board)\n*   SMARC module Revision 2.2\n\n**Bottom Row of Logos:**\n*   intel ATOM\n*   Ultra HD 4K\n*   HDMI HIGH DEFINITION MULTI MEDIA INTERFACE\n*   D DisplayPort\n*   PCI EXPRESS\n*   SERIAL ATA\n*   CAN FD\n*   (Ethernet icons)\n*   LVD S\n*   SD\n*   eMM C\n*   SUPER SPEED USB\n*   EXTREME RUGGED\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   37](.q1-26-smarc-q7-osm-3-2026-01-28/slide-037.jpg)

## Slide 38

![Function Diagram\nLEC-ALN/ASL\nProduction\nHDMI/DP++\n4K\nDP++\n4K\neDP 1.4\nLVDS 18/24-bit single / dual\neDP to LVDS\nCAN 0/1\nUSB 2.0 with OTG\n2x USB 3.1/2.0\n3x USB 2.0\n1x SATA at\n6Gb/s\neMMC\n5.0\neMMC\n8 to 64GB\nSDIO\nto carrier\nSEMA\nEC\nBIOS\n2x MIPI\nCSI (4L /\n2L)\nMax. 16GB LPDDR5 x32\n4x PCIe x1\ni226\nLAN\nPCIe 2.5 GbE\ni226\nLAN\nPCIe 2.5 GbE\nTPM\nData Security\nHDA + I2S\nAudio\n14x GPIO\n4x I2C\n1x eSPI\n4x UART\n1x HDA\n1x SMBus\nSMARC\nmodule\nRevision\n2.1\nADLINK | Leading Edge AI\nComputing\nConfidential\n38](.q1-26-smarc-q7-osm-3-2026-01-28/slide-038.jpg)

## Slide 39

![**Header:**\nSpecifications\nLEC-EL\nProduction\n\n**Left Column Text:**\nProcessor: Intel® ATOM™ x6000E Series (Elkhart Lake)\n• Atom™ X6425E 4C 1.8/3.0GHz 12W\n• Atom™ X6413E 4C 1.5/3.0GHz 9W\n• Atom™ X6211E 2C 1.2/3.0GHz 6W\n• Atom™ X6200FE 2C 1.0 Ghz 4W (headless FUSA SKU)\nMemory\n• Dual channel, soldered 4GB, 8GB or 16GB non-ECC/IBECC LPDDR4 at 3200MHz\nGraphic and Video\n• Gen 11 Media – HEVC VP9, OpenGL ES 3.1/3.0/2.0/1.1, OpenCL™, 1.2, Microsoft* DirectX 12\n• 4Kp30 (10b, 444), 4Kp60 (10b/8b 420) - Decode , 4Kp60(10b/8b 420) – Encode\n• DP 1.4: 8kx4k@60, HDMI 2.0a/DP 1.4: 4kx2k@60, MIPI DSI 1.2 or eDP 1.4\nStorage\n• 1x SDIO to carrier, Onboard from 16GB up to 128GB eMMC 5.0 (build option)\n• 1x SATA GEN3 at 6Gb/s\nAudio\n• 1x HDA for audio codec on carrier\nPCI Express\n• 4x PCIex1 Gen3\nPeripherals\n• Ethernet controller , 2x 2.5 GbE both supporting TSN\n• 2x USB 3.1/2.0, 3x USB2.0 , 1x USB2.0 OTG\n• 14x GPIO, 1x eSPI 2CS, Smbus/I²C, 4x UART, 2x CAN + FD\nOperation Temperature\n• Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\nPower\n• 4.75 V ~ 5.25 V\n\n**Right Column / Logos:**\nStandard Supported\nWindows 10\nyocto PROJECT\nFOUNTRIES.IO\nProject Based\nVxWorks\nintel\nSMARC module Revision 2.1\n\n**Bottom Logos (Left to Right):**\nintel ATOM\nUltra HD 4K\nHDMI HIGH DEFINITION MULTIMEDIA INTERFACE\nDisplayPort\nPCI EXPRESS\nSERIAL ATA\nEthernet (two icons)\nLVD S\nSD\neMM C\nSUPERFAST USB\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n39](.q1-26-smarc-q7-osm-3-2026-01-28/slide-039.jpg)

## Slide 40

![**Function Diagram**\n**LEC-EL**\n\n**Production**\n\n**Left Side Connections:**\nDP 1.4\n4K\nHDMI\n2.0a or\nDP 1.4\n4K\nMIPI 4 lanes\nor eDP 1.4\nUSB 2.0 with\nOTG\n2x USB 3.1/2.0\n3x USB 2.0\n1x SATA at\n6Gb/s\neMMC 8 to 64GB\neMMC\n5.0\nSDIO\nto carrier\n\n**Center Chip:**\nintel\nIntel Atom® x6000E Series\n\n**Right Side Connections:**\nMax. 8GB LPDDR4\nx32\nMax. 8GB LPDDR4\nx32\n4x PCIe x1\nPHY\nLAN\nIntegrated 2.5\nGbE\nIntegrated 2.5\nGbE\nHDA + I2S\nAudio\n14x GPIO\n4x I2C\n1x eSPI\n4x UART\n1x HDA\n1x SMBus\n\n**Bottom Center Modules:**\nSEMA\nEC\nBIOS\nTPM\nData Security\n(optiona\nl)\n\n**Bottom Right Logo:**\nSMARC\nmodule\nRevision\n2.1\n\n**Footer:**\nADLINK | Leading Edge AI\nComputing\nConfidential\n40](.q1-26-smarc-q7-osm-3-2026-01-28/slide-040.jpg)

## Slide 41

![**Header:**\nNOT RECOMMENDED FOR NEW\nProduction\n\n**Title:**\nSpecifications\nLEC-AL\n\n**Specifications List:**\n*   **Processor:** Intel® ATOM™ E3900 Series (Apollo Lake)\n    *   Atom™ E3950 1.6(2.0)GHz, 400-650MHz(graphics), 12W (4C/1866)\n    *   Atom™ E3940 1.6(1.8)GHz, 400-600MHz(graphics), 9W (4C/1866)\n    *   Atom™ E3930 1.3(1.8)GHz, 400-550MHz(graphics), 6W (2C/1866)\n*   **Memory**\n    *   Dual channel, soldered 2GB, 4GB or 8GB non-ECC DDR3L\n*   **Graphic and Video**\n    *   Gen9 Low Power 4K Codec h.264/265 decode, H.264 encode\n    *   HDMI 1.4b/DP 1.2a, DP1.2a, dual channel LVDS (18/24bit) or eDP1.4\n*   **Storage**\n    *   1x SDIO to carrier, Onboard from 8GB up to 64 GB eMMC 5.0 (build option)\n    *   1x SATA GEN3 at 6Gb/s\n*   **Audio and Camera**\n    *   1x I²S and 1x HDA for audio codec on carrier\n    *   2x MIPI CSI camera (2L/4L)\n*   **PCI Express**\n    *   4x PCIex1 Gen3\n*   **Peripherals**\n    *   Ethernet controller , i210 GbE with IEEE 1588\n    *   2x USB 3.0, 2x USB2.0 , 1x USB2.0 OTG\n    *   12x GPIO, 2x SPI, 3x I²C, 4x UART, 1x CAN + FD (SPI to CAN controller)\n*   **Operation Temperature**\n    *   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n*   **Power :**\n    *   Wide 3.0 V ~ 5.25 V\n\n**Right Column & Logos Text:**\n*   intel\n*   Standard Supported Windows 10\n*   yocto PROJECT\n*   Ubuntu\n*   Project Based VxWorks\n*   SMARC module Revision 2.0\n*   intel ATOM\n*   Ultra HD 4K\n*   HDMI\n*   DisplayPort\n*   PCI EXPRESS\n*   SERIAL ATA\n*   Ethernet\n*   2x MIPI CSI\n*   LVD S\n*   SD\n*   eMM C\n*   SUPER SPEED USB\n*   EXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n41](.q1-26-smarc-q7-osm-3-2026-01-28/slide-041.jpg)

## Slide 42

![The slide is a function diagram titled "LEC-AL" under the header "Function Diagram."\n\n**Top Header:** "NOT RECOMMENDED FOR NEW"\n**Top Right Button:** "Production"\n\n**Central Component:**\nAn Intel chip labeled "intel ATOM E3900".\n\n**Left Side Connections:**\n*   "DP 1.2" connected to a "4K" monitor icon.\n*   "HDMI 1.4b or DP 1.2" connected to a "4K" monitor icon.\n*   "eDP 1.4" (greyed out box).\n*   "LVDS 18/24-bit single / dual".\n*   "USB 2.0 with OTG".\n*   "2x USB 3.0/2.0".\n*   "3x USB 2.0 1x SATA at 6Gb/s".\n*   "eMMC 8 to 64GB".\n*   "SDIO to carrier".\n*   Small box: "eDP to LVDS".\n*   Small box: "eMMC 5.0".\n\n**Right Side Connections:**\n*   Four memory chips labeled: "Max. 4GB DDR3L x16" and "Max. 4GB DDR3L x16".\n*   Four PCIe slots labeled: "4x PCIe x1".\n*   Small box: "i211/i210 LAN" connected to a network card icon labeled "Integrated GbE".\n*   Small box: "HDA + I2S Audio" connected to a speaker icon.\n\n**Bottom Connections:**\n*   Small box: "SEMA BMC".\n*   Orange box: "Dual BIOS".\n*   Two camera lenses labeled: "2x MIPI CSI (4L / 2L)".\n*   List of interfaces: "12x GPIO", "3x I2C", "2x SPI", "4x UART", "1x HDA", "1x SMBus".\n\n**Bottom Right:**\nLogo: "SMARC module Revision 2.0".\n\n**Footer:**\n*   Left: "ADLINK | Leading Edge AI Computing"\n*   Center: "Confidential"\n*   Right: "42"](.q1-26-smarc-q7-osm-3-2026-01-28/slide-042.jpg)

## Slide 43

![**Top Header:**\nNOT RECOMMENDED FOR NEW\nProduction\n\n**Title:**\nSpecifications\nLEC-BTS\n\n**Left Column Text:**\n**Processor:** Intel® ATOM™ E3800 Series (Bay Trail)\n• Atom™ E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP\n• Atom™ E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP\n• Atom™ E3815 (1C/1066), 1.46 GHz, Gfx 400/-MHz, 5 W TD\n\n**Memory**\n• 2 or 4 GB DDR3L at 1066/1333 MHz, memory down non-ECC\n\n**Graphic and Video**\n• Intel® HD Graphics support DirectX11 | OpenGL 3.0 | OpenCL 1.2 | OpenGLES 2.0 | full HW acceleration for decode/encode of MPEG2, H.264 | MVC\n• Displayport 1.1 up to 2560x1600 or HDMI 1.4a up to 1920x1200\n• Dual channel LVDS at max resolution of 1920x1200@60Hz or eDP (build option)\n\n**Storage**\n• 1x SDIO to carrier, Onboard from 8GB up to 64 GB eMMC 5.0 (build option)\n• 1x SATA GEN3 at 6Gb/s\n\n**Audio and Camera**\n• 1x I²S and 1x HDA for audio codec on carrier\n• 1x MIPI CSI camera (4L)\n\n**PCI Express**\n• 3x PCIex1 Gen3\n\n**Peripherals**\n• Ethernet controller , i210 GbE with IEEE 1588\n• 1x USB 3.0, 3x USB2.0 , 1x USB2.0 OTG\n• 12x GPIO, 2x SPI, 3x I²C, 4x UART, 1x CAN + FD (SPI to CAN controller)\n\n**Operation Temperature**\n• Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power :**\n• Wide 3.0 V ~ 5.25 V\n\n**Right Column Text/Logos:**\nStandard Supported\nWindows 10\nWindows 7\nyocto PROJECT\nVxWorks\nintel\n\nSMARC module Revision 1.1\n\nintel ATOM\nFull HD 1080p\nHDMI HIGH DEFINITION MULTIMEDIA INTERFACE\nDisplayPort\nPCI EXPRESS\nSERIAL ATA\nEthernet\nMIPI CSI\nLVD S\nSD\neMMC\nSUPER SPEED USB\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n43](.q1-26-smarc-q7-osm-3-2026-01-28/slide-043.jpg)

## Slide 44

![The slide displays a "Function Diagram" for "LEC-BTS" with a banner at the top stating "NOT RECOMMENDED FOR NEW" and a "Production" badge in the top right.\n\n**Central Component:**\nThe central image is a processor chip labeled:\n*   "intel"\n*   "Atom™ Processor Bay Trail"\n*   "INTEL" (small text under the chip)\n\n**Left Side Connections:**\n*   "HDMI 1.4a or DP 1.1"\n*   "LVDS 18/24-bit single / dual"\n*   "eDP to LVDS"\n*   "USB 2.0 with OTG"\n*   "1x USB 3.0/2.0"\n*   "3x USB 2.0"\n*   "2x SATA at 6Gb/s"\n\n**Bottom/Center Connections:**\n*   "SDIO to carrier"\n*   "SEMA BMC"\n*   "Dual BIOS"\n*   "1x MIPI CSI (4L)"\n\n**Right Side Connections:**\n*   "Max. 4GB DDR3L x16" (listed twice for different memory modules)\n*   "3x PCIe x1"\n*   "i210 LAN"\n*   "Integrated GbE"\n*   "HDA + I2S Audio"\n*   "12x GPIO"\n*   "3x I2C"\n*   "2x SPI"\n*   "4x UART"\n*   "1x HDA"\n*   "1x SMBus"\n\n**Footer & Logos:**\n*   Bottom Right: "SMARC module Revision 1.0"\n*   Bottom Left: "ADLINK | Leading Edge AI Computing"\n*   Bottom Center: "Confidential"\n*   Bottom Right Corner: "44"](.q1-26-smarc-q7-osm-3-2026-01-28/slide-044.jpg)

## Slide 45

![**Specifications**\n**Q7-EL**\n\n**Processor:** Intel® ATOM™ x6000E Series (Elkhart Lake)\n*   Atom™ X6425E 4C 1.8/3.0GHz 12W\n*   Atom™ X6413E 4C 1.5/3.0GHz 9W\n*   Atom™ X6211E 2C 1.2/3.0GHz 6W\n*   Atom™ X6200FE 2C 1.0 Ghz 4W (headless FUSA SKU)\n\n**Memory**\n*   Dual channel, soldered 4GB, 8GB or 16GB non-ECC/IBECC LPDDR4 at 3200MHz\n\n**Graphic and Video**\n*   Gen 11 Media – HEVC VP9, OpenGL ES 3.1/3.0/2.0/1.1, OpenCL™, 1.2, Microsoft* DirectX 12\n*   4Kp30 (10b, 444), 4Kp60 (10b/8b 420) - Decode , 4Kp60(10b/8b 420) – Encode\n*   DP 1.4: 8kx4k@60, HDMI 2.0a/ eDP 1.4, DP, Dual channel LVDS\n\n**Storage**\n*   1x SDIO to carrier, Onboard from 16GB up to 128GB eMMC 5.0 (build option)\n*   2x SATA GEN3 at 6Gb/s\n\n**Audio**\n*   1x HDA for audio codec on carrier\n\n**PCI Express**\n*   4x PCIex1 Gen3\n\n**Peripherals**\n*   Ethernet controller , 2x 2.5 GbE both supporting TSN\n*   2x USB 3.1/2.0, 5x USB2.0 , 1x USB2.0 OTG\n*   8x GPIO, 1x GSPI/FSPI, 1x LPC, 1x SMBus, 1xI2C, 1x UART, 1x CAN + FD\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V\n\n**Right Side Content:**\n*   Production\n*   intel\n*   Standard\n*   Windows 10\n*   yocto PROJECT\n*   FOUNDRIES.IO\n*   Project Based\n*   VxWorks\n*   QSEVEN\n*   Rev 2.1\n*   intel ATOM\n*   Ultra HD 4K\n*   HDMI HIGH DEFINITION MULTIMEDIA INTERFACE\n*   DisplayPort\n*   PCI EXPRESS\n*   SERIAL ATA\n*   LVDS\n*   SD\n*   eMMC\n*   SUPER SPEED USB\n*   EXTREME RUGGED\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   45](.q1-26-smarc-q7-osm-3-2026-01-28/slide-045.jpg)

## Slide 46

![**Function Diagram Q7-EL**\n\n**Central Component:**\n*   An Intel processor chip labeled "**intel**" and "**Intel Atom® x6000E Series**"\n\n**Left-Side Peripherals (Connected to Central Chip):**\n*   **DP 1.4/HDMI** connected to a monitor labeled "**4K**"\n*   **eDP / LVDSA** and **DP / LVDSB** connected to a monitor labeled "**4K**" and a generic display icon\n*   **USB 2.0 with OTG** connected to USB ports\n*   **2x USB 3.1/2.0** and **5x USB 2.0** connected to USB ports\n*   **2x SATA at 6Gb/s** connected to storage drives\n*   **eMMC 8 to 64GB** connected to an SD card\n*   **eMMC 5.0** (inside a grey box)\n*   **SDIO to carrier** connected to an SD card\n\n**Bottom-Center Components:**\n*   Orange boxes labeled "**SEMA EC**" and "**BIOS**"\n\n**Right-Side Peripherals (Connected to Central Chip):**\n*   Memory chips labeled "**Max. 8GB LPDDR4 x32**" (listed twice)\n*   **4x PCIe x1** connected to PCIe slots\n*   **PHY LAN** connected to "**Integrated 2.5 GbE**"\n*   **HDA + I2S Audio** icon\n*   List of interfaces:\n    *   **8x GPIO**\n    *   **1x I2C**\n    *   **1x FSPI/GSPI**\n    *   **1x UART**\n    *   **1x HDA**\n    *   **1x SMBus**\n    *   **1x LPC**\n\n**Footer & Overlays:**\n*   Top Right: "**Production**" (in a blue box)\n*   Bottom Left: "**ADLINK | Leading Edge AI Computing**"\n*   Bottom Center: "**Confidential**"\n*   Bottom Right: "**Q S E V E N**" logo, "**Rev 2.1**", and page number "**46**"](.q1-26-smarc-q7-osm-3-2026-01-28/slide-046.jpg)

## Slide 47

![**Header:**\nNOT RECOMMENDED FOR NEW\nProduction\n\n**Specifications Q7-AL**\n\n**Processor:** Intel® ATOM™ E3900 Series (Apollo Lake)\n*   Atom™ E3950 1.6(2.0)GHz, 400-650MHz(graphics), 12W (4C/1866)\n*   Atom™ E3940 1.6(1.8)GHz, 400-600MHz(graphics), 9W (4C/1866)\n*   Atom™ E3930 1.3(1.8)GHz, 400-550MHz(graphics), 6W (2C/1866)\n\n**Memory**\n*   Dual channel, soldered 2GB, 4GB or 8GB LPDDR4\n\n**Graphic and Video**\n*   Gen9 Low Power 4K Codec h.264/265 decode, H.264 encode\n*   HDMI 1.4b/DP 1.2a, DP1.2a, dual channel LVDS (18/24bit) or eDP1.4\n\n**Storage**\n*   1x SDIO to carrier, Onboard from 16GB up to 128GB eMMC 5.0 (build option)\n*   2x SATA GEN3 at 6Gb/s\n\n**Audio and Camera**\n*   1x I²S and 1x HDA for audio codec on carrier\n*   1x MIPI CSI camera 2L/4L on feature connector\n\n**PCI Express**\n*   4x PCIex1 Gen3\n\n**Peripherals**\n*   Ethernet controller , i210 GbE with IEEE 1588\n*   2x USB 3.0, 5x USB2.0 , 1x USB2.0 OTG\n*   8x GPIO, 1x SPI, 1x I²C, 1x UART, 1x LPC, 1x SMBus\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power :**\n*   5V DC +/- 5%\n\n**Supported OS / Logos (Middle Column):**\nStandard Supported\nWindows 10\nyocto PROJECT\nUbuntu\nProject Based\nVxWorks\n\n**Logos (Right Side/Bottom):**\nintel\nQ S E V E N\nRev 2.1\nintel ATOM\nUltra HD 4K\nHDMI DisplayPort\nPCI EXPRESS\nSERIAL ATA\nEthernet\n1x MIPI CSI\nLVDS\nSD\neMMC\nSUPERspeed USB\nEXTREME RUGGED\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n47](.q1-26-smarc-q7-osm-3-2026-01-28/slide-047.jpg)

## Slide 48

![NOT RECOMMENDED FOR NEW\nProduction\nFunction Diagram\nQ7-AL\n\nHDMI\n1.4b or\nDP 1.2\n4K\n\neDP 1.4 build option\n\nLVDS 18/24-\nbit\nsingle / dual\neDP to\nLVDS\n\nUSB 2.0 with\nOTG\n\n2x USB 3.0/2.0\n\n5x USB 2.0\n\n2x SATA at\n6Gb/s\n\neMMC\n16 to\n128GB\neMMC\n5.0\n\nSDIO\nto carrier\n\nintel\nATOM™\nE3900\n\nMax. 8GB LPDDR4\n\n4x PCIe x1\n\ni211/\ni210\nLAN\n\nHDA + I2S\nAudio\n\n8x GPIO\n1x I2C\n1x SPI\n1x UART\n1x HDA / I1S\n1x SMBus\n1x LPC\n\n1x MIPI\nCSI (4L /\n2L)\n\nSEMA\nBMC\nBIOS\n\nADLINK | Leading Edge AI\nComputing\nConfidential\nQ S E V E N\nRev 2.1\n48](.q1-26-smarc-q7-osm-3-2026-01-28/slide-048.jpg)

## Slide 49

![**NOT RECOMMENDED FOR NEW**\n**Production**\n\n**Specifications**\n**Q7-BT**\n\n**Processor:** Intel® ATOM™\n*   Single, dual or quad-core Intel® Atom™ Processor E3800 Series SoC\n\n**Memory**\n*   Up to 4 GB soldered DDR3L\n\n**Graphic and Video**\n*   Intel® HD Graphics support DirectX11 | OpenGL 3.0 | OpenCL 1.2 | OpenGLES 2.0 | full HW acceleration for decode/encode of MPEG2, H.264 | MVC\n*   Displayport 1.1 up to 2560x1600 or HDMI 1.4a up to 1920x1200\n*   Dual channel LVDS, max resolution of 1920x1200@60Hz\n\n**Storage**\n*   1x SDIO to carrier, Onboard from 32GB up to 128GB eMMC 5.0 (build option), 2x SATA\n\n**Audio and Camera**\n*   HDA audio codec on carrier,\n\n**Peripherals**\n*   Single Intel GbE Ethernet controller\n*   3x PCIe x1, Gen2\n*   5x USB 2.0, 1x USB2.0 client, 2x I²C, 1x SPI\n*   1x UART 4 wire, LPC bus,\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Dimensions**\n*   Qseven 70 x 70 mm\n\n**Standard Supported**\n*   Windows 10\n*   Windows 7\n*   yocto PROJECT\n*   VxWorks\n\nintel.\n\nQ S E V E N\nRev 2.1\n\nintel ATOM\nFull HD 1080p\nHDMI HIGH DEFINITION MULTIMEDIA INTERFACE\nDisplayPort\nPCI EXPRESS\nSERIAL ATA\n\nEthernet\nMIPI CSI\nLVD S\nSD\neMMC\nSUPER SPEED USB 2.0\nEXTREME RUGGED\n\nADLINK | Leading Edge AI Computing\nConfidential\n49](.q1-26-smarc-q7-osm-3-2026-01-28/slide-049.jpg)

## Slide 50

![**Header:**\nNOT RECOMMENDED FOR NEW\nProduction\n\n**Title:**\nFunction Diagram\nQ7-BT\n\n**Central Processor:**\nintel Atom™ Processor Bay Trail\nINTEL (small label on chip edge)\n\n**Left Side Connections:**\nHDMI 1.4a or DP 1.1\nLVDS 18/24-bit single / dual\neDP to LVDS\nUSB 2.0 with OTG\n1x USB 3.0/2.0\n5x USB 2.0\n2x SATA at 6Gb/s\nSDIO to carrier\n\n**Right Side & Bottom Connections:**\nMax. 4GB DDR3L x16\nMax. 4GB DDR3L x16\n3x PCIe x1\ni210 LAN\nIntegrated GbE\nHDA + I2S Audio\n2x I2C\n1x SPI\n1x UART\n1x HDA\n1x SMBus\n1x LPCBus\n1x MIPI CSI (4L)\nSEMA BMC\nBIOS\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\nQ S E V E N\nRev 2.1\n50](.q1-26-smarc-q7-osm-3-2026-01-28/slide-050.jpg)

## Slide 51

![**Title:** Product Lifecycle\n\n**Legend:**\n*   **Promotion** (Blue square)\n*   **Maintenance** (Grey square)\n*   **Last time buy** (Yellow square)\n*   **Last shipment** (Red square)\n\n**Y-Axis Labels:**\n*   Q7-EL\n*   Q7-AL\n*   Q7-BT\n\n**X-Axis Labels (Years):**\n2015, 2016, 2017, 2018, 2019, 2020, 2021, 2022, 2023, 2024, 2025, 2026, 2027, 2028, 2029, 2030, 2031, 2032, 2033, 2034, 2035, 2036, 2037\n\n**Chart Data:**\n*   **Q7-EL:** Promotion (2021–2025), Maintenance (2025–2031), Last time buy (2031–2032), Last shipment (2032–2033).\n*   **Q7-AL:** Promotion (2017–2020), Maintenance (2020–2031), Last time buy (2031–2032), Last shipment (2032).\n*   **Q7-BT:** Promotion (2015–2017), Maintenance (2017–2028), Last time buy (2028–2029), Last shipment (2029–2030).\n\n**Additional Text:**\n*   **Logo:** Q SEVEN\n*   **Footer:** ADLINK | Leading Edge AI\n    Computing\n    Confidential\n    51](.q1-26-smarc-q7-osm-3-2026-01-28/slide-051.jpg)

## Slide 52

![Specifications\nOSM-iMX93\n\nProcessor: NXP® i.MX93\n• 2x 1.7GHz Arm Cortex-A55 + 250MHz Arm Cortex-M33\n• Optional Arm Ethos U-65 NPU(incorporated on SoC)\nMemory\n• Up to 2 GB soldered LPDDR4 x32\nGraphic and Video\n• Pixel processing pipeline (PXP) engine to support 2D image processing\n• single/dual channel LVDS 1366x768 or MIPI-DSI (4-lane) at 1920x1080\nStorage\n• 2x SDIO to carrier, Onboard from 32GB up to 128GB eMMC 5.0 (build option)\nAudio and Camera\n• I²S audio codec on carrier, 1x MIPI CSI cameras (2 lanes)\nPeripherals\n• Dual GbE Ethernet controller (one with TSN)\n• 4x USB 2.0, 1x USB2.0 OTG, 12x GPIO, 2x SPI, 2x I²C,\n• 4x UART, 2x CAN + FD (native)\n• ADC 4 channel, 12-bit\nOperation Temperature\n• Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\nPower\n• 4.75 V ~ 5.25 V input\nDimensions\n• OSM size L 45 x 45 mm\n\nProduction\nStandard\nSupported\nFOUNDRIES.IO\nyocto\nPROJECT\nNXP\narm\nOPEN\nSTANDARD\nMODULE™\nRevision 1.1\nNXP\ni.MX 93\nLVDS\nS\neMMC\nC\nSUPERspeed\nUSB\nEXTREME\nRUGGED\nEthernet\nEthernet\nMIPI CSI /\nDSI\nSD\nCAN\nFD\n\nADLINK | Leading Edge AI\nComputing\nConfidential\n52](.q1-26-smarc-q7-osm-3-2026-01-28/slide-052.jpg)

## Slide 53

![This slide presents a "Function Diagram" for the "OSM-iMX93".\n\n**Central Component:**\nThe center features a large black chip labeled "NXP" and "i.MX93".\n\n**Peripheral Connections:**\nLines radiate from the central chip to various components and interfaces:\n\n*   **Displays (Left):**\n    *   "MIPI DSI" connects to an icon labeled "Full HD".\n    *   "LVDS single channel" connects to a smaller screen icon.\n*   **USB (Left):**\n    *   "USB 2.0 with OTG" connects to a USB port icon. A label near the chip reads "USB2." and "0".\n    *   "3x USB 2.0" connects to three USB icons, which feed into a grey box labeled "USB 2.0 HUB". This hub connects to the chip via a line labeled "USB 2.0".\n*   **Storage (Bottom Left):**\n    *   "eMMC 5.0 (build option) (8/16/32/64 GB)" connects to a chip labeled "eMMC 5.0".\n    *   "2x SDIO 3.0" connects to SD card icons.\n*   **Power (Bottom Center):**\n    *   An orange box labeled "PMIC" connects to the chip.\n*   **Camera (Bottom Center):**\n    *   "1x MIPI CSI (2L)" connects to a camera lens icon.\n*   **Memory & Network (Right):**\n    *   "1 or 2 GB LPDDR4" connects to a memory chip icon.\n    *   "Integrated GbE with IEEE-1588" connects to a black box labeled "PHY".\n    *   "Integrated GbE" connects to another black box labeled "PHY".\n*   **I/O and Audio (Right/Bottom Right):**\n    *   "12x GPIO 4x I2C 2x SPI 4x UART CAN +FD".\n    *   "I2S Audio" connects to a speaker icon.\n\n**Footer and Branding:**\n*   Top right: A blue button labeled "Production".\n*   Bottom right: A logo for "OPEN STANDARD MODULE ™" with text "Revision 1.1".\n*   Bottom left: "ADLINK | Leading Edge AI Computing".\n*   Bottom center: "Confidential".](.q1-26-smarc-q7-osm-3-2026-01-28/slide-053.jpg)

## Slide 54

![**Header:**\nSpecifications\nOSM-iMX95\nDeveloping\nSamples available\nMP target April 2025\n\n**Specifications List:**\nProcessor: NXP® i.MX95\n• Up to 6x 2.0GHz Arm Cortex-A55\n+ 800MHz Arm Cortex-M7 + 250MHz Arm Cortex-M33\n• OPTIONAL NPU (incorporated on SoC)\nMemory\n• Up to 16 GB soldered LPDDR4 x32\nGraphic and Video\n• Mali G310 GPU 4Kp30\n• H.265 and H.264 encode and decode\n• HDMI 2.0 / single/dual channel LVDS or MIPI-DSI (4-lane) at 1920x1080\nStorage\n• 1x SDIO to carrier, Onboard from 32GB up to 128GB eMMC 5.0 (build option)\nAudio and Camera\n• I²S audio codec on carrier, 1x MIPI CSI cameras (4 lanes)\nPCI Express\n• 1x PCIex1 Gen3\nPeripherals\n• Dual GbE Ethernet controller (one with TSN), Optional WIFI/BT\n• 1x USB 3.0, 1x USB2.0 DRD, 16x GPIO, 3x SPI, 2x I²C,\n• 4x UART, 2x CAN + FD (native)\nOperation Temperature\n• Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\nPower\n• 4.75 V ~ 5.25 V input\n\n**Right Side Graphics & OS:**\nStandard\nSupported\nyocto . PROJECT\nBy project\nandroid\nNXP\nOPEN STANDARD MODULE™ Revision 1.2\n\n**Bottom Logos:**\nNXP i.MX 95\nUltra HD 4K\nHDMI\nPCI EXPRESS\nCAN FD\nEthernet (Icons)\nCamera (Icon)\nScreen (Icon)\nLVD S\nSD (Icon)\neMM C (Icon)\nUSB\nEXTREME RUGGED\nMIPI CSI / DSI\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n54](.q1-26-smarc-q7-osm-3-2026-01-28/slide-054.jpg)

## Slide 55

![**Header & Status**\n*   Function Diagram\n*   OSM-iMX95\n*   Developing\n*   Samples available\n*   MP target April 2026\n\n**Central Chip**\n*   NXP\n*   i.MX95\n\n**Left Side (Display & Connectivity)**\n*   4K\n*   HDMI 2.0a\n*   MIPI DSI\n*   LVDS 18/24-bit\n*   single / dual\n*   USB 2.0 with OTG\n*   USB 3.0/2.0\n*   DSI to HDMI\n\n**Bottom Left (Storage & Power)**\n*   USB2.0\n*   USB 3.0/2.0\n*   eMMC 5.0 (build option) (8/16/32/64 GB)\n*   SDIO 3.0\n*   eMMC 5.0\n*   PMIC\n\n**Bottom Right (I/O Peripherals)**\n*   1x MIPI CSI (4L / 2L)\n*   16x GPIO\n*   2x I2C\n*   3x SPI\n*   4x UART\n*   CAN +FD\n*   I2S Audio\n\n**Right Side (Memory & Network)**\n*   LPDDR4 up to 16GB\n*   1x Gen 3 PCIe x1\n*   LAN\n*   Integrated GbE with IEEE-1588\n*   LAN\n*   Integrated GbE with IEEE-1588\n\n**Footer & Certification**\n*   OPEN STANDARD MODULE TM Revision 1.2\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   55](.q1-26-smarc-q7-osm-3-2026-01-28/slide-055.jpg)

## Slide 56

![**Header:**\nNOT RECOMMENDED FOR NEW\nProduction\n\n**Title:**\nSpecifications\nOSM-iMX8M Plus\n\n**Main Body Text:**\nProcessor: NXP® i.MX8M Plus\n• Single skew 64-bit Quad/Dual Core Cortex A53 1.8Ghz + M7 800Mhz\n• Optional 2.3 TOPS NPU (incorporated on SoC)\nMemory\n• Up to 8 GB soldered LPDDR4 x32\nGraphic and Video\n• GC7000 UL 3D GPU, GC520 2D GPU,1080p60 h.265/4 and VP9/8 decode, and 1080p60 h.265/4 encode\n• HDMI 2.0 / single/dual channel LVDS or MIPI-DSI (4-lane) at 1920x1080\nStorage\n• 2x SDIO to carrier, Onboard from 32GB up to 128 GB eMMC 5.0 (build option)\nAudio and Camera\n• I²S audio codec on carrier, 2x MIPI CSI cameras (4 lanes)\nPCI Express\n• 1x PCIex1 Gen3\nPeripherals\n• Dual GbE Ethernet controller (one with TSN)\n• 2x USB 3.0, 4x USB 2.0, 1x USB2.0 OTG, 8x GPIO, 2x SPI, 2x I²C,\n• 4x UART, 2x CAN + FD (native)\nOperation Temperature\n• Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\nPower\n• 4.75 V ~ 5.25 V input\nDimensions\n• OSM size L 45 x 45 mm\n\n**Footer:**\nADLINK | Leading Edge AI Computing\nConfidential\n56\n\n**Logos and Graphics Text:**\nNXP\nStandard Supported\nFOUNDS.IO\nyocto PROJECT\nandroid\narm\nOPEN STANDARD MODULE™ Revision 1.1\nNXP i.MX 8M MINI\nFull HD 1080p HDMI\nPCI EXPRESS\nCAN FD\nEthernet\nMIPI CSI / DSI\nLVD S\nSD\neMM C\nSUPERSpeed USB\nEXTREME RUGGED](.q1-26-smarc-q7-osm-3-2026-01-28/slide-056.jpg)

## Slide 57

![**Header & Title**\nNOT RECOMMENDED FOR NEW\nProduction\nFunction Diagram\nOSM-iMX8M Plus\n\n**Central Component**\nNXP\ni.MX8MP\n\n**Left-Side Connections**\nHDMI 1.4\nFull HD\nMIPI DSI 4 lane\nLVDS 18/24-bit\nsingle / dual\nUSB 2.0 x4\nUSB 2.0\nUSB 3.0 x1\nOTG 2.0 x1\nUSB3.0\neMMC 5.0\n(build option)\n32/64/128\nGB)\neMMC 5.0\nSDIO 3.0 x2\n\n**Right-Side & Peripheral Components**\nTPM\n1GB, 2GB, 4 or 8GB soldered LPDDR4\n1x PCIe Gen 3\nx1\nIntegrated GbE with\nTSN\nPHY\nIntegrated GbE\nPHY\nI2S Audio\n8x GPIO\n2x I2C\n2x SPI\n4x UART\n2x CAN\nPMIC\nMIPI CSI\n(4L)\n\n**Footer & Logos**\nOPEN STANDARD MODULE™\nRevision 1.1\nADLINK | Leading Edge AI\nComputing\nConfidential\n57](.q1-26-smarc-q7-osm-3-2026-01-28/slide-057.jpg)

## Slide 58

![**Header:**\n*   **Specifications** (Red text)\n*   **OSM-MTK510/710**\n*   **Production** (Blue button)\n\n**Left Column (Technical Specifications):**\n*   **Processor:** MediaTek Genio 510/710\n    *   2x Arm® Cortex® A78, 2.0~2.2GHz + 4x Arm® Cortex® A55, 1.8~2.0GHz (510)\n    *   2x Arm® Cortex® A78, 2.4~2.6GHz + 4x Arm® Cortex® A55, 2.0GHz (710)\n    *   2.8 TOPS NPU (incorporated on SoC)\n*   **Memory**\n    *   Up to 8 GB soldered LPDDR4 x32\n*   **Graphic and Video**\n    *   Mali G57 MC2 supporting OpenGL/OpenCL/Vulkan\n    *   HDMI 2.0b / DP 1.4, eDP 1.4 and MIPI-DSI (4-lane)\n*   **Storage**\n    *   2x SDIO to carrier, Onboard from 32GB up to 128 GB eMMC 5.0 (build option)\n*   **Audio and Camera**\n    *   I²S audio codec on carrier, 1x MIPI CSI cameras (4 lanes)\n*   **PCI Express**\n    *   1x PCIex1 Gen2\n*   **Peripherals**\n    *   SGMii gigabit ethernet (phy on carrier)\n    *   2x USB 3.2 (one shared with DP/HDMI), 1x USB 2.0 17x GPIO, 3x SPI, 2x I²C, 4x UART\n*   **Operation Temperature**\n    *   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n*   **Power**\n    *   4.75 V ~ 5.25 V input\n*   **Dimensions**\n    *   OSM size L 45 x 45 mm\n\n**Right Column (Logos and Visuals):**\n*   **Standard Supported**\n    *   yocto PROJECT\n*   **Project based**\n    *   android\n    *   FOUNDRIES.IO\n*   **Images/Logos:**\n    *   [Image of OSM module]\n    *   [MediaTek Logo]\n    *   arm\n    *   OPEN STANDARD MODULE™ Revision 1.1 Revision 1.2\n    *   [MediaTek Genio 510 Chip Image]\n    *   PCI EXPRESS\n    *   CAN FD\n    *   SUPER SPEED USB\n    *   EXTREME RUGGED\n    *   [Ethernet Icon] [Ethernet Icon]\n    *   MIPI CSI / DSI\n    *   LVD S\n    *   SD\n    *   eMMC\n\n**Footer:**\n*   ADLINK | Leading Edge AI Computing\n*   Confidential\n*   58](.Q1-26_SMARC_Q7_OSM-3-[2026-01-28]/slide_058.jpg)

## Slide 59

![**Function Diagram**\n**OSM-MTK510/710**\n**Production**\n\n**Center Chip:**\n**MEDIATEK**\n**MediaTek**\n**Genio 510**\n\n**Left Connections:**\n**DP 1.4 or**\n**HDMI 2.0b**\n**USB**\n**3.2**\n**USB 3.2 x1**\n**USB 2.0 x1**\n**eDP 4 lanes**\n**MIPI DSI 4 lane**\n\n**Right Connections:**\n**2, 4 or 8GB soldered**\n**LPDDR4**\n**1x PCIe Gen2**\n**x1**\n**Integrated Gigabit**\n**RGMii**\n\n**Bottom Connections:**\n**eMMC 5.0**\n**(build option)**\n**32/64/128**\n**GB)**\n**SDIO 3.0 x2**\n**PMIC**\n**MIPI CSI**\n**(4L)**\n**17x GPIO**\n**2x I2C**\n**3x SPI**\n**4x UART**\n**I2S**\n**Audio**\n\n**Bottom Right:**\n**OPEN**\n**STANDARD**\n**MODULE™**\n**Revision 1.1**\n\n**Footer:**\n**ADLINK | Leading Edge AI**\n**Computing**\n**Confidential**\n**59**](.q1-26-smarc-q7-osm-3-2026-01-28/slide-059.jpg)

## Slide 60

![**Specifications**\n**OSM-MTK520/720**\n\n**Top Right:**\nDeveloping\nSamples available\nMP target August 2025\n\n**Main Specifications List:**\n**Processor:** MediaTek Genio 520 /720\n*   2x Arm® Cortex® A78, 2.0~2.2GHz + 6x Arm® Cortex® A55, 1.8~2.0GHz (520)\n*   2x Arm® Cortex® A78, 2.4~2.6GHz + 6x Arm® Cortex® A55, 2.0GHz (720)\n*   MediaTek NPU 850\n\n**Memory**\n*   Up to 16 GB soldered LPDDR5 x32\n\n**Graphic and Video**\n*   Mali G57 MC2 supporting OpenGL/OpenCL/Vulkan\n*   DP 1.4, eDP 1.4 and MIPI-DSI (4-lane)\n\n**Storage**\n*   2x SDIO to carrier, Onboard from 32GB up to 512 GB UFS (build option)\n\n**Audio and Camera**\n*   I²S audio codec on carrier, 2x MIPI CSI cameras (4 lanes) 2x 16MP @ 30fps\n\n**PCI Express**\n*   1x PCIex1 Gen2\n\n**Peripherals**\n*   SGMii gigabit ethernet (phy on carrier)\n*   2x USB 3.2 (one shared with DP/HDMI), 1x USB 2.0 17x GPIO, 3x SPI, 2x I²C, 4x UART\n\n**Operation Temperature**\n*   Extreme Rugged -40°C to +85°C or Standard 0°C to 60°C\n\n**Power**\n*   4.75 V ~ 5.25 V input\n\n**Dimensions**\n*   OSM size L 45 x 45 mm\n\n**Right Column Graphics & Logos:**\nStandard Supported\nyocto\nPROJECT\n\nProject based\nandroid\n\nFOUNDRIES.IO\n\narm\n\nOPEN\nSTANDARD\nMODULE™\nRevision 1.2\n\nPCI\nEXPRESS\n\nCAN FD\n\nMIPI CSI /\nDSI\n\n**Footer:**\nADLINK | Leading Edge AI\nComputing\n\nConfidential\n\n60](.q1-26-smarc-q7-osm-3-2026-01-28/slide-060.jpg)

## Slide 61

![This slide is a **Function Diagram** for the **OSM-MTK520/720**.\n\n**Top Right:**\n*   **Developing** (in a green box)\n*   Samples available\n*   MP target April 2025\n\n**Center Component:**\n*   **MEDIATEK** (logo)\n*   **MediaTek**\n*   **Genio 520**\n\n**Connections (Left Side):**\n*   **DP 1.4**\n*   **USB 3.2**\n*   **USB 3.2 x1**\n*   **USB 2.0 x1**\n*   **eDP 4 lanes**\n*   **MIPI DSI 4 lane**\n\n**Connections (Right Side):**\n*   **4, 8 or 16GB soldered LPDDR5**\n*   **1x PCIe Gen2 x1**\n*   **Integrated Gigabit RGMii** (connected to a black box labeled **PHY**)\n\n**Connections (Bottom Side):**\n*   **UFS** (build option) **64 ~ 512GB)** (next to a grey box labeled **UFS**)\n*   **SDIO 3.0 x2**\n*   **PMIC** (in an orange box)\n*   **MIPI CSI (4L)**\n*   **14x GPIO**\n    *   **2x I2C**\n    *   **3x SPI**\n    *   **4x UART**\n*   **I2S Audio**\n\n**Footer:**\n*   **ADLINK | Leading Edge AI Computing**\n*   **Confidential**\n*   **61**](.q1-26-smarc-q7-osm-3-2026-01-28/slide-061.jpg)

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